HUASHUO-HSBA060N10

Part #HUASHUO-HSBA060N10
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HUASHUO-HSBA060N10
HSBA060N10  
N-Ch 100V Fast Switching MOSFETs  
Product Summary  
Description  
The HSBA060N10 is the high cell density trenched  
N-ch MOSFE
T
s
, which provide excellent RDSON  
and gate charge for most of the Synchronous  
Rectification for AC/DC Quick Charger.  
V
DS  
100  
4.6  
86  
V
R
DS(ON),TYP  
m
Ω  
A
I
D  
PRPAK5X6 Pin Configuration  
⚫
100% EAS Guaranteed  
⚫
Low R
DS(ON)  
⚫
Low Gate Charge  
⚫
RoHs and Halogen-Free Compliant  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Units  
V
DS  
V
GS  
Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
100  
±
20  
86  
V
V
I
D
@T
C
=25
℃  
I
D
@T
C
=70
℃  
I
DM  
Continuous Drain Current
1,6  
Continuous Drain Current
1,6  
Pulsed Drain Current
2  
A
55  
A
145  
A
EAS  
Single Pulse Avalanche Energy
3  
Avalanche Current  
16  
mJ  
A
I
AS  
18  
P
D
@T
C
=25
℃  
T
STG  
Total Power Dissipation
4  
Storage
T
e
mperature Range  
89  
W
℃
℃
-55 to 150  
T
J  
Operating Junction Temperature Range  
-55 to 150  
Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
—  
Thermal Resistance Junction-Ambient
1
(t
≦
10s)  
23  
50  
℃
/W  
℃
/W  
℃
/W  
R
θ
JA  
R
θ
JC  
Thermal Resistance Junction-Ambient
1  
Thermal Resistance Junction-Case
1  
—  
—  
1.4  
1
V
e
r 2.0  

HSBA060N10  
N-Ch 100V Fast Switching MOSFETs  
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V
GS
=0V , I
D
=250uA  
Min.  
100  
—  
—  
1
Typ.  
—  
Max.  
—  
6
Unit  
BV
DSS  
Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance
2  
Static Drain-Source On-Resistance
2  
Gate Threshold Voltage  
V
V
GS
=10V , I
D
=20A  
4.6  
6.6  
2
R
DS(ON)  
m
 
V
V
GS
=4.5V , I
D
=20A  
8.6  
3
V
GS(th)  
I
DSS  
V
GS
=V
DS
, I
D
=250uA  
V
DS
=80V , V
GS
=0V , T
J
=25
℃  
V
DS
=80V , V
GS
=0V , T
J
=55
℃  
V
GS
=
±
20V , V
DS
=0V  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
1
Drain-Source Leakage Current  
uA  
—  
5
I
GSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
nA  
S
V
DS
=5V , I
D
=20A  
3.1  
1.7  
60  
Rg  
Vgs=0V, Vds=0V,f=1MHz  
Qg  
T
o
tal Gate Charge (10V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
V
DS
=50V , V
GS
=10V , I
D
=20A  
nC  
ns  
Qgs  
Qgd  
Td(on)  
Tr  
8
15  
11  
V
DD
=50V , V
GS
=10V , R
G
=3
,  
20  
I
D
=1A  
Td(off)  
Tf  
Turn-Off Delay Time  
Fall Time  
45  
23  
Ciss  
Coss  
Crss  
Input Capacitance  
3010  
539  
20  
V
DS
=50V , V
GS
=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V
G
=V
D
=0V , Force Current  
V
GS
=0V , I
S
=1A , T
J
=25
℃  
I
F
=20A , di/dt=100A/µs ,  
T
J
=25
℃  
Min.  
—  
Typ.  
—  
Max.  
86  
Unit  
A
I
S  
V
SD  
t
rr  
Continuous Source Current
1,5,6  
Diode Forward Voltage
2  
—  
—  
1.1  
—  
V
Reverse Recovery Time  
Reverse Recovery Charge  
—  
55  
nS  
nC  
Q
rr  
—  
108  
—  
Note :  
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V
DD
=25V,V
GS
=10V,L=0.1mH,I
AS
=18A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.  
6.The maximum current rating is package limited.  
2
V
e
r 2.0  

HSBA060N10  
N-Ch 100V Fast Switching MOSFETs  
Typical Characteristics  
3
V
e
r 2.0  

HSBA060N10  
N-Ch 100V Fast Switching MOSFETs  
4
V
e
r 2.0  

HSBA060N10  
N-Ch 100V Fast Switching MOSFETs  
5
V
e
r 2.0  

HSBA060N10  
N-Ch 100V Fast Switching MOSFETs  
PRPAK5X6 Package Outline Dimensions  
6
V
e
r 2.0