HL-S40N06D

Part #HL-S40N06D
Download 
HL-S40N06D
N-Ch 60V Fast Switching MOSFETs  
S40N06D  
Product Summary  
Features  
Green Device Available  
Super Low Gat
e
C
harge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
BVDSS  
60V  
RDSON  
12m
Ω
 
ID  
40A  
100% EAS Guaranteed  
Applications  
PDFN3*3 Pin Configuration  
The S40N06D
 
is the high cell density trenched
 
N-ch  
MOSFETs, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
The S40N06D
 
meet the RoHS and Green Product,  
requirement 100%
 
EAS guaranteed with  
full function reliability approved.  
Absolute Maximum Ratings  
Max.  
Unit  
Symbol  
Parameter  
V
DSS  
GSS  
Drain-Source Voltage  
Gate-Source Voltage  
60  
±20  
V
V
V
T
T
C
C
= 25
℃
 
= 100
℃  
40  
20  
150  
36  
30  
A
A
A
mJ  
W
I
D
Continuous Drain Current  
Pulsed Drain Current

note1  

I
DM  
E
Single Pulsed
A
v
a
lanche Energy

note2  

AS  
P
D
Power Dissipation  
T
C
= 25
℃  
R
θ
JC  
Thermal Resistance, Junction to Case  
Operating and Storage Temperature Range  
2.5  
-55 to +175  
℃
/W  
℃
T
J
, T
STG  
01  

N-Ch 60V Fast Switching MOSFETs  
S40N06D  
Electrical Characteristics (T

J

=25 ℃ unless otherwise specified)  
Symbol  
Parameter  
Test condition  
Min.  
Typ.  
Max.  
Units  
Off Characteristic  
V
(BR)DSS  
DSS  
GSS  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
V
V
V

GS

=0V, I  
DS
=60V, V
GS
=0V,  

DS

=0V, V

GS

= ±20V  
D
=250
μ
A  
60  
–
–
–
–
–
–
1
V
μ
A  
nA  
I
I
±100  
On Characteristics  
V
GS(th)  
Gate Threshold Voltage  
V
V
V

DS

=V

GS

, I  

GS

=10V, I  
GS
=4.5V, I  
D
=250
μ
A  
1
–
–
1.6  
12  
15  
2.5  
15  
20  
V
Static Drain-Source on-Resistance  
D
=20A  
=10A  
R
DS(on)  
m
Ω  
note3  
D
Dynamic Characteristics  
C
iss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain(“Miller”) Charge  
–
–
–
–
–
–
930  
230  
8
22  
4.5  
3.5  
–
–
–
–
–
–
pF  
pF  
pF  
nC  
nC  
nC  
V
DS
=25V, V
GS
=0V,  
C
oss  
f=1.0MHz  
C
rss  
Q
Q
Q
g
V
DS
=30V, I =20A,  
D
gs  
V

GS

=10V  
gd  
Switching Characteristics  
t
d(on)  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
–
–
–
–
4.5  
2.7  
13.8  
2.7  
–
–
–
–
ns  
ns  
ns  
ns  
t
r
V
R
DD
=30V, I =20A,  
D
t
d(o
f
f)  
G
=1.6
Ω
, V

GS

=10V  
t
f
Drain-Source Diode Characteristics and Maximum Ratings  
I
S
Maximum Continuous Drain to Source Diode Forward
 
Current  
Maximum Pulsed Drain to Source Diode Forward Current  
–
–
–
–
–
–
–
–
18  
12  
40  
150  
1.2  
–
A
A
V
ns  
nC  
I
SM  
SD  
rr  
rr  
V
Drain to Source Diode Forward Voltage  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
V
T
J  
GS
=0V, I  
=25
℃
 
I
F
=20A,dI/dt=100A/
μ
s  
S
=30A  
t
,
Q
–
Note :  
1.Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature  
2.EAS condition: T

J

=25℃, V
DD
=30V, VG=10V, RG=25Ω, L=0.5mH, IAS=12A  
3.Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%  
02  

N-Ch 60V Fast Switching MOSFETs  
S40N06D  
Typical Electrical and Thermal Characteristics (Curves)  
Figure1: Typical Output Characteristics  
Figure 2:Transfer Characteristics  
Figure 2 Transfer Characteristics  
Curr  
Figure 3:On-resistance vs. Drain Current  
Figure 5:
 
Gate Charge Characteristics  
Figure 4:
 
Body Diode Characteristics  
Figure 6: Capacitance Characteristicsature  
03  

N-Ch 60V Fast Switching MOSFETs  
S40N06D  
Typical Performance Characteristics  
Figure 7:
 
Normalized Breakdown Voltage vs. Junction
T
F
e
i
g
m
u
p
r
e
e
r
8
a
:
t
N
u
o
r
e
rmalized on Resistance vs. Junction  
Fig
u
F
r
F
e
i
g
1u0
r
:
e
M
1
a
0
x:
i
m
M
a
u
x
m
i
m
C
u
o
m
n
t
i
C
n
o
u
n
o
t
u
i
n
s
u
Do
r
u
a
s
i
n
D
C
r
a
u
i
r
n
r
e
Curr  
Figure 9: Maximum Safe Operating Area  
Figure 11:Maximum Effective  
ce  
04  

N-Ch 60V Fast Switching MOSFETs  
S40N06D  
PDFN3*3-8L Package Information  
0
0
5
5