HUASHUO-HSS2P10

Part #HUASHUO-HSS2P10
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HUASHUO-HSS2P10
HSS2P10  
P-Ch 100V Fast Switching MOSFETs  
Product Summary  
Description  
The HSS2P10 is the high cell density trenched P-  
ch MOSFE
T
s
, which provides excellent RDSON  
and efficiency for most of the small power  
switching and load switch applications.  
The HSS2P10 meets the RoHS and Green  
Product requirement with full function reliability  
approved.  
V
DS  
-100 V  
R
DS(ON),typ  
255
m
Ω  
I
D  
-2  
A
SOT23 Pin Configuration  
⚫
Super Low Gate Charge  
⚫
Excellent Cdv/dt effect decline  
⚫
Green Device Available  
⚫
Advanced high cell density Trench  
technology  
Absolute Maximum Ratings  
Symbol  
V
DS  
Parameter  
Rating  
-100  
Units  
V
Drain-Source Voltage  
V
GS  
±
20  
V
Gate-Sou
r
ce Voltage  
I
D
@T
A
=25
℃  
I
D
@T
A
=70
℃  
I
DM  
Continuous Drain Current, V
GS
@ -10V
1  
Continuous Drain Current, V
GS
@ -10V
1  
Pulsed Drain Current
2  
-2  
A
-1.5  
A
-8  
A
P
D
@T
A
=25
℃  
T
STG  
Total Power Dissipation
3  
1.4  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T
J  
Thermal Data  
Symbol  
R
θ
JA  
Parameter  
Typ.  
Max.  
125  
80  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient
1  
Thermal Resistance Junction-Case
1  
—  
—  
R
θ
JC  
V
e
r 2.0  
1

HSS2P10  
P-Ch 100V Fast Switching MOSFETs  
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)  
Symbol  
BV
DSS  
Parameter  
Conditions  
V
GS
=0V , I
D
=-250uA  
Min.  
-100  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
△
BV
DSS
/
△
T
J  
Reference to 25
℃
, I
D
=-1mA  
V
GS
=-10V , I
D
=-2A  
-0.0624  
255  
280  
-2.0  
4.5  
—  
—  
V/
℃  
—  
320  
340  
-3.0  
—  
R
DS(ON)  
Static Drain-Source On-Resistance
2  
m
 
V
GS
=-4.5V , I
D
=-1A  
—  
V
GS(th)  
Gate Threshold Voltage  
-1.0  
—  
V
V
GS
=V
DS
, I
D
=-250uA  
△
V
GS(th)  
V
GS(th)
Temperature Coefficient  
mV/
℃  
V
DS
=-80V , V
GS
=0V , T
J
=25
℃  
V
DS
=-80V , V
GS
=0V , T
J
=55
℃  
V
GS
=
±
20V , V
DS
=0V  
—  
10  
I
DSS  
Drain-Source Leakage Current  
uA  
nA  
—  
—  
100  
±
100  
—  
I
GSS  
Q
g  
Gate-Source Leakage Current  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
—  
—  
—  
15  
V
DS
=-50V , V
GS
=-10V , I
D
=-2A  
nC  
Q
gs  
Q
gd  
T
d(on)  
T
r  
—  
3.4  
2.8  
7.3  
47  
—  
—  
—  
—  
—  
V
DD
=-50V , V
GS
=-10V , R
G
=3.3
  
—  
—  
ns  
I
D
=-1A  
T
d(off)  
T
f  
Turn-Off Delay Time  
Fall Time  
—  
34  
—  
—  
39  
—  
C
iss  
C
oss  
C
rss  
Input Capacitance  
—  
900  
48  
—  
V
DS
=-50V , V
GS
=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
—  
43  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V
G
=V
D
=0V , Force Current  
V
GS
=0V , I
S
=-1A , T
J
=25
℃  
Min.  
—  
Typ.  
—  
Max.  
-2  
Unit  
A
I
S  
Continuous Source Current
1,4  
Pulsed Source Current
2,4  
Diode Forward Voltage
2  
I
SM  
V
SD  
—  
—  
-8  
A
—  
—  
-1.2  
V
Note :  
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.  
V
e
r 2.0  
2

HSS2P10  
P-Ch 100V Fast Switching MOSFETs  
Typical Characteristics  
1.5  
10  
7.5  
5
V

DS

=-20V  
I

D

=-0.5A  
1
T

J

=150
℃
 
T

J

=25
℃  
0.5  
2.5  
0
0
0.00  
0.25  
0.50  
0.75  
1.00  
0
2.5  
5
7.5  
10  
-V

SD

, Source-to-Drain Voltage (V)  
Q

G

, Total Gate Charge (nC)  
Fig.1 Forward Characteristics Of Reverse  
Fig.2 Gate-Charge Characteristics  
2.0  
1.5  
1.0  
0.5  
1.8  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T

J

,Junction Temperature (
℃
)  
T

J

, Junction Temperature (
℃
)  
Fig.3 Normalized V
GS(th)
vs. T
J  
Fig.4 Normalized R
DSON
vs. T
J  
1000  
100  
10  
10.00  
1.00  
0.10  
0.01  
0.00  
F=1.0MHz  
Ciss  
1ms  
100ms  
1s  
10S  
DC  
Coss  
Crss  
T

A

=25
℃
 
Single Pulse  
1
5
9
13  
17  
21  
25  
0.1  
1
10  
-V

DS

(V)  
100  
1000  
-V

DS

,Drain to Source Voltage (V)  
Fig.5 Capacitance  
Fig.6 Safe Operating Area  
V
e
r 2.0  
3

HSS2P10  
P-Ch 100V Fast Switching MOSFETs  
1
0.1  
DUTY=0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.01  
P

DM  

T

ON  

0.001 SINGLE
 
PULSE  
T
D = T

ON

/T  
T

Jpeak

= T

C

+
P

D
M

x R

θJC  

0.0001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.7 Normalized Maximum Transient Thermal Impedance  
V

DS  

90%  
10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

Fig.8 Switching Time Waveform  
Fig.9 Gate Charge Waveform  
V
e
r 2.0  
4

HSS2P10  
P-Ch 100V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
Packaging  
HSS2P10  
SO
T
-23L  
3000/Tape&Reel  
V
e
r 2.0  
5