Guangdong-Hottech-SI2307

Part #Guangdong-Hottech-SI2307
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Guangdong-Hottech-SI2307
Plastic-Encapsulate Mosfets  
FEATURES  
HOA2307  
P-Channel MOSFET  
Lower on-resistance  
Reliable and Rugged  
Absolute Maximum Ratings (TA=25

o

C, unless otherwise noted)  
Parameter  
Symbol Ratings  
Unit  
V
V
DS  
V
GS  
I
D  
Drain-Source
V
o
ltage  
-30  
20  
1.Gate  
2.Source  
Gate-source
V
o
ltage  
V
SOT-23  
Drain Current (Continuous)

a  

Total Power Dissipation

=25

o

C  
-2.7  
1.1  
A
3.Drain  
b
P
D  
W
T

j,

T

stg

-55 to +150  
R

θJA  

Operating Junction and Storage Temperature Range  
°C  
Thermal Resistance Junction to Ambient (PCB mounted)  
114  
°C/W  
Electrical Characteristics (TA=25°C, unless otherwise noted)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Static  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
V

(BR)DSS  

V

GS(th)  

I

GSS  

V

GS

= 0V, I

D

=-250µA  
V

DS

=V

GS

, I

D

=-250µA  
V

DS

=0V, V

GS

=±20V  
V

DS

=-30V, V

GS

=0V  
-30  
-1  
V
-3  
±100  
-1  
nA  
µA  
Zero Gate Voltage Drain Current  
Drain-Source On-State Resistance

c  

I

DSS  

-10  
V

DS

=-30V, V

GS

=0V,
T

J

=55
℃
 
V

GS

=-4.5V, I

D

=-2.5A  
V

GS

=-10V, I

D

=-3.5A  
0.110  
0.073  
7
0.138  
0.088  
R

DS(on)  

g

fs  

Ω
Forward Transconductance

c  

Dynamic

d  

V

DS

=-10V, I

D

=-3.5A  
S
Input Capacitance  
C

iss  

C

oss  

C

rss  

Q

g  

340  
67  
V

DS

=-15V,V

GS

=0V,f =1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
51  
4.1  
1.3  
1.8  
10  
6.2  
V

DS

=-15V,V

GS

=-4.5V,  
I

D

=-2.5A  
nC  
Q

gs  

Q

gd  

R

g  

f =1MHz  
Ω
Page:P3-P1  
GUANGDONG HOTTECH INDUSTRIAL CO.,
 
LTD  

Plastic-Encapsulate Mosfets  
HOA2307  
Turn-On Delay Time  
t

d(on)  

t

r  

t

d(off)  

t

f  

40  
40  
20  
17  
60  
60  
40  
30  
V

DD

=-15V,  
Rise Time  
R

L

=15
Ω
,
I

D

=-1A,  
ns  
V
Turn-Off Delay Time  
V

GEN

=-4.5V,Rg=1
Ω  
Fall Time  
Drain-source Body diode characteristics  
-1.2  
Body Diode Voltage  
V

SD  

I

S

=-0.75A, ,V

GS

=0  
-0.8  
Notes:  
a. t=5s.  
b. Surface mounted on 1” ×1” FR4 board.  
c. Pulse
T
e
st : Pulse Width < 300µs, Duty Cycle
≤
2%.  
d. Guaranteed by design, not subject to production testing.  
Page:P3-P2  
GUANGDONG HOTTECH INDUSTRIAL CO.,
 
LTD  

Plastic-Encapsulate Mosfets  
Typical Characteristics  
HOA2307  
Output Characteristics  
Transfer Characteristics  
-20  
-10  
-8  
V

GS

=-10V,-8V,-6V  
T

a

=25  
℃
T

a

=25  
℃
Pulsed  
Pulsed  
V

GS

=-4.5V  
-16  
-12  
-8  
V

GS

=-4.0V  
V

GS

=-3.5V  
-6  
-4  
V

GS

=-3.0V  
-4  
-2  
-0  
-0  
-0  
-1  
-2  
-3  
-4  
-5  
-0  
-1  
-2  
-3  
-4  
-5  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
DRAIN TO SOURCE VOLTAGE
 
V

DS

(V)  
R

DS(ON)

—— I

D  

R

DS(ON)

—— V

GS  

300  
250  
200  
150  
100  
50  
500  
400  
300  
200  
100  
0
T

a

=25  
℃
T

a

=25
℃
 
Pulsed  
Pulsed  
V

GS

=-4.5V  
I

D

=-3.5A  
V

GS

=-10V  
-0  
-4  
-8  
-12  
-16  
-20  
-0  
-4  
-8  
-12  
-16  
-20  
DRAIN CURRENT
 
I

D

(A)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
I

S

—— V

SD  

-10  
T

a

=25
℃  
Pulsed  
-1  
-0.1  
-0.01  
-0.0  
-0.3  
-0.6  
-0.9  
-1.2  
-1.5  
SOURCE TO DRAIN VOLTAGE
 
V

SD

(V)  
Page:P3-P3  
GUANGDONG HOTTECH INDUSTRIAL CO.,
 
LTD