HUASHUO-HSM0026

Part #HUASHUO-HSM0026
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HUASHUO-HSM0026
HSM0026  
N-Ch 100V Fast Switching MOSFETs  
Description  
Product Summary  
The HSM0026 is the high cell density trenched N-  
ch MOSFE
T
s
, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
V

DS  

100  
20  
V
R

DS(ON),max  

I

D  

mΩ  
A
7.5  
The HSM0026 meet the RoHS and Green Product  
requirement, 100% EAS guaranteed with full  
function reliability approved.  
SOP8 Pin Configuration  
l
Green Device Available  
l
Super Low Gate Charge  
l
Excellent Cdv/dt effect decline  
l
Advanced high cell density Trench  
technology  
( 5,6,7,8 )  
( 4 )  
( 1,2,3 )  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Units  
V

DS  

V

GS  

Drain-Source Voltage  
100  
V
V
Gate-Sou
r
ce Voltage  
±
20  
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

7.5  
A
6
40  
A
A
EAS  
Single Pulse Avalanche Energy

3  

16  
mJ  
A
I

AS  

Avalanche Current  
18  
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

4  

2.5  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
Parameter  
Typ.  
—  
Max.  
50  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1

(t
≦
10S)  
Thermal Resistance Junction-ambient

1

(Steady State)  
R

θJA  

—  
85  
V
e
r 2.0  

HSM0026  
N-Ch 100V Fast Switching MOSFETs  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
100  
—  
—  
—  
1.2  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=1mA  
V

GS

=10V , I

D

=7A  
0.08  
16  
—  
V/
℃  
20  
25  
2.5  
—  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
Ω
 
V

GS

=4.5V , I

D

=5A  
19  
V

GS(th)  

Gate Threshold Voltage  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
-5.5  
—  
mV/
℃  
V

DS

=80V , V

GS

=0V , T

J

=25
℃  
V

DS

=80V , V

GS

=0V , T

J

=55
℃  
10  
100  
±
100  
—  
I

DSS  

Drain-Source Leakage Current  
uA  
—  
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
nA  
S
V

DS

=5V , I

D

=7A  
24  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
1.6  
36  
—  
Ω
Q

g  

Total Gate Charge (10V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
—  
V

DS

=80V , V

GS

=10V , I

D

=7A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

5
—  
10  
—  
11.5  
29  
—  
V

DD

=50V , V

GS

=10V , R

G

=3.3
Ω  
—  
I

D

=7A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
42  
—  
18  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
1930  
245  
125  
—  
V

DS

=15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
7
Unit  
A
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source Current

1,6  

Pulsed Source Current

2,6  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
40  
1.2  
—  
A
—  
—  
V
—  
48  
29  
nS  
nC  
I
F
=7A , dI/dt=100A/µs , T

J

=25
℃  
Q

rr  

—  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=25V,V

GS

=10V,L=0.1mH  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
V
e
r 2.0  

HSM0026  
N-Ch 100V Fast Switching MOSFETs  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. Gate-Source  
V

DS

=80  
V
I

D

=7A  
Q

G

,
T
o
tal Gate Charge (nC)  
Fig.4 Gate-Charge Characteristics  
Fig.3 Forward Characteristics Of Reverse  
Fig.5 Normalized V

GS(th)

vs. T

J  

Fig.6 Normalized R

DSON

vs. T

J  

V
e
r 2.0  

HSM0026  
N-Ch 100V Fast Switching MOSFETs  
100us  
1ms  
10m  
100  
T

A

=25

o

C  
D
V

DS

(V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.01  
P

DM  

T

ON  

0.01  
T
D =
T

ON

/T  
SINGLE  
T

Jpeak

=
T

C

+P

D
M

XR

θJC  

0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
V

DS  

90%  
10%  
V

GS  

T

d(on)  

T

r  

T

d(off)  

T

f  

T

off  

T

on  

Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Switching  
V
e
r 2.0  

HSM0026  
N-Ch 100V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
Packaging  
HSM0026  
SOP-8  
2500/Tape&Reel  
V
e
r 2.0