HUASHUO-HSM4313
| Part # | HUASHUO-HSM4313 |
Download  | HUASHUO-HSM4313 |
HSM4313
Dual P-Ch 40V Fast Switching MOSFETs
Description
Product Summary
The HSM4313 is the high cell density trenched P-
ch MOSFE
T
s
, which provide excellent RDSON and
gate charge for most of the synchronous buck
converter applications.
V
DS
-40
45
V
R
DS(ON),max
I
D
m
Ω
A
-6.5
The HSM4313 meet the RoHS and Green Product
requirement, 100% EAS guaranteed with full
function reliability approved.
SOP8 Pin Configuration
⚫
100% EAS Guaranteed
Green Device Available
Super Low Gate Charge
Excellent CdV/dt effect decline
Advanced high cell density Trench
technology
⚫
⚫
⚫
⚫
Absolute Maximum Ratings
Symbol
V
DS
Parameter
Rating
-40
Units
Drain-Source Voltage
V
V
V
GS
±
20
Gate-Sou
r
ce Voltage
I
D
@T
C
=25
℃
Continuous Drain Current, -V
GS
@ -10V
1
Continuous Drain Current, -V
GS
@ -10V
1
Pulsed Drain Current
2
-6.5
A
I
D
@T
C
=100
℃
-4.7
A
I
DM
-15
A
EAS
Single Pulse Avalanche Energy
3
36
mJ
A
I
AS
P
D
@T
C
=25
℃
T
STG
Avalanche Current
-27.2
3.1
Total Power Dissipation
4
W
℃
℃
Storage
T
e
mperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
T
J
Thermal Data
Symbol
R
θ
JA
Parameter
Typ.
Max.
85
Unit
℃
/W
℃
/W
Thermal Resistance Junction-Ambient
1
Thermal Resistance Junction-Case
1
—
—
R
θ
JC
40
V
e
r 2.0
1
HSM4313
Dual P-Ch 40V Fast Switching MOSFETs
P-Channel Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
BV
DSS
Parameter
Conditions
V
GS
=0V , I
D
=-250uA
Min.
-40
—
—
—
-1.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
—
Max.
—
Unit
V
Drain-Source Breakdown Voltage
BV
DSS
Temperature Coefficient
△
BV
DSS
/
△
T
J
Reference to 25
℃
, I
D
=-1mA
V
GS
=-10V , I
D
=-6A
-0.012
—
—
V/
℃
45
75
-2.5
—
R
DS(ON)
Static Drain-Source On-Resistance
2
m
V
GS
=-4.5V , I
D
=-3A
—
V
GS(th)
Gate Threshold Voltage
—
V
V
GS
=V
DS
, I
D
=-250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
4.32
—
mV/
℃
V
DS
=-32V , V
GS
=0V , T
J
=25
℃
V
DS
=-32V , V
GS
=0V , T
J
=55
℃
1
I
DSS
Drain-Source Leakage Current
uA
—
5
V
GS
=
±
20V , V
DS
=0V
I
GSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
—
±
100
—
nA
S
V
DS
=-5V , I
D
=-6A
12
R
g
V
DS
=0V , V
GS
=0V , f=1MHz
13
—
Q
g
Total Gate Charge (-4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
9
—
V
DS
=-20V , V
GS
=-4.5V , I
D
=-6A
nC
ns
Q
gs
Q
gd
T
d(on)
T
r
2.54
3.1
19.2
12.8
48.6
4.6
1004
108
80
—
—
—
V
DD
=-15V , V
GS
=-10V , R
G
=3.3
,
—
I
D
=-1A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
—
C
iss
C
oss
C
rss
Input Capacitance
—
V
DS
=-15V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
—
—
Diode Characteristics
Symbol
Parameter
Conditions
V
G
=V
D
=0V , Force Current
V
GS
=0V , I
S
=-1A , T
J
=25
℃
Min.
—
Typ.
—
Max.
-4
Unit
A
I
S
Continuous Source Current
1,5
Diode Forward Voltage
2
V
SD
—
—
-1
V
Note :
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The EAS data shows Max. rating . The test condition is V
DD
=-25V,V
GS
=-10V,L=0.1mH,I
AS
=-27.2A
4.The power dissipation is limited by 150
℃
junction temperature
5.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
V
e
r 2.0
2
HSM4313
Dual P-Ch 40V Fast Switching MOSFETs
P-Channel Typical Characteristics
60
12
I
D
=-6A
V
GS
=-10V
10
55
50
45
40
35
30
V
GS
=-7V
V
GS
=-5V
8
6
V
GS
=-4.5V
4
V
GS
=-3V
2
0
0
0.5
1
1.5
2
2
4
6
8
10
-V
DS
Drain-to-Source Voltage (V)
-V
GS
(V)
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance v.s Gate-Source
10
12
10
8
V
DS
=-20V
I
D
=-6A
8
6
4
2
0
6
T
J
=150
℃
T
J
=25
℃
4
2
0
0
6
12
18
0.2
0.4
0.6
0.8
1
Q
G
, Total Gate Charge (nC)
-V
SD
, Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics of Reverse
Fig.4 Gate-Charge Characteristics
2.0
1.5
1.0
0.5
1.5
1
0.5
0
-50
0
50
100
150
-50
0
50
100
150
T
J
,Junction Temperature (
℃
)
T
J
, Junction Temperature (
℃
)
Fig.5 Normalized V
GS(th)
v.s T
J
Fig.6 Normalized R
DSON
v.s T
J
V
e
r 2.0
3
HSM4313
Dual P-Ch 40V Fast Switching MOSFETs
10000
1000
100
100.00
F=1.0MHz
Ciss
10.00
1.00
0.10
0.01
100us
1ms
Coss
Crss
10ms
100ms
DC
Tc=25
o
C
Single Pulse
10
1
5
9
13
17
21
25
0.1
1
10
100
-V
DS
Drain to Source Voltage(V)
-V
DS
(V)
Fig.7 Capacitance
Fig.8 Safe Operating Area
1
DUTY=0.5
0.3
0.1
0.1
0.05
P
DM
T
ON
T
0.02
0.01
D = T
ON
/T
T
J
peak = T
C
+ P
DM
x R
θJC
S
I
NGLE PULSE
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
Fig.11 Unclamped Inductive Waveform
V
e
r 2.0
4
HSM4313
Dual P-Ch 40V Fast Switching MOSFETs
Ordering Information
Part Number
Package code
SOP-8
Packaging
HSM4313
2500/Tape&Reel
V
e
r 2.0
5
