HUASHUO-HSM4062
| Part # | HUASHUO-HSM4062 |
Download  | HUASHUO-HSM4062 |
HSM4062
N-Ch 40V Fast Switching MOSFETs
Features
Product Summary
⚫
Advanced Trench MOS Technology
Low Gate Charge
V
DS
40
V
⚫
⚫
⚫
R
DS(ON),typ
12.5
m
Ω
100% EAS Guaranteed
Green Device Available
I
D
9.5
A
Applications
⚫
⚫
⚫
Power Management Functions
DC-DC Converters.
Backlighting.
SOP8 Pin Configuration
Absolute Maximum Ratings
Symbol
V
DS
Parameter
Rating
40
Units
V
Drain-Source Voltage
Gate-Sou
r
ce Voltage
V
GS
±
20
9.5
V
I
D
@T
A
=25
℃
Continuous Drain Current, V
GS
@ 10V
1
Continuous Drain Current, V
GS
@ 10V
1
Pulsed Drain Current
2
A
I
D
@T
A
=70
℃
7.5
A
I
DM
40
A
EAS
Single Pulse Avalanche Energy
3
Avalanche Current
14.5
17
mJ
A
I
AS
P
D
@T
A
=25
℃
T
STG
Total Power Dissipation
4
2
W
℃
℃
Storage
T
e
mperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
T
J
Thermal Data
Symbol
R
θ
JA
Parameter
Typ.
Max.
60
Unit
℃
/W
℃
/W
Thermal Resistance Junction-ambient (Steady State)
1
Thermal Resistance Junction-Case
1
—
—
R
θ
JC
32
V
e
r 2.0
1
HSM4062
N-Ch 40V Fast Switching MOSFETs
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
BV
DSS
Parameter
Conditions
V
GS
=0V , I
D
=250uA
Min.
40
—
—
—
1.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
—
Max.
—
Unit
V
Drain-Source Breakdown Voltage
BVDSS Temperature Coefficient
△
BV
DSS
/
△
T
J
Reference to 25
℃
, I
D
=1mA
V
GS
=10V , I
D
=8A
0.034
12.5
19
—
V/
℃
15
23
2.4
—
R
DS(ON)
Static Drain-Source On-Resistance
2
m
V
GS
=4.5V , I
D
=6A
V
GS(th)
Gate Threshold Voltage
1.7
-5.64
—
V
V
GS
=V
DS
, I
D
=250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
mV/
℃
V
DS
=32V , V
GS
=0V , T
J
=25
℃
V
DS
=32V , V
GS
=0V , T
J
=55
℃
V
GS
=
±
20V , V
DS
=0V
1
I
DSS
Drain-Source Leakage Current
uA
—
5
I
GSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
—
±
100
—
nA
S
V
DS
=5V , I
D
=8A
30
R
g
V
DS
=0V , V
GS
=0V , f=1MHz
2.1
3.8
2.8
1.1
12.2
5.3
18
—
Q
g
Total Gate Charge (4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
—
V
DS
=32V , V
GS
=4.5V , I
D
=6A
nC
ns
Q
gs
Q
gd
T
d(on)
T
r
—
—
—
V
DD
=20V , V
GS
=10V , R
G
=3.3
—
I
D
=1A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
9
—
C
iss
C
oss
C
rss
Input Capacitance
376
240
19
—
V
DS
=15V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
—
—
Diode Characteristics
Symbol
Parameter
Conditions
V
G
=V
D
=0V , Force Current
V
GS
=0V , I
S
=1A , T
J
=25
℃
Min.
—
Typ.
—
Max.
9.5
40
Unit
A
I
S
I
SM
V
SD
t
rr
Continuous Source Current
1,5
Pulsed Source Current
2,5
Diode Forward Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
—
—
A
—
—
1.2
—
V
—
20
35
nS
nC
IF=6A, dI/dt=100A/us, T
J
=25
℃
Q
rr
—
—
Note :
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The EAS data shows Max. rating . The test condition is V
DD
=25V,V
GS
=10V,L=0.1mH,I
AS
=17A
4.The power dissipation is limited by 150
℃
junction temperature
5.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
V
e
r 2.0
2
HSM4062
N-Ch 40V Fast Switching MOSFETs
Typical Characteristics
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs. G-S Voltage
Fig.4 Gate-Charge Characteristics
Fig.3 Forward Characteristics of Reverse
Fig.5 Normalized V
GS(th)
vs. T
J
Fig.6 Normalized R
DSON
vs. T
J
V
e
r 2.0
3
HSM4062
N-Ch 40V Fast Switching MOSFETs
Fig.7 Capacitance
Fig.8 Safe Operating Area
Fig.9 Normalized Maximum Transient Thermal Impedance
1
2
BV
DSS
BV
DSS
-V
DD
EAS=
BV
DSS
L x I
AS
2
x
V
DS
90%
V
DD
I
AS
10%
V
GS
T
d(on)
T
r
T
on
T
d(off)
T
f
T
off
V
GS
Fig.10 Switching Time Waveform
Fig.11 Unclamped Inductive Switching
V
e
r 2.0
4
HSM4062
N-Ch 40V Fast Switching MOSFETs
Ordering Information
Part Number
Package code
Packaging
HSM4062
SOP-8
4000/Tape&Reel
V
e
r 2.0
5
