HUASHUO-HSM4805

Part #HUASHUO-HSM4805
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HUASHUO-HSM4805
HSM4805  
Dual P-Ch 30V Fast Switching MOSFETs  
Description  
Product Summary  
V
DS  
-30  
12  
-9  
V
The HSM4805 is the high cell density trenched P-  
ch MOSFE
T
s
, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
R
DS(ON),typ  
m
Ω  
A
I
D  
The HSM4805 meet the RoHS and Green Product  
requirement, 100% EAS guaranteed with full  
function reliability approved.  
⚫
100% EAS Guaranteed  
⚫
Green Device Available  
⚫
Super Low Gate Charge  
⚫
Excellent CdV/dt effect decline  
⚫
Advanced high cell density Trench  
technology  
SOP8 Pin Configuration  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Units  
V
DS  
V
GS  
Drain-Source Voltage  
-30  
V
V
±
25  
Gate-Sou
r
ce Voltage  
I
D
@T
A
=25
℃  
I
D
@T
A
=70
℃  
I
DM  
Continuous Drain Current, -V
GS
@ -10V
1  
Continuous Drain Current, -V
GS
@ -10V
1  
Pulsed Drain Current
2  
-9  
A
-7  
-40  
A
A
EAS  
Single Pulse Avalanche Energy
3  
Avalanche Current  
125  
mJ  
A
I
AS  
-50  
P
D
@T
A
=25
℃  
T
STG  
Total Power Dissipation
4  
2
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T
J  
Thermal Data  
Symbol  
R
θ
JA  
Parameter  
Typ.  
Max.  
85  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-Ambient
1  
Thermal Resistance Junction-Case
1  
—  
—  
R
θ
JC  
24  
1
V
e
r 2.0  

HSM4805  
Dual P-Ch 30V Fast Switching MOSFETs  
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)  
Symbol  
BV
DSS  
Parameter  
Conditions  
V
GS
=0V , I
D
=-250uA  
Min.  
-30  
—  
—  
—  
-1.0  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BV
DSS
Temperature Coefficient  
△
BV
DSS
/
△
T
J  
Reference to 25
℃
, I
D
=-1mA  
V
GS
=-10V , I
D
=-8A  
-0.022  
12  
—  
V/
℃  
16  
28  
-2.5  
—  
R
DS(ON)  
Static Drain-Source On-Resistance
2  
m
 
V
GS
=-4.5V , I
D
=-5A  
18  
V
GS(th)  
Gate Threshold Voltage  
—  
V
V
GS
=V
DS
, I
D
=-250uA  
△
V
GS(th)  
V
GS(th)
Temperature Coefficient  
4.6  
—  
mV/
℃  
V
DS
=-24V , V
GS
=0V , T
J
=25
℃  
V
DS
=-24V , V
GS
=0V , T
J
=55
℃  
V
GS
=
±
20V , V
DS
=0V  
-1  
I
DSS  
Drain-Source Leakage Current  
uA  
—  
-5  
I
GSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V
DS
=-5V , I
D
=-8A  
24  
R
g  
V
DS
=0V , V
GS
=0V , f=1MHz  
9
—  
Q
g  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
20  
—  
V
DS
=-15V , V
GS
=-4.5V , I
D
=-8A  
nC  
ns  
Q
gs  
Q
gd  
T
d(on)  
T
r  
5.1  
7.3  
33.8  
35.8  
72.8  
10.6  
2215  
310  
237  
—  
—  
—  
V
DD
=-15V , V
GS
=-10V , R
G
=3.3
,  
—  
I
D
=-1A  
T
d(off)  
T
f  
Turn-Off Delay Time  
Fall Time  
—  
—  
C
iss  
C
oss  
C
rss  
Input Capacitance  
—  
V
DS
=-15V , V
GS
=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V
G
=V
D
=0V , Force Current  
V
GS
=0V , I
S
=-1A , T
J
=25
℃  
Min.  
—  
Typ.  
—  
Max.  
-9  
Unit  
A
I
S  
I
SM  
V
SD  
t
rr  
Continuous Source Current
1,5  
Pulsed Source Current
2,5  
Diode Forward Voltage
2  
Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
-50  
-1.2  
—  
A
—  
—  
V
—  
35  
25  
nS  
nC  
I
F
=-8A , dI/dt=100A/µs , T
J
=25
℃  
Q
rr  
—  
—  
Note :  
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V
DD
=-25V,V
GS
=-10V,L=0.1mH,I
AS
=-50A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.  
2
V
e
r 2.0  

HSM4805  
Dual P-Ch 30V Fast Switching MOSFETs  
Typical Characteristics  
Fig.2 On-Resistance vs G-S Voltage
de  
Fig.1 Typical Output Characteristics
diode  
12  
10  
8
6
T

J

=150
℃
 
T

J

=25
℃  
4
2
0
0.2  
0.4  
0.6  
0.8  
1
-V

SD

, Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-Charge Characteristics  
2.0  
1.5  
1.5  
1.0  
0.5  
1
0.5  
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T

J

,Junction Temperature (
℃
)  
T

J

, Junction Temperature (
℃
)  
Fig.5 Normalized V
GS(th)
vs. T
J  
Fig.6 Normalized R
DSON
vs. T
J  
3
V
e
r 2.0  

HSM4805  
Dual P-Ch 30V Fast Switching MOSFETs  
10000  
1000  
100  
F=1.0MHz  
Ciss  
Coss  
Crss  
10  
1
1
5
9
13  
17  
21  
25  
-V

DS

Drain to Source Voltage(V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
DUTY=0.5  
0.2  
0.1  
0.1  
0.01  
0.05  
0.01  
P

DM  

T

ON  

T
D =
T

ON

/T  
SINGLE  
T

Jpeak

=
T

C

+P

D
M

XR

θJC  

0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Switching Waveform  
4
V
e
r 2.0  

HSM4805  
Dual P-Ch 30V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
SOP-8  
Packaging  
HSM4805  
4000/Tape&Reel  
5
V
e
r 2.0