GOSEMICON-GBS60037TOB

Part #GOSEMICON-GBS60037TOB
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GOSEMICON-GBS60037TOB
GOSEMICON  
GBS60037  
REV P2  
N-channel 600V 29m
Ω
(Typ) Power MOSFET  
1 FEATURES  
2 APPLICATIONS  
•
•
•
•
600V break down voltage  
Ultra-low R

DS-ON

& FOM  
Ultra-fast body diode  
Fast switching on/off  
•
•
•
•
Server power  
Telecom power  
EV charger  
Motor driver  
D(2)  
3 ORDERING
 
INFORMATION  
TYPE  
MARKING  
PACKAGE  
G(1)  
GBS60037TOB  
60037  
TO-247  
TO-247  
S(3)  
4 DISCRIPTION  
The 600V high voltage Super Junction MOSFET achieves ultra-low ON-resistance and gate charge.  
Thanks to excellent balance between switching performance and conduction performance, the  
GBS60037 provides very high efficiency in resonant switch topology.  
The Ultra-fast recovery body dio
d
e makes the GBS60037 suitable for high switching frequency  
application and supports high power density application. The GBS60037 is available in TO-247 package.  
5 KEY PERFORMANCE PARAMETERS  
PARAMETER  
V

DS

@ Tj_max  
R

DS-ON

max @Vgs=10V  
Q

g

(Typ)  
VALUE  
UNIT  
650  
34  
V
mΩ  
nC  
A
136  
235  
18  
I

D-pulse  

Eoss@400V  
µJ  
ns  
Body diode recovery time  
155  
All information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
1

GBS60037  
6 SPECIFICATIONS  
6.1 ABSOLUTE MAXIMUM RATINGS  
T

J

=25°C
operating free-air temperature unless otherwise noted  
SYMBOL PARAMETER  
TEST CONDITION  
VALUE  
UNIT  
V

DS  

I

D  

Drain-source voltage  
600  
58  
V
Tc=25
°C  
A
Continuous drain current  
Tc=100
°C  
36  
A
V
I

D-pulse  

V

GS  

E

AS  

Pulsed drain current  
235  
Gate-source voltage  
±
30  
340  
mJ  
mJ  
A
Single pulsed avalanche energy  
Repetitive avalanche energy  
Single pulsed avalanche current  
Power dissipation  
I

D

=8A, V

DD

=50V  
I

D

=8A, V

DD

=50V  
E

AR  

1.7  
I

AS  

8
W
P

D  

227  
V/ns  
A
dv/dt  
I

S  

MOSFET dv/dt ruggedness  
Continuous diode forward current  
Diode pulsed current  
V

DS

=0~400V  
60  
58  
A
I

S-pulse  

dv/dt  
T

j  

235  
V/ns  
°C  
°C  
Reverse diode dv/dt  
V

DS

=0~400V, I

SD

<25A  
50  
Operating junction temperature  
Storage temperature  
-55 ~ 150  
-55 ~ 150  
T

stg  

6.2 THERMAL INFORMATION  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
R

θJC max.  

R

θJ
A max.  

T

sold  

Max. Thermal resistance, junction – case  
Max. Thermal resistance, junction – ambient  
Soldering temperature  
0.54  
62  
°C/W  
°C/W  
°C  
260  
6.3 ELECTRICAL CHARACTERISTICS  
T

J

=25°C
operating free-air temperature unless otherwise noted  
SYMBOL  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX UNIT  
STATIC CHARACTERISTICS  
V

(BR)DSS  

V

GS

=0V, I

D

=10mA  
600  
V
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
2

GBS60037  
SYMBOL  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX UNIT  
Drain-source breakdown  
voltage  
V

GS

=0V, I

D

=10mA,  
Tj=150
℃  
650  
3.4  
V

(GS)th  

Gate threshold voltage  
V

DS

=V

GS

, I

D

=1mA  
V

GS

=10V, I

D

=25A  
V

GS

=10V, I

D

=25A,  
Tj=125
℃  
4
4.6  
34  
V
29  
Drain-source on state  
resistance  
R

DS-ON  

mΩ  
60  
Gate-source leakage  
current  
I

GSS  

V

GS

=30V, V

DS

=0V  
100  
5
nA  
uA  
V

GS

=0V, V

DS

=600V  
V

GS

=0V, V

DS

=600V,  
Tj=125
℃  
Drain-source leakage  
current  
I

DSS  

500  
DYNAMIC CHARACTERISTICS  
C

iss  

Input capacitance  
Output capacitance  
Reverse transfer  
capacitance  
6300  
110  
pF  
pF  
V

GS

=0V  
C

oss  

V

DS

=400V, f=250KHz  
C

rss  

9
pF  
Effective output  
capacitance,  
C

o

(er)  
225  
pF  
energy related  
Effective output  
capacitance,  
V

GS

= 0V, V

DS

= 0V~400V  
C

o

(tr)  
2435  
pF  
time related  
t

d(on)  

t

r  

t

d(off)  

t

f  

Turn-on delay time  
Rise time  
50  
6
ns  
ns  
ns  
ns  
V

GS

=14V, V

DS

=400V,  
R

G

=3Ω  
Turn-off delay time  
Fall time  
140  
7
GATE CHARGE CHARACTERISTICS  
Q

g  

Gate charge total  
136  
54  
nC  
nC  
nC  
V
Q

gd  

Gate to drain charge  
Gate to source charge  
Gate plateau voltage  
V

DS

=400V, I

D

=25A  
V

GS

=0~10V  
Q

gs  

38  
V

plateau  

6.2  
BODY DIODE CHARACTERISTICS  
V

SD

Diode forward voltage  
V

GS

=0V, I

F

=25A, T

j

=25°C  
1.3  
V
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
3

GBS60037  
SYMBOL  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX UNIT  
t

rr  

Reverse recovery time  
Reverse recovery charge  
Peak reverse recovery  
current  
155  
1.1  
ns  
Q

rr  

µC  
V

DS

=400V, I

F

=25A  
di

F

/dt=100A/µs  
I

rr  

13  
A
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
4

GBS60037  
7 Electrical
 
Characteristic Diagram  
SOA (Ta=25
℃
, D=0)  
IDS=10mA  
1000  
100  
10  
780  
760  
740  
720  
700  
680  
660  
640  
620  
600  
1µs  
10µs  
100µs  
1ms  
10ms  
1
0.1  
1
10  
100  
1000  
-50  
0
50  
Tj [℃]  
100  
150  
Drain voltage (V
)  
Figure 2. Safety Operating Area  
Figure 1. Drain-source Breakdown Voltage  
ID vs. VGS
 
(VDS=20V)  
SOA (Ta=80
℃
, D=0)  
300  
250  
200  
150  
100  
50  
1000  
25
℃  
100  
10  
1
1µs  
10µs  
100µs  
1ms  
150
℃  
10ms  
0
0.1  
-50  
1
10  
100  
1000  
2
4
6
8
10  
12  
Drain voltage (V
)  
Gate voltage (V)  
Figure 3. Safety Operating Area(Ta=80
℃
)  
Figure 4. Typ. Transfer Characteristics  
ID vs. VDS
 
(Ta=25℃)  
ID vs. VDS
 
(Ta=125℃)  
200  
180  
160  
140  
120  
100  
80  
300  
Vgs=20V  
Vgs=20V  
250  
200  
150  
100  
50  
Vgs=10V  
Vgs=10V  
Vgs=8V  
Vgs=8V  
Vgs=7V  
Vgs=7V  
Vgs=6V  
60  
Vgs=6V  
40  
20  
0
0
0
5
10  
15  
20  
0
5
10  
15  
20  
Drain voltage (V)  
Drain voltage (V)  
Figure 5. Typ. Output Characteristics  
Figure 6. Typ. Output Characteristics  
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
5

GBS60037  
VGS=10V
,
IDS=25A  
RDS-
on vs. ID
 
(Ta=25℃)  
140  
120  
100  
80  
2.5  
2.3  
2.1  
1.9  
1.7  
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
60  
40  
20  
-50  
0
50  
Tj [℃]  
100  
150  
0
50  
100  
150  
200  
250  
300  
Drain current (A)  
Figure 7. Typ. Drain Source On-state Resistance  
Figure 8. RDS-ON vs. Tj  
Qg vs. VGS
 
(Ta=25℃
, VDD=400V)  
Cap vs. VDS
 
(Ta=25
℃
, f=250kHz)  
14  
100000  
10000  
1000  
100  
12  
10  
8
Ciss  
Coss  
Crss  
6
4
10  
2
1
0
0
100  
200  
300  
400  
0
40  
80  
120  
160  
Gate charge (nC)  
Drain voltage (V)  
Figure 9. Typ. Gate Charge  
Figure 10. Typ. Capacitance  
Eoss vs. VDS
 
(Ta=25
℃
)  
IF vs. VSD
 
(Ta=
25℃)  
20  
100  
10  
1
18  
16  
14  
12  
10  
8
125
℃  
25
℃  
6
4
2
0.1  
0
0.3  
0.6  
0.9  
1.2  
0
50 100
 
150 200 250 300 350 400 450  
Drain voltage
(
V
)  
Body diode forward voltage (V)  
Figure 11. Typ. Coss Stored Energy  
Figure 12. Body diode forward characteristics  
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
6

GBS60037  
VGS(th) vs. Tj (ID=1mA)  
ID vs. Tc  
70  
60  
50  
40  
30  
20  
10  
0
5
4.5  
4
3.5  
3
2.5  
2
1.5  
1
0.5  
-50  
0
50  
100  
150  
0
40  
80  
120  
160  
Tj [℃]  
Case Temperature (
℃
)  
Figure 13. Threshold Voltage vs. Tj  
Figure 14. Maximum Drain current vs. Tj  
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
7

GBS60037  
8 Test
 
Circuit  
V
(BR)DS  
ID  
VDS  
I
D
 
Rg  
Waveform 1.
 
Unclamped inductive switching  
waveform  
Figure 15. Unclamped inductive  
switching test circuit  
VDS  
Rg1  
dv/dt  
VDS  
dI
F
/dt  
t
rr  
Rg2  
IF  
Qrr  
dI
rr
/dt  
Figure 16. Body diode characteristics test  
circuit  
Waveform 2. Body diode characteristics waveform  
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
8

GBS60037  
VDS  
VDS  
90%  
90%  
90%  
Rg  
VGS  
10%  
10%  
10%  
VGS  
t

d(on)  

t

r  

t

d(off)  

t

f  

Figure 17. Switching time test circuit  
Waveform 3. Switching time waveform  
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
9

GBS60037  
PACKAGE INFORMATION  
mm  
NOM  
5.00  
2.41  
2.00  
1.21  
2.01  
3.01  
0.61  
21.00  
16.55  
15.80  
13.30  
5.00  
SYMBOL  
MIN  
4.80  
2.21  
1.85  
1.11  
1.91  
2.91  
0.51  
20.70  
16.25  
15.50  
13.00  
4.80  
2.30  
MAX  
5.20  
2.59  
2.15  
1.36  
2.21  
3.21  
0.75  
21.30  
16.85  
16.10  
13.60  
5.20  
A
A1  
A2  
b
b2  
b4  
c
D
D1  
E
E1  
E2  
E3  
e
2.50  
2.70  
5.44BSC  
19.92  
–
3.60  
–
L
19.62  
20.22  
4.30  
3.80  
7.30  
L1  
Φ
P  
Φ
P1  
S
–
3.40  
–
6.15BSC  
All application information:
 

©2021
GOSEMICON Co., Ltd.  
All Rights Reserved  
10