HUASHUO-HSS3N10
| Part # | HUASHUO-HSS3N10 |
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HSS3N10
N-Ch 100V Fast Switching MOSFETs
Product Summary
Description
V
DS
100
V
The HSS3N10 is the high cell density trenched N-
ch MOSFE
T
s
, which provide excellent RDSON and
gate charge for most of the synchronous buck
converter applications.
R
DS(ON),typ
110
m
Ω
I
D
3
A
The HSS3N10 meet the RoHS and Green Product
requirement with full function reliability approved.
⚫
⚫
⚫
⚫
Green Device Available
Super Low Gate Charge
Excellent Cdv/dt effect decline
Advanced high cell density Trench
technology
SOT23 Pin Configuration
Absolute Maximum Ratings
Symbol
V
DS
Parameter
Rating
100
Units
V
Drain-Source Voltage
Gate-Sou
r
ce Voltage
V
GS
±
20
V
I
D
@T
A
=25
℃
I
D
@T
A
=100
℃
I
DM
Continuous Drain Current, V
GS
@ 10V
1
Continuous Drain Current, V
GS
@ 10V
1
Pulsed Drain Current
2
3
2.4
A
A
12
A
P
D
@T
A
=25
℃
T
STG
Total Power Dissipation
3
1.2
W
℃
℃
Storage
T
e
mperature Range
-55 to 150
-55 to 150
T
J
Operating Junction Temperature Range
Thermal Data
Symbol
Parameter
Typ.
—
Max.
104
76
Unit
℃
/W
℃
/W
Thermal Resistance Junction-ambient(steady state)
1
Thermal Resistance Junction-ambient(t<10s)
1
R
θ
JA
—
1
V
e
r 2.0
HSS3N10
N-Ch 100V Fast Switching MOSFETs
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
BV
DSS
Parameter
Conditions
V
GS
=0V , I
D
=250uA
Min.
100
—
Typ.
—
Max.
—
Unit
V
Drain-Source Breakdown Voltage
BVDSS Temperature Coefficient
△
BV
DSS
/
△
T
J
Reference to 25
℃
, I
D
=1mA
V
GS
=10V , I
D
=3A
0.122
110
160
1.8
-4.84
—
—
V/
℃
m
m
V
—
140
300
3.0
—
R
DS(ON)
Static Drain-Source On-Resistance
2
V
GS
=4.5V , I
D
=2A
—
V
GS(th)
Gate Threshold Voltage
1.0
—
V
GS
=V
DS
, I
D
=250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
mV/
℃
V
DS
=80V , V
GS
=0V , T
J
=25
℃
V
DS
=80V , V
GS
=0V , T
J
=55
℃
V
GS
=
±
20V , V
DS
=0V
—
10
I
DSS
Drain-Source Leakage Current
uA
nA
—
—
100
±
100
—
I
GSS
Q
g
Gate-Source Leakage Current
Total Gate Charge (10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
—
—
—
4.3
1.5
1.0
14.3
3.4
21
V
DS
=50V , V
GS
=10V , I
D
=3A
nC
Q
gs
Q
gd
T
d(on)
T
r
—
—
—
—
—
—
V
DD
=50V , V
GS
=10V , R
G
=2
—
—
ns
I
D
=3A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
—
—
2.8
208
29
—
C
iss
C
oss
C
rss
Input Capacitance
—
—
V
DS
=50V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
—
—
—
1.4
—
Diode Characteristics
Symbol
Parameter
Conditions
V
G
=V
D
=0V , Force Current
V
GS
=0V , I
S
=1A , T
J
=25
℃
Min.
—
Typ.
—
Max.
3
Unit
A
I
S
Continuous Source Current
1,4
Diode Forward Voltage
2
Reverse recovery time
V
SD
trr
—
—
1.2
—
V
—
32
ns
nC
Is=3A,di/dt=100A/us
Qrr
Reverse recovery Charge
—
39
—
Note :
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The power dissipation is limited by 150
℃
junction temperature
4.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
2
V
e
r 2.0
HSS3N10
N-Ch 100V Fast Switching MOSFETs
Typical Characteristics
130
125
120
115
12
9
I
D
=2A
V
GS
=10V
V
GS
=7V
V
GS
=5V
V
GS
=4.5V
6
V
GS
=3V
3
0
4
6
8
10
0
1
2
3
4
V
GS
(V)
V
DS
, Drain-to-Source Voltage (V)
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs. Gate-Source
10
7.5
5
12
V
DS
=60V
I
D
=2A
10
8
6
T
J
=150
℃
T
J
=25
℃
4
2.5
0
2
0
0
5
10
15
20
25
0
0.3
0.6
0.9
1.2
Q
G
, Total Gate Charge (nC)
V
SD
, Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics Of Reverse
Fig.4 Gate-Charge Characteristics
1.8
1.4
1
0.6
0.2
-50
0
50
100
150
T
J
,Junction Temperature (
℃
)
Fig.5 Normalized V
GS(th)
vs. T
J
Fig.6 Normalized R
DSON
vs. T
J
3
V
e
r 2.0
HSS3N10
N-Ch 100V Fast Switching MOSFETs
10000
1000
100
10.00
1.00
0.10
0.01
F=1.0MHz
Ciss
100us
10ms
100ms
Coss
DC
Tc=25
o
C
Single Pulse
Crss
10
1
5
9
13
17
21
25
0.01
0.1
1
10
100
V
DS
, Drain to Source Voltage (V)
V
DS
(V)
Fig.7 Capacitance
Fig.8 Safe Operating Area
1
DUTY=0.5
0.2
0.1
0.1
0.01
0.05
0.01
P
DM
T
ON
T
D =
T
ON
/T
SINGLE
T
Jpeak
=
T
C
+P
D
M
XR
θJC
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
V
DS
90%
10%
V
GS
T
d(on)
T
r
T
on
T
d(off)
T
f
T
off
Fig.11 Gate Charge Waveform
Fig.10 Switching Time Waveform
4
V
e
r 2.0
HSS3N10
N-Ch 100V Fast Switching MOSFETs
Ordering Information
Part Number
Package code
Packaging
HSS3N10
SO
T
-23L
3000/Tape&Reel
5
V
e
r 2.0
