HUASHUO-HSSC3139

Part #HUASHUO-HSSC3139
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HUASHUO-HSSC3139
HSSC3139  
P-Ch 20V Fast Switching MOSFETs  
Description  
Product Summary  
The HSSC3139 is the high cell density trenched P-  
ch MOSFE
T
s
, which provide excellent RDSON and  
gate charge for most of the synchronous buck  
converter applications.  
V
DS  
-20  
V
R
DS(ON),typ  
400  
-0.65  
m
Ω  
A
I
D  
The HSSC3139 meet the RoHS and Green Product  
requirement with full function reliability approved.  
⚫
Super Low Gate Charge  
⚫
Low Threshold  
SOT 723 Pin Configurations  
⚫
High-Side Switching  
⚫
Advanced high cell density Trench  
technology  
D
S
G
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-20  
Units  
V
V
DS  
V
GS  
Drain-Source Voltage  
Gate-Sou
r
ce Voltage  
±
12  
V
I
D
@T
A
=25
℃  
I
DM  
Continuous Drain Current, V
GS
@ -4.5V
1  
Pulsed Drain Current
2  
-0.65  
-1.2  
A
A
P
D
@T
A
=25
℃  
T
STG  
Total Power Dissipation
3  
0.15  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T
J  
Thermal Data  
Symbol  
Parameter  
Typ.  
Max.  
830  
Unit  
R
θ
JA  
Thermal Resistance Junction-Ambient
1  
—  
℃
/W  
1
V
e
r 2.0  

HSSC3139  
P-Ch 20V Fast Switching MOSFETs  
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)  
Symbol  
BV
DSS  
Parameter  
Conditions  
V
GS
=0V , I
D
=-250uA  
Min.  
-20  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BV
DSS
Temperature Coefficient  
△
BV
DSS
/
△
T
J  
Reference to 25
℃
, I
D
=-1mA  
V
GS
=-4.5V , I
D
=-1A  
-0.014  
400  
600  
900  
—  
—  
V/
℃  
—  
500  
700  
—  
R
DS(ON)  
Static Drain-Source On-Resistance
2  
m
 
V
GS
=-2.5V , I
D
=-0.8A  
V
GS
=-1.8V , I
D
=-0.5A  
—  
—  
V
GS(th)  
Gate Threshold Voltage  
-0.35  
—  
-1.1  
—  
V
V
GS
=V
DS
, I
D
=-250uA  
△
V
GS(th)  
V
GS(th)
Temperature Coefficient  
3.95  
—  
mV/
℃  
V
DS
=-16V , V
GS
=0V , T
J
=25
℃  
V
DS
=-16V , V
GS
=0V , T
J
=55
℃  
V
GS
=
±
10V , V
DS
=0V  
—  
-1  
I
DSS  
Drain-Source Leakage Current  
uA  
—  
—  
-5  
I
GSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
—  
—  
±
20  
—  
nA  
S
V
DS
=-10V , I
D
=-0.5A  
0.7  
—  
—  
Q
g  
1.2  
0.05  
0.13  
9
—  
V
DS
=-10V , V
GS
=-4.5V , I
D
=-0.6A  
nC  
Q
gs  
Q
gd  
T
d(on)  
—  
—  
Turn-On Delay Time  
Rise Time  
—  
—  
—  
V
DD
=-10V , V
GS
=-4.5V , R
G
=10
,  
T
r  
—  
6
ns  
I
D
=-0.2A  
T
d(off)  
T
f  
Turn-Off Delay Time  
Fall Time  
—  
—  
—  
—  
—  
30  
19  
—  
—  
C
iss  
C
oss  
C
rss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
150  
20  
V
DS
=-15V , V
GS
=0V , f=1MHz  
pF  
11  
Diode Characteristics  
Symbol  
Parameter  
Diode Forward Voltage
2  
Conditions  
Min.  
Typ.  
Max.  
Unit  
V
SD  
V
GS
=0V , I
S
=-1A , T
J
=25
℃  
—  
—  
-1.2  
V
Note :  
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.  
2
V
e
r 2.0  

HSSC3139  
P-Ch 20V Fast Switching MOSFETs  
3
V
e
r 2.0  

HSSC3139  
P-Ch 20V Fast Switching MOSFETs  
4
V
e
r 2.0  

HSSC3139  
P-Ch 20V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
Packaging  
HSSC3139  
SO
T
-723  
8000/Tape&Reel  
5
V
e
r 2.0