HUASHUO-HSU150N03

Part #HUASHUO-HSU150N03
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HUASHUO-HSU150N03
HSU150N03  
N-Ch 30V Fast Switching MOSFETs  
Product Summary  
Description  
The HSU150N03 is the high cell density trenched  
N-ch MOSFE
T
s
, which provide excellent RDSON  
and gate charge for most of the synchronous  
buck converter applications.  
V
DS  
30  
V
R
DS(ON),typ  
2.4  
150  
m
Ω  
A
I
D  
The HSU150N03 meet the RoHS and Green  
Product requirement, 100% EAS guaranteed with  
full function reliability approved.  
TO252 Pin Configuration  
⚫
⚫
⚫
⚫
⚫
100% EAS Guaranteed  
Green Device Available  
Super Low Gate Charge  
Excellent CdV/dt effect decline  
Advanced high cell density Trench  
technology  
Absolute Maximum Ratings  
Symbol  
V
DS  
Parameter  
Rating  
30  
Units  
V
Drain-Source Voltage  
V
GS  
±
20  
V
Gate-Sou
r
ce Voltage  
I
D
@T
C
=25
℃  
Continuous Drain Current, V
GS
@ 10V
1,6  
Continuous Drain Current, V
GS
@ 10V
1,6  
Pulsed Drain Current
2  
150  
95  
A
I
D
@T
C
=100
℃  
A
I
DM  
590  
A
EAS  
Single Pulse Avalanche Energy
3  
Avalanche Current  
226  
mJ  
A
I
AS  
P
D
@T
C
=25
℃  
T
STG  
30  
Total Power Dissipation
4  
60  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
T
J  
Thermal Data  
Symbol  
R
θ
JA  
Parameter  
Typ.  
—  
Max.  
62  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-Ambient
1  
Thermal Resistance Junction-Case
1  
R
θ
JC  
—  
1.4  
1
V
e
r 2.0  

HSU150N03  
N-Ch 30V Fast Switching MOSFETs  
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V
GS
=0V , I
D
=250uA  
Min.  
30  
—  
—  
1.2  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
BV
DSS  
Drain-Source Breakdown Voltage  
V
V
GS
=10V , I
D
=30A  
2.4  
4.4  
—  
3.2  
6.5  
2.5  
1
R
DS(ON)  
Static Drain-Source On-Resistance
2  
Gate Threshold Voltage  
m
 
V
V
GS
=4.5V , I
D
=20A  
V
GS(th)  
I
DSS  
V
GS
=V
DS
, I
D
=250uA  
V
DS
=24V , V
GS
=0V , T
J
=25
℃  
V
DS
=24V , V
GS
=0V , T
J
=55
℃  
V
GS
=
±
20V , V
DS
=0V  
—  
Drain-Source Leakage Current  
uA  
nA  
—  
5
I
GSS  
Q
g  
Gate-Source Leakage Current  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
—  
±
100  
—  
39  
V
DS
=15V , V
GS
=10V , I
D
=30A  
nC  
Q
gs  
Q
gd  
T
d(on)  
T
r  
10  
—  
12  
—  
20.1  
23  
—  
V
DD
=15V , V
GS
=10V , R
G
=3.3
,  
—  
ns  
I
D
=30A  
T
d(off)  
T
f  
Turn-Off Delay Time  
Fall Time  
99  
—  
37  
—  
C
iss  
C
oss  
C
rss  
Input Capacitance  
3500  
480  
410  
—  
V
DS
=15V , V
GS
=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V
G
=V
D
=0V , Force Current  
V
GS
=0V , I
S
=1A , T
J
=25
℃  
Min.  
—  
Typ.  
—  
Max.  
150  
1.2  
—  
Unit  
A
I
S  
Continuous Source Current
1,6  
Diode Forward Voltage
2  
Reverse Recovery Time  
Reverse Recovery Charge  
V
SD  
trr  
—  
—  
V
—  
44  
ns  
nC  
If=20A,di/dt=100A/us  
Qrr  
—  
37  
—  
Note :  
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V
DD
=15V,V
GS
=10V,L=0.5mH,I
AS
=30A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.  
6.The maximum current rating is package limited.  
2
V
e
r 2.0  

HSU150N03  
N-Ch 30V Fast Switching MOSFETs  
Typical Characteristics  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. G-S Voltage  
12  
10  
8
V

DS

=15V  
I

D

=15A  
10  
8
6
6
T

J

=150
℃
 
T

J

=25
℃  
4
4
2
0
2
0
0
40  
80  
120  
0.2  
0.4  
0.6  
0.8  
1
V

SD

, Source-to-Drain Voltage (V)  
Q

G

, Total Gate Charge (nC)  
Fig.3 Source Drain Forward Characteristics  
Fig.4 Gate-Charge Characteristics  
Fig.5 Normalized V
GS(th)
vs. T
J  
Fig.6 Normalized R
DSON
vs. T
J  
3
V
e
r 2.0  

HSU150N03  
N-Ch 30V Fast Switching MOSFETs  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
P

DM  

T

ON  

SINGLE  
0.01  
0.001  
T
D =
T

ON

/T  
T

Jpeak

=
T

C

+P

D
M

XR

θJC  

0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
1
2
BV

DSS  

BV

DSS

-V

DD  

EAS=  
BV

DSS  

L x I

AS

2

x  
V

DS  

90%  
V

DD  

I

AS  

10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

V

GS  

Fig.11 Unclamped Inductive Switching  
Fig.10 Switching Time Waveform  
4
V
e
r 2.0  

HSU150N03  
N-Ch 30V Fast Switching MOSFETs  
TO252 Package Outline Dimensions  
MILLIMETERS  
MILLIMETERS  
SYMBOL  
SYMBOL  
MIN  
2.20  
0.00  
0.97  
0.72  
5.23  
0.47  
6.00  
NOM  
2.30  
MAX  
MIN  
9.90  
1.40  
NOM  
MAX  
A
A1  
A2  
b
2.38  
0.10  
1.17  
0.85  
5.46  
0.58  
6.20  
H
L
10.10 10.30  
—  
1.50  
2.90REF  
0.51BSC  
—  
1.70  
1.07  
L1  
L2  
L3  
L4  
L5  
Ɵ
0.78  
b3  
c
5.33  
0.53  
0.90  
0.60  
1.70  
0°  
1.25  
1.00  
1.90  
8°  
0.80  
D
6.10  
1.80  
D1  
E
5.30REF  
6.60  
—  
6.50  
4.70  
6.70  
4.92  
Ɵ1  
Ɵ2  
K
5°  
7°  
9°  
E1  
e
4.83  
5°  
7°  
9°  
2.286BSC  
0.40REF  
5
V
e
r 2.0