HL-100N02

Part #HL-100N02
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HL-100N02
N-Ch 20V Fast Switching MOSFETs  
10
0
N
0
2
Green Device Available  
Super Low Gat
e
C
harge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
Product Summary  
BVDSS  
RDSON  
ID  
20V  
2.7mΩ  
100A  
100% EAS Guaranteed  
Description  
TO252 Pin Configuration  
The 100N02
 
is the high cell density trenched
 
N-ch  
MOSFETs, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
The 100N02
 
meet the RoHS and Green Product,  
requirement 100%
 
EAS guaranteed with  
full function reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Units  
20  
V
V
Drain-Source
Voltage  
Gate-Sou
r
ce
V
oltage  
V
DS  
GS  
±20  
100  
V
Continuous
Drain Current, V

GS

@ 10V

1,6  

Continuous
Drain Current, V

GS

@ 10V

1,6  

A
I
D
@T  
C
=25
℃
 
59  
360  
A
I
D
@T
C
=100
℃  
A
Pulsed
Drain Current  
2
I
DM  
118  
mJ  
A
Single
Pulse Avalanche Energy  
3
EAS  
41  
Avalanche
Current  
I
AS  
88  
W
℃
℃
Total
Power Dissipation  
4
P
D
@T  
C
=25
℃  
-55 to 150  
-55 to 150  
Storage Temperature
Range  
T
STG  
Operating
Junction Temperature Range  
T
J
Thermal Data  
Symbol  
Parameter  
Thermal Resistance Junction-Case

1  

Typ.  
Max.  
Unit  
R
θ
JC  
—  
1.8  
℃
/W  
01  

N-Ch 20V Fast Switching MOSFETs  
100N02  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
T
e
st Condition  
Min.  
Typ.  
Max.  
Units  
Off Characteristic  
20  
–
V
(BR)DSS
Drain-Source Breakdown Voltage  
V
V
V

GS

=0V, I  
D
=250
μ
A  
–
–
–
–
V
1
I
DSS  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  

DS

=20V, V

GS

=0V  
μ
A  
nA  
I
GSS  

GS

= ±12V, V

DS

=0V  
–
±100  
On Characteristics  
0.4  
0.7  
2.8  
4
1
4
6
V
GS(th)  
DS(on)  
Gate Threshold Voltage  
V
V
V

DS

=V

GS

, I  

GS

=4.5V, I  

GS

=2.5V, I  
D
=250
μ
A  
V
D
=30A  
=20A  
–
Static Drain-Source On-Resistance  
R
m
Ω  
note  
3
D
Dynamic Characteristics  
3200  
460  
445  
48  
C
iss  
Input Capacitance  
–
–
–
–
–
–
–
–
–
–
–
–
pF  
pF  
pF  
nC  
nC  
nC  
V

DS

=10V, V

GS

=0V,  
C
oss  
Output Capacitance  
f=1.0MHz  
C
rss  
Reverse Transfer Capacitance  
Total Gate Charge  
Q
g
V

DS

=10V, I =30A,  
D
3.6  
Q
Q
gs  
gd  
Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
V

GS

=4.5V  
19  
Switching Characteristics  
9.7  
37  
63  
52  
t
d(on)  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
–
–
–
–
–
–
–
–
ns  
ns  
ns  
ns  
t
r
V

DS

=10V, I =30A,  
G
D
t
d(o
f
f)  
R =1.8
Ω
, V

GS

=4.5V  
t
f
Drain-Source Diode Characteristics and Maximum Ratings  
100  
360  
I
S
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
–
–
–
–
A
A
I
SM  
Drain to Source Diode Forward  
Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
V

GS

=0V, I

SD

=30A,  
=25
℃
 
=25°C, I =30A,  
1.2  
V
SD  
rr  
rr  
–
–
V
T
T
J
23  
10  
t
–
–
–
–
ns  
J
F
Q
di/dt =100A/
μ
s  
nC  
Notes:  
1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature  
2. EAS condition: T

J

=25℃, V
DD
=15V, V
G
=4.5V, L=0.5mH, R
G
=25Ω, I
AS
=21A  
3. Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%  
02  

N-Ch 20V Fast Switching MOSFETs  

100N02  
Typical Electrical and Thermal Characteristics (Curves)  
Figure1: Output Characteristics  
Figure 2: Typical Transfer Characteristics  
Figure 3:On-resistance vs. Drain Current  
Figure 5: Gate Charge Characteristics  
Figure 4: Body Diode Characteristics  
Figure 6: Capacitance Characteristics  
03  

N-Ch 20V Fast Switching MOSFETs  

1
0
0
N
0
2
Typical Performance Characteristics  
Figure 7: Normalized Breakdown Voltage vs.  
Figure 8: Normalized on Resistance vs.  
Junction Temperature  
Junction Temperature  
Figure 9: Maximum safe operating area  
Fig
u
F
r
F
e
i
g
1u0
r
:e
M
1
a
0
x
:
i
M
m
aux
m
i
m
du
r
m
a
i
n
C
o
c
u
n
r
t
r
i
n
e
n
u
t
o
v
us.
D
c
r
a
a
s
i
e
nt
C
e
u
m
r
p
r erature  
Figure 11:Maximum Effective Transient  
Thermal Impedance, Junction-to-Casense curve  
04  

N-Ch 20V Fast Switching MOSFETs  
100N02  
Package Mechanical Data-TO-252-4R  
E
Dimensions  
Millimeters  
C2  
B2  
Ref.  
Inches  
T
y
p.  
Min.  
2.1  
T
y
p.  
Max.  
2.5  
Min.  
0.083  
0
Max.  
0.098  
0.004  
0.034  
0.216  
0.024  
0.023  
0.248  
A
A2  
B
0
0.1  
0.66  
5.18  
0.4  
0.86  
5.48  
0.6  
0.026  
0.202  
0.016  
0.017  
0.232  
B2  
C
C2  
D
0.44  
5.9  
0.58  
6.3  
C
B
D1  
E
5.30REF  
0.209REF  
G
DETA IL
 
A  
6.4  
6.8  
0.252  
0.182  
0.176  
0.374  
0.043  
0.053  
0.268  
E1  
G
4.63  
4.47  
9.5  
4.67  
10.7  
1.21  
1.65  
0.184  
0.421  
0.048  
0.065  
H
L
1.09  
1.35  
TO-  
L2  
V1  
V2  
E1  
7°  
7°  
L2  
0°  
6°  
0°  
6°  
Reel Spectification-TO-252-4R  
P0  
P2  
Dimensions  
t1  
Ref.  
M
i
llimeters  
Inches  
Typ.  
A
M
i
n.  
15.9  
1.65  
7.4  
Typ.  
16  
M
a
x
.  
16.1  
1.85  
7.6  
M
i
n.  
M
a
x
.  
A
W
E
0.626  
0.065  
0.291  
0.055  
0.055  
0.154  
0.311  
0.075  
0.27  
0.63  
0.634  
0.073  
0.299  
0.063  
0.063  
0.161  
0.319  
0.083  
0.276  
0.417  
0.113  
0.011  
1.75  
7.5  
1.5  
1.5  
4
0.069  
0.295  
0.059  
0.059  
0.157  
0.315  
0.079  
0.271  
0.413  
0.109  
P1  
A0  
F
B
K0  
D0  
D1  
P0  
P1  
P2  
A0  
B0  
K0  
T
1.4  
1.6  
5°  
1.4  
1.6  
3.9  
4.1  
7.9  
8
8.1  
1.9  
2
2.1  
6.85  
10.45  
2.68  
0.24  
0.1  
6.9  
10.5  
2.78  
7
10.6  
2.88  
0.27  
0.411  
0.105  
0.009  
0.004  
1.567  
t1  
10P0  
39.8  
40  
40.2  
1.575  
1.583  
05