HUASHUO-HSS3400A

Part #HUASHUO-HSS3400A
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HUASHUO-HSS3400A
HSS3400A  
Description  
Product Summary  
V

DS  

30  
26  
5.5  
V
The HSS3400A is the high cell density trenched N-  
ch MOSFE
T
s
, which provides excellent RDSON  
and efficiency for most of the small power switching  
and load switch applications.  
R

DS(ON),max  

I

D  

mΩ  
A
The HSS3400A meet the RoHS and Green Product  
requirement with full function reliability approved.  
l
Green Device Available  
l
Super Low Gate Charge  
l
Excellent Cdv/dt effect decline  
l
Advanced high cell density Trench  
technology  
SOT23 Pin Configuration  
Absolute Maximum Ratings  
Symbol  
V

DS  

Parameter  
Rating  
30  
Units  
V
Drain-Source Voltage  
V

GS  

±
12  
V
Gate-Sou
r
ce Voltage  
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I

DM  

Continuous Drain Current, V

GS

@ 4.5V

1  

Continuous Drain Current, V

GS

@ 4.5V

1  

Pulsed Drain Current

2  

5.5  
4.5  
A
A
22  
A
P

D

@T

A

=25
℃  
T

STG  

Total Power Dissipation

3  

1.0  
W
℃
℃
Storage
T
e
mperature Range  
-55 to 150  
-55 to 150  
T

J  

Operating Junction Temperature Range  
Thermal Data  
Symbol  
R

θJA  

Parameter  
Typ.  
—  
Max.  
100  
80  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction-Case

1  

R

θJC  

—  
1
V
e
r 2.0  

HSS3400A  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
30  
—  
—  
—  
—  
0.7  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
△
BV

DSS

/△
T

J  

Reference to 25
℃
, I

D

=1mA  
V

GS

=10V , I

D

=5.9A  
V

GS

=4.5V , I

D

=5A  
0.029  
19  
—  
V/
℃  
26  
31  
48  
1.4  
—  
R

DS(ON)  

Static Drain-Source On-Resistance

2  

23  
m
Ω
 
V

GS

=2.5V , I

D

=4A  
38  
V

GS(th)  

Gate Threshold Voltage  
0.9  
-2.82  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
mV/
℃  
V

DS

=24V , V

GS

=0V , T

J

=25
℃  
V

DS

=24V , V

GS

=0V , T

J

=55
℃  
1
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
12V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=3A  
19  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
1.5  
3.74  
0.62  
1.82  
6.5  
2
3
Ω
Q

g  

Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
—  
V

DS

=15V , V

GS

=4.5V , I

D

=3A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

—  
—  
—  
V

DD

=15V , V

GS

=4.5V , R

G

=3.3
Ω  
—  
I

D

=3A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
28.6  
2.6  
614  
78  
—  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
V

DS

=15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
61  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
5.5  
22  
Unit  
A
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source Current

1,4  

Pulsed Source Current

2,4  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
A
—  
—  
1.2  
—  
V
—  
6.8  
2.3  
nS  
nC  
I
F
=3A , dI/dt=100A/µs , T

J

=25
℃  
Q

rr  

—  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2
V
e
r 2.0  

HSS3400A  
3
V
e
r 2.0  

HSS3400A  
4
V
e
r 2.0  

HSS3400A  
Ordering Information  
Part Number  
Package code  
Packaging  
3000/Tape&Reel  
HSS3400A  
SO
T
–
23  
5
V
e
r 2.0