Guangdong-Hottech-AO4407

Part #Guangdong-Hottech-AO4407
Download 
Guangdong-Hottech-AO4407
AO4407  
P-CHANNEL ENHANCEMENT MODE MOSFET  
FE
A
T
URES  
Advanced trench process technology  
High density cell design for ultra low on-resistance  
Lead free product is acquired  
V

DS:

-30V Max.,I

D:

-12A Max.  
R

DS(ON)

≤13mΩ@V

GS

=-20V  
R

DS(ON)

≤14mΩ@V

GS

=-10V  
R

DS(ON)

≤30mΩ@V

GS

=-5V  
SOP-8  
MECHANICAL DATA  
Case: SOP-8  
Case material: Molded plastic. UL flammability  
Classification rating: 94V-0  
Weight: 0.3 grams (approximate)  
MAXIMUM RATINGS
(T

A

=25°C unless otherwise specified)  
Parameter  
Drain-source voltage  
Symbol  
1
0
S
ec  
Steady state  
Unit  
V

DS  

V

GS  

-30  
V
V
Gate-source voltage  
±25  
T

A

=25°C  
T

A

=70°C  
-12  
-10  
-9.2  
-7.4  
I

D  

Continuous drain current  
Pulsed drain current
 

(note 1)  

A
I

DM  

I

AR  

-60  
26  
Avalanche current  
(note 1)  
Repetitive avalanche energy L=0.3Mh
 

(note 1)  

E

AR  

101  
mJ  
W
T

A

=25°C  
Power dissipation

(note 2)  

T

A

=70°C  
3.1  
2.0  
1.7  
1.1  
P

D  

Junction and storage temperature range  
T

J

, T

STG  

R

θJA  

-55 to 150  
°C  
Typ.:32  
Max.:40  
Typ.:60  
Max.:75  
Maximum junction-to-ambient

(note 3)  

°C/W  
Typ.:17  
Max.:24  
Maximum junction-to-lead

(note 3,4)  

R

θJL  

Note:  
1. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to  
keep initial T

J

=25°C.  
2. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.  
3. The value of R

qJA

is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
value in any given application depends on the user’s specific board design.  
4.The R

qJA

is the sum of the thermal impedance from junction to lead R

qJL

and lead to ambient.  
5.The static characteristics in Figures 1 to 6 are obtained using <300ms pulses, duty cycle 0.5% max.  
6.These curves are based on the junction-to-ambient thermal impedance which is measured with the device mounted on 1in2 FR-4 board with  
2oz. copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.  
SHENZHEN HOTTECH ELECTRONICS CO.,LTD  
1

/ 6  

E-mail:hkt@heketai.com  
©

AO4407  
P-CHANNEL ENHANCEMENT MODE MOSFET  
ELECTRICAL CHARACTERISTICS
(T

A

=25°C unless otherwise specified)  
Parameter  
Symbol Min
 
Typ Max
 
Unit  
Conditions  
Drain-source breakdown voltage  
V

DSS  

-30  
V
I

D

=-250μA,V

GS

=0V  
V

DS

=-30V,V

GS

= 0V  
V

DS

=-30V,V

GS

=0V,T

J

=55°C  
V

DS

=0V,V

GS

=±25V  
V

DS

=V

GS

,I

D

=-250μA  
V

GS

=-10V,V

DS

=-5V  
V

GS

=-20V,I

D

=-12A  
V

GS

=-10V,I

D

=-12A  
-1  
-5  
±100  
Zero gate voltage drain current  
I

DSS  

μA  
Gate-body leakage current  
Gate threshold voltage  
On state drain current  
I

GSS  

V

GS(t  

I

D(ON)  

nA  
V
A
-1.7 -2.25 -2.8  
-60  
8.5  
10  
13  
14  
19  
30  
Static drain-source on-resistance  
R

DS(ON)  

mΩ  
12  
19  
V

GS

=-10V,I

D

=-12A,T

J

=125°C  
V

GS

=-5V,I

D

=-7A  
Forward transconductance  
Diode forward voltage  
Maximum body-diode continuous  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Gate resistance  
Total gate charge  
Gate source charge  
Gate drain charge  
Turn-on delaytime  
Turn-on rise time  
g

FS  

V

SD  

I

S  

Ciss  
Coss  
Crss  
Rg  
27  
-0.72  
S
V
A
V

DS

=-5V,I

D

=-10.5A  
I

S

=-1A,V

GS

=0V  
-1  
-4  
2060 2600  
370  
295  
pF  
pF  
pF  
Ω
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
V

GS

=0V,V

DS

=-15V,f=1MHz  
V

GS

=0V,V

DS

=0V,f=1MHz  
1.2  
24  
2.4  
30  
4.6  
10  
11  
9.4  
24  
12  
30  
3.6  
39  
Qg  
V

GS

=-10V,V

DS

=-15V,  
I

D

=-12A  
Qgs  
Qgd  
t

D(on)  

tr  
t

D(off)  

t

f  

V

GS

=-10V, V

DS

=-15V,  
R

L

=1.25Ω,  
R

GEN

=3Ω  
Turn-off delaytime  
Turn-off fall time  
Body diode reverse recovery time  
t

rr  

40  
I

F

=-12A, dI/dt=100A/μs  
Body diode reverse recovery  
charge  
Qrr  
22  
nC  
SHENZHEN HOTTECH ELECTRONICS CO.,LTD  
2

/ 6  

E-mail:hkt@heketai.com  
©

AO4407  
P-CHANNEL ENHANCEMENT MODE MOSFET  
TYPICAL CHARACTERISTICS  
80  
80  
60  
40  
20  
0
-10V  
V

DS

=-5V  
-6V  
-5V  
60  
40  
20  
0
-4.5V  
125
°
C  
-4V  
V

GS

=-3.5V  
4
25
°
C  
1
2
3
4
5
6
0
1
2
3
5
V

GS

(Volts)  
Figure 2: Transfe
r
C
haracteristic
s
(
Not
e
5
)  
-V

DS

(Volts)  
Fig 1: On-Regio
n
C
haracteristic
s
(
Not
e
5
)  
30  
1.6  
1.4  
1.2  
1
25  
20  
15  
10  
5
V

GS

=-10V  
I

D

=-12A  
V

GS

=-5V  
V

GS

=-5V  
V

GS

=-10V  
I

D

=-7A  
0
0.8  
0
5
10  
15  
20  
0
25  
50  
75  
100  
125  
150  
175  
-I

D

(A)  
Temperature (
°
C
)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage
(
N
o
t
e
5
)
Figure 4: On-Resistance vs. Junction Temperature  
(Note 5)  
30  
25  
20  
15  
10  
5
1.0E+01  
I

D

=-12A  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125
°
C  
125
°
C  
25
°
C  
25
°
C  
0.0  
0.2  
0.4  
-V

SD

(Volts)  
Figure 6:
 
Body-Diode Characteristic
s
(
Not
e
5
)  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
-V

GS

(Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
SHENZHEN HOTTECH ELECTRONICS CO.,LTD  
3

/ 6  

E-mail:hkt@heketai.com  
©

AO4407  
P-CHANNEL ENHANCEMENT MODE MOSFET  
3000  
2500  
2000  
1500  
1000  
500  
10  
V

DS

=-15V  
I

D

=-12A  
8
6
4
2
0
C

iss  

C

oss  

C

rss  

0
0
5
10  
15  
Q

g

(nC)  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
-V

DS

(Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
1000.0  
100.0  
10.0  
1.0  
10000  
1000  
100  
10  
T

A

=25
°
C  
10
µ
s  
R

DS(ON)  

limited  
100
µ
s  
1ms  
10ms  
10s  
T

J(Max)

=150
°
C  
T

A

=25
°
C  
0.1  
DC  
1
0.0  
0.00001  
0.001  
0.1  
10  
1000  
0.01  
0.1  
1
10  
100  
V

DS

(Volts)  
Pulse Width (s)  
Figure 11: Single Pulse Power Rating Junction-to-  
Ambient (Note 6)  
Figure 10: Maximum Forward Biased Safe  
Operating Area (Note 6)  
10  
1
D=T

on

/T  
T

J,PK

=T

A

+P

DM

.Z

θ
JA

.R

θ
JA  

In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
R

θ
JA

=75
°
C/W  
0.1  
P

D  

0.01  
0.001  
Single Pulse  
0.001  
T

on  

T
0.00001  
0.0001  
0.01  
Pulse Width (s)  
Figure 12: Normalized Maximum Transient Thermal Impedance (Note 6)  
0.1  
1
10  
100  
1000  
SHENZHEN HOTTECH ELECTRONICS CO.,LTD  
4

/ 6  

E-mail:hkt@heketai.com  
©

AO4407  
P-CHANNEL ENHANCEMENT MODE MOSFET  
SOP-8 Package
 
Outline Dimensions  
Dimensions In Millimeters  
Symbol  
Dimensions In Inches  
Min.  
Max.  
1.750  
0.250  
1.550  
0.510  
0.250  
5.000  
Min.  
Max.  
A
A1  
A2  
b
1.350  
0.100  
1.350  
0.330  
0.170  
4.800  
0.053  
0.004  
0.053  
0.013  
0.007  
0.189  
0.069  
0.010  
0.061  
0.020  
0.010  
0.197  
c
D
e
1.270(BSC)  
0.050
(
BSC
)  
E
5.800  
3.800  
0.400  
0
°  
6.200  
4.000  
1.270  
8
°  
0.228  
0.150  
0.016  
0
°  
0.244  
0.157  
0.050  
8
°  
E1  
L
θ
SOP-8 Suggested Pad Layout  
Note:  
1.Controlling dimension: in millimeters  
2.General tolerance: ±0.05mm  
3.The pad layout is for reference purposes only  
SHENZHEN HOTTECH ELECTRONICS CO.,LTD  
5

/ 6  

E-mail:hkt@heketai.com  
©

AO4407  
P-CHANNEL ENHANCEMENT MODE MOSFET  
SOP-8 Tape
 
and Reel  
SOP-8 Embossed Carrier Tape  
DIMENSIONS ARE IN MILLIMETER  
TYPE  
A
B
C
d
E
F
P0  
P
P1  
W
SOP-8  
6.40  
±0.1  
5.40  
±0.1  
2.10  
±0.1  
Ø1.50  
±0.1  
1.75  
±0.1  
5.50  
±0.1  
4.00  
±0.1  
8.00  
±0.1  
2.00  
±0.1  
12.00  
±0.1  
TOLERANCE  
SOP-8 Tape Leader and Trailer  
SOP-8 Reel  
DIMENSIONS ARE IN MILLIMETER  
REEL OPTION  
13’’ DIA  
D
D1  
D2  
13.00  
±1  
G
R151.00  
±1  
H
R56.00  
±1  
I
W1  
W2  
Ø330.00 100.00  
±2 ±1  
R6.50  
±1  
12.40  
±1  
17.60  
±1  
TOLERANCE  
SHENZHEN HOTTECH ELECTRONICS CO.,LTD  
6

/ 6  

E-mail:hkt@heketai.com  
©