HL-3415

Part #HL-3415
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HL-3415
P-CH 20V Fast Switching MOSFETs  
3
4
1
5
Green Device Available  
Super Low Gat
e
C
harge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
Product Summary  
BVDSS  
RDSON  
ID  
-20V  
30mΩ  
-4.1A  
Description  
SOT23 Pin Configuration  
The 3415
 
is the high cell density trenched
 
p-ch  
MOSFETs, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
The 3415 meet the RoHS and Green Product  
requirement with
 
full function
 
reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
V
V
DSS  
GSS  
Drain-Source Voltage  
Gate-Source Voltage  
20  
±12  
-4.1  
-2.6  
-16  
1
V
V
T
C
= 25
℃
 
A
A
A
W
I
D  
Continuous Drain Current  
T
C
= 100
℃  
I
DM  
P
D  
Pulsed Drain Current

note1  

Power Dissipation  
Thermal Resistance, Junction to Case  
Operating and Storage Temperature Range  
T
C
= 25
℃  
R
θ
JC  
125  
℃
/W  
℃
T
J
, T

STG  

-55 to +175  
01  

P-CH 20V Fast Switching MOSFETs  
3415  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristic  
—  
—  
Source Breakdown Voltage  
V
V

GS

=0V , I

D

=-250uA  
V

(BR)DSS  

Drain  
-20  
V
I

DSS  

Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  

DS

= -20V V

GS

= 0V  
—  
—  
—  
-1.0  
±100  
μA  
nA  
I

GSS  

—  
V
DS
=0V, V
GS
= ±12V  
On Characteristics  
V
GS(th)  
-0.7  
30  
Gate Threshold Voltage  
-0.4  
—  
-1.0  
38  
V
V
DS
=V
GS
, I
D
=250μA  
V
GS
=-4.5V, I
D
=-4.1A  
V
GS
=-2.5V, I
D
=-3A  
Static Drain-Source on-Resistance  
mΩ  
Dynamic Chara

n

c

o

t

t

e

e
2

ristics  
R
DS(on)  
—  
38  
53  
C
iss  
C
oss  
C
rss  
Q
g  
Input Capacitance  
—  
830  
132  
85  
—  
Output Capacitanc
e
–  
V

DS

=-10V, V
GS
=0V, f=1.0MHz  
V

DS

=-10V, I
D
=-2A, V
GS
=-4.5V  
pF  
nC  
Reverse Transfer Capacitance  
Total Gate Charge  
—  
—  
—  
—  
—  
—  
—  
—  
8.8  
1.4  
1.9  
Q
gs  
Q
gd  
Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
Switching Characteristics  
10  
t
d(on)  
t
r  
Turn-on Delay Time  
—  
—  
V

DS

=-10V,I
D
=-3.3A,R
GEN
=1Ω,  
V

GS

=-4.5V  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
32  
50  
51  
ns  
t
d(off)  
—  
—  
—  
—  
t
f  
Drain-Source Diode Characteristics and Maximum Ratings  
-4.1  
-16  
I

S  

—  
—  
—  
—  
—  
—  
Maximum Continuous Drain to Source Diode Forward Current  
A
A
V
I

SM  

V
SD  
Maximum Pulsed Drain to Source Diode Forward Current  
Drain to Source Diode Forward Voltage  
V

GS

=0V, I
S
=-4.1A  
-1.2  
Notes:1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature  
2.Pulse Test: Pulse Width≤300μs, Duty Cycle≤2%  
02  

P-Ch 20V Fast Switching MOSFETs  
3415  
Typical Performance Characteristics  
Figure1: Output Characteristics  
Figure 2: Typical Transfer Characteristics  
Figure 3:On-resistance vs. Drain Current  
Figure 5: Gate Charge Characteristics  
Figure 4: Body Diode Characteristics  
Figure 6: Capacitance Characteristics  
03  

P-CH 20V Fast Switching MOSFETs  
3415  
Typical Performance Characteristics  
Figure 7: Normalized Breakdown Voltage vs. Junction
T
F
e
i
m
g
u
p
r
er
8
a
:
t
u
N
r
o
e
r
malized on Resistance vs. Junctio  
Figure 9: Maximum Safe Operating Area  
FFigure 10: Maximum Continuous Drain Curr  
Figure.11: Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
04  

P-CH 20V Fast Switching MOSFETs  
3415  
Package Mechanical Data-SOT-23  
DIMENSIONS  
DIMENSIONS ( unit : mm )  
Symbol  
A
Min  
0.9  
0.3  
2.8  
T
y
p  
1.01  
0.42  
2.92  
1.9  
Max  
1.15  
0.5  
3
Symbol  
Min  
0.01  
0.08  
1.2  
—  
T
y
p  
0.05  
0.13  
1.33  
0.95  
0.42  
0.2  
Max  
0.1  
0.15  
1.4  
—  
A
1
b
p  
c
D
e
E
—  
—  
—  
e
1
H
E
2.25  
0.45  
2.4  
2.55  
0.55  
—  
L
p  
0.3  
—  
0.5  
—  
Q
w
0.49  
0.1  
v
05