HL-2319

Part #HL-2319
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HL-2319
P-CH 40V Fast Switching MOSFETs  
23
1
9
Product Summary  
Green Device Available  
Super Low Gat
e
C
harge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
BVDSS  
-40V  
RDSON  
63m
Ω
 
ID  
-4A  
SOT23 Pin Configurations  
Description  
The 2319 is the high cell density trenched  
P-ch MOSFETs, which provides excellent  
RDSON and efficiency for m ost of the small  
power switching and load switch applications.  
The 2319 meets the RoHS and Green  
Product with full function reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
Drain-Source
V
o
ltage  
-40  
V
V
DS  
Gate-Source Voltage  
±20  
V
A
V
GS  
Continuous Drain Current  
T
A
= 25°C  
= 25°C  
-4  
-20  
I
D
Pulsed Drain Current  
1
A
I
DM  
Power Dissipation  
T
A  
1.2  
W
°C  
P
D
Operating Junction and Storage Temperature Range  
-55 to 150  
T
J
,T

STG  

Thermal Data  
Symbol  
Parameter  
Value  
Unit  
R
θ
JA  
Thermal Resistance from Junction to
A
m
bient  
2
104  
°C/W  
01  

P-CH 40V Fast Switching MOSFETs  
2319  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
Test condition  
Min.  
Typ.  
Max.  
Units  
Static Characteri
s
tics  
V
(BR)DSS  
DSS  
GSS  
Drain-Source Breakdown
V
o
ltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage  
V
V
V
GS
= 0
V
, I  
DS
= -40
V
, V
GS
= 0V  
DS
= 0
V
, V
GS
= ±20V  
= -250
μ
A  

GS

= -10
V
,I
 
= -5A  

GS

= -4.5V,I
 
= -4A  
D
= -250
μ
A  
-40  
–
–
-1.2  
–
–
–
–
–
–
-1  
±100  
-2.5  
85  
V
μ
A  
nA  
V
I
I
V
GS(th)  
Gate-Threshold
V
o
ltage  
V
DS
= V
GS,  
I
D  
-1.5  
63  
80  
V
V
D
R
DS(on)  
Drain-Source on-Resistance  
3
m
Ω  
D
125  
Dynamic Characteri
s
tics  
4
Input Capacitance  
Output Capacitance  
C
iss  
–
–
–
553  
50  
–
–
–
V

GS

= 0
V
,
V

DS

= -20
V
,  
C
oss  
pF  
f=1.0MHz  
Re
v
e
rse Transfer Capacitance  
C
rss  
42  
Switching Characteri
s
tics  
4
Q
g
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-on Delay Time  
Rise Time  
–
–
–
–
–
–
–
11.8  
2.2  
3
–
–
–
–
–
–
–
V
I
D  
GS
= -10V ,
V
DS
= -20
V
,  
= -5A  
Q
gs  
nC  
ns  
Q
gd  
t
d
(
o
n)  
7
t
r  
V
DS
= -20
V
, V
GS
= -10V  
6.5  
24  
7.8  
t
d
(
o
ff)  
Turn-off Delay Time  
Fall Time  
R
L
= 2.5
Ω
, R
 
= 3
Ω  
G
t
f  
Drain-Source Body Diode Characteri
s
tics  
Body Diode
v
o
ltage  
Continuous Source Current  
3
I
S
= -5
A
,V

GS

=0V  
V
DS  
–
–
–
–
-1.2  
-4  
V
A
I
S
Diode Characteristics  
Notes:  
1.Repetitive rating, pulse width limited by junction temperature T

J(MAX)

=150°C.  
2
.
T
he data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper, The value in any given application depends on  
the user’s specific board design.  
3.Pulse Test: Pulse width≤300μs, duty cycle≤2%.  
4
.
T
his value is guaranteed by design hence it is not included in the production test.  
02  

P-CH 40V Fast Switching MOSFETs  

2319  
Typical Electrical and Thermal Characteristics (Curves)  
Figure1: Output Characteristics  
Figure 2: Typical Transfer Characteristics  
Figure 3:Forward Characteristics of Reverse  
Figure 4: RDS(ON) vs. VGS  
Figure 5: RDS(ON) vs. ID  
Figure 6:Normalized RDS(on) vs. Temperature  
03  

P-CH 40V Fast Switching MOSFETs  

2
3
1
9
Typical Performance Characteristics  
Figure 7:Capacitance Characteristics  
Figure 8: Gate Charge Characteristics  
04  

P-CH 40V Fast Switching MOSFETs  
2319  
SOT23 Mechanical tData  
05