HL-40N05

Part #HL-40N05
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HL-40N05
N-Ch 40V Fast Switching MOSFETs  
40
N
0
5
Product Summary  
Super Low Gate Charge  
Green Device Available  
Excellent CdV/dt effect decline  
BVDSS  
RDSON  
ID  
100% EAS Guaranteed  
40V  
19mΩ  
7A  
Advanced Trench MOS Technology  
SOT-23-3L  
Description  
ption  
The 40N05 is the high cell density trenched  
N ch MOSFETs, which provide excellent RDSON  
and gate charge for most of the synchronous  
buck converter applications.  
The 40N05 meet the RoHS and Green Product  
requirement, 100% EAS guaranteed with full  
function reliability approved.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Units  
V
Drain-Source
V
o
ltage  
40  
V
DS  
Gate-Sou
r
ce Voltage  
Continuous Drain Current,
V
GS
@ 10
V

1  

Continuous Drain Current,
V
GS
@ 10
V

1  

±
20  
V
V
GS  
7
A
I
D
@T
C  
=25
℃
 
4
A
I
D  
@T
C  
=100
℃  
Pulsed Drain Current  
2
32.8  
A
I
DM  
Single Pulse
A
v
a
lanche Energy  
3
13  
2
mJ  
A
EAS  
Av
a
lanche Current  
I
AS  
Total Power Dissipation  
4
73  
W
℃
℃
P
D
@T =25
℃  
C
Storage Temperature Range  
-55 to 150  
-55 to 150  
T
STG  
Operating Junction Temperature Range  
T
J  
01  

N-Ch 40V Fast Switching MOSFETs  
40N05  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
Test condition  
Min.  
Typ.  
Max.  
Units  
Off Characteristic  
40  
V
(BR)DSS  
DSS  
GSS  
Drain-Source Breakdown Voltage
 
V
GS
=0V, I  
D
=250
μ
A  
–
–
–
–
1
V
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
V

DS

=40V, V

GS

=0V  
DS
=0V, V
GS
=±20V  
I
–
μ
A  
nA  
I
V
–
±100  
On Characteristics  
1
–
–
1.5  
19  
25  
2.5  
24  
35  
V
GS(th)  
Gate Threshold Voltage  
Static Drain-Source on-  
Resistance

note3  

V
V
V
DS
=V
GS
, I  

GS

=10V, I  

GS

=4.5V, I  
D
=250
μ
A  
V
m
Ω  
m
Ω  
D
=8A  
=5A  
R
DS(on)  
D
Dynamic Characteristics  
633  
67  
C
iss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
–
–
–
–
–
–
–
–
–
–
–
–
pF  
pF  
pF  
nC  
nC  
nC  
C
oss  
V
DS
=20V, V
GS
=0V, f=1.0MHz  
58  
C
rss  
12  
Q
Q
Q
g
3.2  
3.1  
gs  
gd  
V

DS

=20V, I =8A, V

GS

=10V  
D
Switching Characteristics  
4
3
t
d(on)  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
–
–
–
–
–
–
–
–
ns  
ns  
ns  
ns  
t
r
V
DD
= 20V, R  
L
=2.5
Ω  
15  
2
t
d(o
f
f)  
V

GS

=10V,R

REN

=3
Ω  
t
f
Drain-Source Diode Characteristics and Maximum Ratings  
7
I
S
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
Drain to Source Diode Forward  
–
–
–
–
A
A
32  
I
SM  
1.2  
V
SD  
V
GS
=0V, I
S
= 8A  
–
–
V
Voltage  
Notes:  
1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature  
2. EAS condition : T

J

=25℃,V
DD
=20V,V
G
=10V,L=0.5mH,Rg=25Ω,IAS=7.2A  
T

J

=25℃,V
DD
=-20V,V
G
= -10V,L=0.5mH,Rg=25Ω,IAS=-8.4A  
3. Pulse Test: Pulse Width≤300μs, Duty Cycle≤2%  
02  

N-Ch 40V Fast Switching MOSFETs  

40N05  
Typical Electrical and Thermal Characteristics (Curves)  
Figure1: Output Characteristics  
Figure 2: Typical Transfer Characteristics  
Figure 3:On-resistance vs. Drain Current  
Figure 5: Gate Charge Characteristics  
Figure 4: Body Diode Characteristics  
Figure 6:Capacitance Characteristics  
03  

N-Ch 40V Fast Switching MOSFETs  

4
0
N
0
5
Typical Performance Characteristics  
Figure 7:Normalized Breakdown Voltage vs.  
Figure 8: Normalized on Resistance vs.  
Junction Temperature  
Junction Temperature  
Fig
u
F
r
F
e
i
g
1u0
r
:e
M
1
a
0
x
:
i
M
m
aux
m
i
m
Cuo
m
n
t
C
i
n
o
u
n
o
t
i
u
n
s
u
D
o
r
u
a
s
i
n
D
r
C
au
i
n
rr
C
e
n
u
t
rr  
vs. Ambient Temperature  
Figure 9:Maximum Safe Operating Areaedance  
Figure 11:Maximum Effective  
Transient Thermal Impedance, Junction-to-Ambient  
04  

N-Ch 40V Fast Switching MOSFETs  
40N05  
Package Mechanical Data-SOT-23-3L  
05