HL-3419

Part #HL-3419
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HL-3419
P-Ch 30V Fast Switching MOSFETs  
3
4
1
9
Green Device Available  
Super Low Gat
e
C
harge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
Product Summary  
BVDSS  
RDSON  
ID  
-30V  
16mΩ  
-32A  
100% EAS Guaranteed  
Description  
PDFN 3*3 Pin Configuration  
The 3419
 
is the high cell density trenched
 
P-ch  
MOSFETs, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
The 3419
 
meet the RoHS and Green Product  
requirement 100%
 
EAS guaranteed with  
full function reliability approved.  
Absolute Maximum Ratings (TA=25℃ unless otherwise specified)  
Rating  
Symbol  
Parameter  
Units  
10s  
Steady State  
V
DS  
Drain-Source
V
o
ltage  
-30  
±
20  
-32  
V
V
Gate-Sou
r
ce Voltage  
V
GS  
Continuous Drain Current,
V

GS

@ -10
V

1  

Continuous Drain Current,
V

GS

@ -10
V

1  

I
D
@T
C  
=25
℃
 
A
I
D
@T
C  
=100
℃  
-20  
A
I
DM  
Pulsed Drain Current  
2
-65  
A
EAS  
Single Pulse
A
v
a
lanche Energy  
3
72.2  
mJ  
A
I
AS  
Av
a
lanche Current  
-38  
P
D
@T  
C
=25
℃  
Total Power Dissipation  
4
29  
W
℃
℃
T
STG  
Storage Temperature Range  
-55 to 150  
-55 to 150  
T
J
Operating Junction Temperature Range  
Thermal Data  
Symbol  
Parameter  
Thermal Resistance Junction-
A
m
bient

1  

Typ.  
Max.  
75  
Unit  
—  
℃
/W  
R
θ
JA  
01  

P-Ch 30V Fast Switching MOSFETs  
3
4
1
9
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
Conditions  
Min.  
-30  
—  
—  
—  
-1  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown
V
o
ltage  
BV

DSS

Temperature Coefficient  
V

GS

=0
V
, I  
D
=-250uA  
△
BV

DSS

/
△
T  
J
Reference to 25
℃
, I  

GS

=-10V , I
 
=-15A  

GS

=-4.5
V
, I
 
=
-10A  
D
=-1mA  
-0.022  
16  
—  
V/
℃  
V
D
20  
32  
-2.5  
—  
R
DS(ON)  
Static Drain-Source On-Resistance  
Gate Threshold
V
o
ltage  
2
m
Ω
 
V
D
22  
V
GS(th)  
—  
V
V

GS

=V

DS

, I
 
=-250uA  
D
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
4.6  
—  
m
V
/
℃  
V

DS

=-24V ,
V

GS

=0
V
,
T
J
=25
℃  
-1  
I
DSS  
Drain-Source Leakage Current  
uA  
V

DS

=-24V ,
V

GS

=0
V
,
T
J
=55
℃  
—  
-5  
I
GSS  
Gate-Source Leakage Current  
Gate Resistance  
V

GS

=
±
25
V
,
V

DS

=0V  

DS

=0
V
,
V

GS

=0V , f=1MHz  
—  
±
100  
—  
nA  
R
g
V
13  
Ω
Q
g
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
52  
—  
Q
gs  
gd  
V

DS

=-15V ,
V

GS

=-4.5V , I  
D
=-15A  
9.8  
8.3  
13  
—  
nC  
ns  
Q
—  
T
d
(
o
n)  
—  
T
r
15  
—  
V

DD

=-15
V
,
V

GS

=-10V , R  
G
=3.3
Ω
,  
I
D
=-15A  
T
d
(
o
ff)  
Turn-Off Delay Time  
Fall Time  
198  
98  
—  
T
f
—  
C
iss  
oss  
rss  
Input Capacitance  
1150  
150  
134  
—  
C
C
Output Capacitance  
Re
v
e
rse Transfer Capacitance  
V

DS

=-15V , V

GS

=0
V
,
f
=1MHz  
—  
pF  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
—  
Typ.  
—  
Max.  
-32  
Unit  
A
I
S  
Continuous Source Current
1,5  
Pulsed Source Current

2,5  

V
G
=V
D  
=0
V
,
F
orce Current  
I
SM  
—  
—  
-65  
A
V
SD  
Diode Forward
V
o
ltage  
2
V

GS

=0
V
, I  
S
=-1A , T  
J
=25
℃
 
—  
—  
-1.2  
V
Note :  
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=-25V,V
GS
=-10V,L=0.1mH,I
AS
=-38A  
4.The power dissipation is limited by 150℃ junction temperature  
5.The data is theoretically the same as I

D

and I
DM
, in real applications , should be limited by total power dissipation.  
02  

P-Ch 30V Fast Switching MOSFETs  
3
4
1
9
Typical Performance Characteristics  
Figure1: Output Characteristics  
Figure 2: On-Resistance v.s Gate-Source  
Figure 3:Forward Characteristics of Reverse  
Figure 5: Normalized VGS(th) vs. TJ  
Figure 4: Gate-Charge Characteristics  
Figure 6: Normalized RDSON vs. TJ  
03  

P-Ch 30V Fast Switching MOSFETs  
3
4
1
9
Typical Performance Characteristics  
Figure 7: Capacitance  
Figure 8:Safe Operating Area  
Figure 9: Normalized Maximum Transient Thermal Impedance  
Figure 11: Unclamped Inductive Switching Wav  
Figure 10: Switching Time Waveform  
04  

P-Ch 30V Fast Switching MOSFETs  
3
4
1
9
Package Mechanical Data-SOP-8  
Test Circuit  
Package Mechanical Data-SOP-8  
05  

P-Ch 30V Fast Switching MOSFETs  
3
4
1
9
PDFN3*3-8L Package Information  
MILLMETER  
Symbol  
MIN  
MON  
0.80  
MAX  
A
A1  
b
0.70  
0.00  
0.24  
0.10  
3.25  
3.05  
2.40  
3.00  
1.35  
0.90  
0.05  
0.35  
0.20  
3.40  
3.25  
2.60  
3.20  
1.55  
0.03  
0.30  
c
0.15  
D
3.32  
D1  
D2  
E
3.15  
2.50  
3.10  
E1  
e
1.45  
0.65BSC.  
3.30  
H
3.20  
0.30  
0.10  
3.40  
0.50  
0.20  
L
0.40  
L1  
L2  
0.15  
1.13REF.  
06