HL-30P10M

Part #HL-30P10M
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HL-30P10M
P-Ch 30V Fast Switching MOSFETs  
3
0
P
1
0M  
100% EAS Guaranteed  
Green Device Available  
Super Low Gat
e
C
harge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
Product Summary  
BVDSS  
RDSON  
ID  
-30V  
19mΩ  
-10.0A  
Description  
DFN2X2-6L Pin Configuration  
The 30P10M
 
is the high cell density trenched
 
P-ch  
MOSFETs, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
The 30P10M
 
meet the RoHS and Green Product  
requirement 100%
 
EAS guaranteed with  
full function reliability approved.  
Absolute Maximum Ratings (TA=25℃ unless otherwise specified)  
Rating  
Symbol  
Parameter  
Units  
10s  
Steady State  
Drain-Source
V
o
ltage  
-30  
±
20  
-10  
-8  
V
DS  
V
A
Gate-Sou
r
ce Voltage  
V
GS  
I
D
@T
C
=25
℃
 
Continuous Drain Current,
V

GS

@ -10
V

1  

I
D  
@T
C
=100
℃  
Pulsed Drain Current  
2
-36  
25  
I
DM  
Single Pulse
A
v
a
lanche Energy  
3
EAS  
mJ  
A
I
AS  
Av
a
lanche Current  
-8  
P
P
D
@T  
C
=25
℃  
=25
℃  
5
Total Power Dissipation  
4
W
D
@T  
A
4.2  
1.67  
Storage Temperature Range  
T
STG  
-55 to 150  
-55 to 150  
℃
T
J
Operating Junction Temperature Range  
Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
Thermal Resistance Junction-
A
m
bient  
1
30  
℃
/W  
—  
R
θ
JA  
01  

P-Ch 30V Fast Switching MOSFETs  
3
0
P
1
0M  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
BV

DSS  

Parameter  
Drain-Source Breakdown
V
o
ltage  
Test Condition  
Min.  
-30  
Typ.  
—  
Max.  
—  
U
n
its  
V
V

G
S

=0
V
, I  
Reference to 25
℃
, I  
1mA  
G
S
=-10V , I  
G
S
=-4.5
V
, I  
D
=-250uA  
D
=-  
△
BV

DSS  

/
△
T
J  
BV

DSS

Temperature Coefficient  
—  
-0.022  
—  
V/
℃  
m
Ω
 
V
D
=-15A  
—  
—  
-1  
19  
25  
24  
35  
-2.5  
—  
R
DS(ON)  
Static Drain-Source On-Resistance  
Gate Threshold
V
o
ltage  
2
V
D
=-10A  
V
GS(th)  
—  
V
V

G
S

=V

DS

, I  
D
=-250uA  

DS

=-24V , V

G
S

=0
V
, T  
DS
=-24V , V
G
S
=0
V
, T  
±
25V ,
V

DS

=0V  

DS

=0
V
,
V

GS

=0
V
,
f
=1MHz  
△
V
GS(th)  
V

G
S
(
th)

Temperature Coefficient  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
4.6  
—  
m
V
/
℃  
V
J
=25
℃  
=55
℃  
-1  
I
DSS  
Drain-Source Leakage Current  
uA  
V
J
—  
-5  
I
G
S
S  
Gate-Source Leakage Current  
Gate Resistance  
V
GS  
=
—  
±
100  
—  
nA  
V
R
g
g
13  
Ω
Q
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
48  
—  
V
15A  

DS

=-15V , V

GS

=-4.5V , I  
D
=-  
Q
gs  
gd  
9.5  
8
—  
nC  
ns  
Q
—  
T
d
(
o
n)  
12  
—  
T
r  
14  
—  
V
R

DD

=-15V ,
V

G
S

=-10V ,  
G
=3.3
Ω
, I
 
=-15A  
D
T
d
(
o
ff)  
Turn-Off Delay Time  
Fall Time  
190  
90  
—  
T
f  
—  
C
iss  
Input Capacitance  
1150  
155  
139  
—  
C
oss  
Output Capacitance  
Re
v
e
rse Transfer Capacitance  
V

DS

=-15V ,
V

G
S

=0
V
,
f
=1MHz  
—  
pF  
C
r
s
s  
—  
Diode Characteristics  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
-10  
Unit  
A
I
S  
Continuous Source Current
1,5  
Pulsed Source Current

2,5  

V
G
=V
D  
=0
V
,
F
orce Current  
I
SM  
—  
—  
-36  
A
V
SD  
Diode Forward
V
o
ltage  
2
V

G
S

=0
V
, I  
S
=-1A , T  
J
=25
℃
 
—  
—  
-1.2  
V
Note :  
1. 1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=-25V,V
GS
=-10V,L=0.1mH,IAS=-38A  
4.The power dissipation is limited by 150℃ junction temperature  
5.The data is theoretically the same as I

D

and I
DM
, in real applications , should be limited by total power dissipation.  
02  

P-Ch 30V Fast Switching MOSFETs  
3
0
P
1
0M  
Typical Performance Characteristics  
Figure1: Output Characteristics  
Figure 2: Typical Transfer Characteristics  
Figure 3:On-resistance vs. Drain Current  
Figure 5: Gate Charge Characteristics  
Figure 4: Body Diode Characteristics  
Figure 6: Capacitance Characteristics  
03  

P-Ch 30V Fast Switching MOSFETs  
3
0
P
1
0M  
Typical Performance Characteristics  
Figure 7: Normalized Breakdown Voltage vs.  
Junction Temperature  
Figure 8:Normalized on Resistance vs.  
Junction Temperature  
Figure 10: Maximum Continuous Drain Current  
vs. Case Temperature  
Figure 9: Maximum Safe Operating Area  
Figure 11: Maximum Effective Transient  
Thermal Impedance, Junction-to-Ambient  
04  

P-Ch 30V Fast Switching MOSFETs  
3
0
P
1
0M  
Test Circuit  
05  

P-Ch 30V Fast Switching MOSFETs  
3
0
P
1
0M  
DFN2X2-6L Package Information  
06