HUASHUO-HSS2312

Part #HUASHUO-HSS2312
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HUASHUO-HSS2312
HSS2312  
N-Ch 20V Fast Switching MOSFETs  
Description  
Product Summary  
The HSS2312 is the high cell density trenched N-  
ch MOSFE
T
s
, which provides excellent RDSON  
and efficiency for most of the small power switching  
and load switch applications.  
V

DS  

20  
15  
6
V
R

DS(ON),typ  

I

D  

m
Ω  
A
The HSS2312 meet the RoHS and Green Product  
requirement with full function reliability approved.  
SOT23L Pin Configuration  
⚫
Green Device Available  
⚫
Super Low Gate Charge  
⚫
Excellent Cdv/dt effect decline  
⚫
Advanced high cell density Trench  
technology  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
Units  
Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
20  
V
V
V

GS  

±
12  
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 4.5V

1  

Continuous Drain Current, V

GS

@ 4.5V

1  

Pulsed Drain Current

2  

6
A
5
24  
A
A
P

D

@T

A

=25
℃  
P

D

@T

A

=70
℃  
T

STG  

Total Power Dissipation

3  

1.4  
W
W
℃
℃
Total Power Dissipation

3  

0.9  
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T

J  

Thermal Data  
Symbol  
Parameter  
Max.  
Unit  
R

θ
JA  

Thermal Resistance Junction-ambient

1  

90  
℃
/W  
1
V
e
r2.0  

HSS2312  
N-Ch 20V Fast Switching MOSFETs  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
20  
—  
—  
—  
0.5  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
△
BV

DSS

/
△
T

J
BVDSS Temperature Coefficient  

Reference to 25
℃
, I

D

=1mA  
V

GS

=4.5V , I

D

=6A  
0.018  
15  
—  
V/
℃  
20  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
 
V

GS

=2.5V , I

D

=5A  
19  
28  
V

GS(th)  

Gate Threshold Voltage  
0.7  
-3.1  
—  
1.0  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
mV/
℃  
V

DS

=16V , V

GS

=0V , T

J

=25
℃  
V

DS

=16V , V

GS

=0V , T

J

=55
℃  
1
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
12V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=4A  
10  
Q

g  

12  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
V

DS

=15V , V

GS

=4.5V , I

D

=4A  
nC  
Q

gs  

Q

gd  

T

d(on)  

T

r  

2.4  
1.1  
9
Turn-On Delay Time  
Rise Time  
V

DS

=10V , V

GS

=4.5V , R

G

=6
  
12  
ns  
I

D

=6A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
33  
36  
C

iss  

C

oss  

C

rss  

Input Capacitance  
900  
220  
100  
V

DS

=10V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
6
Unit  
A
I

S  

Continuous Source Current

1,4  

Pulsed Source Current

2,4  

Diode Forward Voltage

2  

I

SM  

V

SD  

—  
—  
24  
A
—  
—  
1.2  
V
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2
V
e
r2.0  

HSS2312  
N-Ch 20V Fast Switching MOSFETs  
Typical Characteristics  
6
4
T

J

=175
℃
 
T

J

=25
℃  
2
0
0
0.3  
0.6  
0.9  
1.2  
V

SD

, Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics Of Reverse  
Fig.4 Gate-Charge Characteristics  
1.8  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
T

J

,Junction Temperature (
℃
)  
T

J

, Junction
T
e
mperature (
℃
)  
Fig.5 Normalized V

GS(th)

vs. T

J  

Fig.6 Normalized R

DSON

vs. T

J  

1000  
100  
10  
100.00  
10.00  
1.00  
Ciss  
100us  
10ms  
Coss  
Crss  
100ms  
1s  
0.10  
DC  
T

A

=25
℃
 
F=1.0MHz  
Single Pulse  
0.01  
1
4
7
10  
13  
16  
19  
22  
0.1  
1
10  
100  
V

DS

Drain to Source Voltage (V)  
V

DS

(V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
3
V
e
r2.0  

HSS2312  
N-Ch 20V Fast Switching MOSFETs  
1
0.1  
DUTY=0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.01  
P

DM  

T

ON  

0.001 SINGLE
 
PULSE  
T
D = T

ON

/T  
T

Jpeak

= T

A

+
P

D
M

x R

θJA  

0.0001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
V

DS  

90%  
10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

Fig.10 Switching Time Waveform  
Fig.11 Gate Charge Waveform  
4
V
e
r2.0  

HSS2312  
N-Ch 20V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
Packaging  
HSS2312  
SO
T
-23L  
3000/Tape&Reel  
5
V
e
r2.0