HUASHUO-HSM4113

Part #HUASHUO-HSM4113
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HUASHUO-HSM4113
HSM4113  
P-Ch 40V Fast Switching MOSFETs  
Description  
Product Summary  
The HSM4113 is the high cell density trenched P-  
ch MOSFE
T
s
, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
V

DS  

-40  
40  
V
R

DS(ON),max  

I

D  

m
Ω  
A
-7.5  
The HSM4113 meet the RoHS and Green Product  
requirement, 100% EAS guaranteed with full  
function reliability approved.  
⚫
100% EAS Guaranteed  
Green Device Available  
Super Low Gate Charge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
SOP8 Pin Configuration  
⚫
⚫
⚫
⚫
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
-40  
Units  
Drain-Source Voltage  
V
V
V

GS  

±
20  
Gate-Sou
r
ce Voltage  
I

D

@T

C

=25
℃  
Continuous Drain Current, -V

GS

@ -10V

1  

Continuous Drain Current, -V

GS

@ -10V

1  

Pulsed Drain Current

2  

-7.5  
A
I

D

@T

C

=100
℃  
-5.7  
A
I

DM  

-15  
A
EAS  
Single Pulse Avalanche Energy

3  

36  
mJ  
A
I

AS  

P

D

@T

C

=25
℃  
T

STG  

Avalanche Current  
-27.2  
3.1  
Total Power Dissipation

4  

W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
R

θ
JA  

Parameter  
Typ.  
Max.  
85  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-Ambient

1  

Thermal Resistance Junction-Case

1  

—  
—  
R

θ
JC  

40  
V
e
r 2.1  
1

HSM4113  
P-Ch 40V Fast Switching MOSFETs  
P-Channel Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=-250uA  
Min.  
-40  
—  
—  
—  
-1.0  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
J
BV

DSS

Temperature Coefficient  
△
BV

DSS

/
△
T  
Reference to 25
℃
, I

D

=-1mA  
V

GS

=-10V , I

D

=-6A  
-0.012  
—  
—  
V/
℃  
40  
70  
-2.5  
—  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
 
V

GS

=-4.5V , I

D

=-3A  
—  
V

GS(th)  

Gate Threshold Voltage  
—  
V
V

GS

=V

DS

, I

D

=-250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
4.32  
—  
mV/
℃  
V

DS

=-32V , V

GS

=0V , T

J

=25
℃  
V

DS

=-32V , V

GS

=0V , T

J

=55
℃  
1
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=-5V , I

D

=-6A  
12  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
13  
—  
Q

g  

Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
9
—  
V

DS

=-20V , V

GS

=-4.5V , I

D

=-6A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

2.54  
3.1  
19.2  
12.8  
48.6  
4.6  
1004  
108  
80  
—  
—  
—  
V

DD

=-15V , V

GS

=-10V , R

G

=3.3
,  
—  
I

D

=-1A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
V

DS

=-15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=-1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
-7.5  
-15  
-1  
Unit  
A
I

S  

Continuous Source Current

1,5  

Pulsed Source Current

2,5  

Diode Forward Voltage

2  

I

SM  

V

SD  

—  
—  
A
—  
—  
V
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=-25V,V

GS

=-10V,L=0.1mH,I

AS

=-27.2A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
V
e
r 2.1  
2

HSM4113  
P-Ch 40V Fast Switching MOSFETs  
P-Channel Typical Characteristics  
60  
55  
50  
45  
40  
35  
30  
12  
I

D

=-6A  
V

GS

=-10V  
10  
V

GS

=-7V  
V

GS

=-5V  
8
6
V

GS

=-4.5V  
4
V

GS

=-3V  
2
0
0
0.5  
1
1.5  
2
2
4
6
8
10  
-V

DS

Drain-to-Source Voltage (V)  
-V

GS

(V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance v.s Gate-Source  
10  
12  
10  
8
V

DS

=-20V  
I

D

=-6A  
8
6
4
2
0
6
T

J

=150
℃
 
T

J

=25
℃  
4
2
0
0
6
12  
18  
0.2  
0.4  
0.6  
0.8  
1
Q

G

, Total Gate Charge (nC)  
-V

SD

, Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-Charge Characteristics  
2.0  
1.5  
1.0  
0.5  
1.5  
1
0.5  
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T

J

,Junction Temperature (
℃
)  
T

J

, Junction Temperature (
℃
)  
Fig.5 Normalized V

GS(th)

v.s T

J  

Fig.6 Normalized R

DSON

v.s T

J  

V
e
r 2.1  
3

HSM4113  
P-Ch 40V Fast Switching MOSFETs  
10000  
1000  
100  
100.00  
10.00  
1.00  
F=1.0MHz  
Ciss  
100us  
1ms  
Coss  
Crss  
10ms  
100ms  
DC  
0.10  
Tc=25

o

C  
Single Pulse  
10  
0.01  
1
5
9
13  
17  
21  
25  
0.1  
1
10  
100  
-V

DS

Drain to Source Voltage(V)  
-V

DS

(V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.3  
0.1  
0.1  
0.05  
P

DM  

T

ON  

T
0.02  
0.01  
D = T

ON

/T  
T

J

peak = T

C

+ P

DM

x R

θJC  

S
I
NGLE PULSE  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Waveform  
V
e
r 2.1  
4

HSM4113  
P-Ch 40V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
Packaging  
HSM4113  
SOP-8  
2500/Tape&Reel  
V
e
r 2.1  
5