HUASHUO-HSM9926

Part #HUASHUO-HSM9926
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HUASHUO-HSM9926
HSM9926  
Dual N-Ch 20V Fast Switching MOSFETs  
Description  
Product Summary  
V

DS  

20  
28  
6
V
The HSM9926 is the high cell density trenched N-  
ch MOSFE
T
s
, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
R

DS(ON),max  

I

D  

mΩ  
A
The HSM9926 meet the RoHS and Green Product  
requirement, 100% EAS guaranteed with full  
function reliability approved.  
Dual SOP8 Pin Configuration  
l
l
l
l
l
100% EAS Guaranteed  
Green Device Available  
Super Low Gate Charge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
Units  
Drain-Source Voltage  
20  
±
12  
6
V
V
A
A
V

GS  

Gate-Sou
r
ce Voltage  
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

4
I

DM  

P

D

@T

A

=25
℃  
T

STG  

Pulsed Drain Current

2  

Total Power Dissipation

4  

24  
A
1.3  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
R

θJA  

Thermal Resistance Junction-ambient

1  

—  
62.5  
℃
/W  
1
V
e
r 2.0  

HSM9926  
Dual N-Ch 20V Fast Switching MOSFETs  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
20  
—  
—  
0.6  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
BV

DSS  

Drain-Source Breakdown Voltage  
V
V

GS

=4.5V , I

D

=6A  
22  
28  
44  
1.5  
1
R

DS(ON)  

V

GS(th)  

I

DSS  

Static Drain-Source On-Resistance

2  

Gate Threshold Voltage  
m
Ω
 
V
V

GS

=2.5V , I

D

=5.2A  
34  
V

GS

=V

DS

, I

D

=250uA  
0.9  
—  
V

DS

=20V , V

GS

=0V , T

J

=25
℃  
V

DS

=20V , V

GS

=0V , T

J

=55
℃  
Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
12V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=6A  
47  
Q

g  

6.2  
1.6  
1.5  
9.6  
6.3  
30  
—  
V

DS

=10V , V

GS

=4.5V , I

D

=3A  
nC  
Q

gs  

Q

gd  

T

d(on)  

T

r  

—  
—  
Turn-On Delay Time  
Rise Time  
—  
V

DD

=10V , V

GEN

=4.5V , R

GEN

=6
Ω  
I

D

=1A; R

L

=10
Ω  
—  
ns  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
6.5  
553  
144  
120  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
V

DS

=8V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=25V,V

GS

=10V,L=0.1mH,I

AS

=46A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2
V
e
r 2.0  

HSM9926  
Dual N-Ch 20V Fast Switching MOSFETs  
Typical Characteristics  
3
V
e
r 2.0  

HSM9926  
Dual N-Ch 20V Fast Switching MOSFETs  
4
V
e
r 2.0  

HSM9926  
Dual N-Ch 20V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
SOP-8  
Packaging  
HSM9926  
4000/Tape&Reel  
5
V
e
r 2.0