HL-3401A

Part #HL-3401A
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HL-3401A
P-Ch 30V Fast Switching MOSFETs  
3
4
0
1A  
Product Summery  
Features  
Green Device Available  
BVDSS  
RDSON  
ID  
Super Low Gate Charge  
-30V  
42m
Ω
 
-4.5A  
Excellent CdV/dt effect decline  
Advanced high cell density Trench technology  
Description  
SOT 23 Pin Configurations  
THE 3401A is the high cell density trenched  
P-ch MOSFETs, which provide excellent RDSON  
and efficiency for most of the small power  
switching and load switch applications.  
The 3401A meet the RoHS and Green Product  
requireme n t with full function reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-30  
Units  
Drain-Source
V
o
ltage  
Gate-Sou
r
ce Voltage  
Continuous Drain Current  
Continuous Drain Current  
V
V
V
DS  
±
12  
-4.5  
V
GS  
A
I
D  
@T
A
=25
℃
 
-3.6  
A
I
D  
@T
A
=70
℃  
Pulsed Drain Current  
2
-16  
A
I
DM  
Total Power Dissipation  
Total Power Dissipation  
3
3
1.4  
W
W
℃
℃
P
P
D
D
@T  
A
=25
℃  
0.9  
A
@T =70
℃  
Storage Temperature Range  
-55 to 150  
T
STG  
Operating Junction Temperature Range  
-55 to 150  
T
J
Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
105  
—  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-
A
m
bient  
1
—  
—  
R
R
θ
JA  
θ
JA  
Thermal Resistance Junction-
A
m
bient
 
(t
≤
10s)  
1
01  

P-Ch 30V Fast Switching MOSFETs  
3401A  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
Te
s
t Conditions  
Min.  
Typ.  
Max.  
Unit  
Static Characteristics  
Drain-Source Breakdown
V
o
ltage  
Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
Gate-Threshold
V
o
ltage  
V
GS
= 0
V
, I  

DS

= -30
V
, V

GS

= 0V  

DS

= 0
V
, V

GS

= ±12V  

DS

= V

GS

, I
 
= -250µA  

GS

= -10
V
, I
 
= -4.2A  

GS

= -4.5V, I  

GS

= -2.5V, I  
D
= -250µA  
-30  
V
μ
A  
nA  
V
V
(BR)DSS  
–
–
–
V
–
–
I
DSS  
GSS  
GS(th)  
-1  
V
l
–
±100  
-1.3  
60  
V
D
-0.7  
V
-1  
42  
V
D
V
D
= -4A  
= -1A  
–
–
R
DS(on)  
Drain-Source on-Resistance  
3
52  
60  
75  
90  
m
Ω  
V
D
Dynamic Characteristics 4  
Input Capacitance  
Output Capacitance  
C
iss  
oss  
rss  
–
–
–
745  
70  
–
–
–
C
V

DS

= -15
V
, V

GS

=0
V
, f =1MHz  
pF  
Re
v
e
rse Transfer Capacitance  
C
57  
Switching Characteristics  
4
Total Gate Charge  
Gate
−
Source Charge  
Gate
−
Drain Charge  
Turn-on Delay Time  
Rise Time  
Q
g  
–
–
–
–
–
–
–
8
1.8  
2.7  
7
–
–
–
–
–
–
–
V

GS

= -4.5V, V

DS

= -15
V
,  
= -4.2A  
Q
gs  
gd  
d(on)  
nC  
ns  
I
D  
Q
t
t
r  
3
V

GS

= -10
V
, V

DD

= -15
V
, I
 
= –  
D
Turn-off Delay Time  
Fall Time  
4.2
A
,
R

GEN

= 6
Ω  
t
d(off)  
30  
12  
t
f  
Drain-Source Diode Characteristics  
Diode Forward
V
o
ltage  
3
I
S  
= -4.2A, V

GS

= 0V  
–
–
–
–
-1.2  
-4.2  
V
A
V
SD  
Continuous Source Current  
I
S  
Note :  
1.Repetitive rating, pulse width limited by junction temperature T

J(MAX)

=150°C  
2
.
T
he data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper, The value in any given application  
depends on the user’s specific board design.  
3.Pulse Test: Pulse width≤300μs, duty cycle≤2%.  
4.
.
T
his value is guaranteed by design hence it is not included in the production test.  
02  

P-Ch 30V Fast Switching MOSFETs  
3401A  
P-Channel Typical
 
Performance Characteristics  
Figure1:Typical Output Characteristics  
Figure 2:Transfer Characteristics  
Figure 3:Forward Characteristics of Reverse  
Figure 4: RDS(ON) vs. VGS  
Figure 5: RDS(ON) vs. ID  
Figure 6: Normalized RDS(on) vs. Temperature  
03  

P-Ch 30V Fast Switching MOSFETs  
3401A  
P-Channel Typical
 
Performance Characteristics  
Figure7:Capacitance  
Figure 8: Safe Operating Area  
Figure9:Normalized Maximum Transient Thermal Impedance  
Figure10:Switching Time Waveform  
Figure 11: Gate Charge Waveform  
04  

P-Ch 30V Fast Switching MOSFETs  
3401A  
N
P
–
a
C
c
h
k
a
a
n
g
n
e
e
M
l
e
T
c
y
h
p
a
i
n
c
i
a
c
l
a
P
l
D
e
a
r
f
t
o
a
r
–
m
S
O
a
T
n
–
c
2e
3
C
haracteristics  
05