HUASHUO-HSU28N15

Part #HUASHUO-HSU28N15
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HUASHUO-HSU28N15
HSU28N15  
N-Ch 150V Fast Switching MOSFETs  
Product Summary  
Description  
The HSU28N15 is the highest performance trench  
N-ch MOSFE
T
s
w
ith extreme high cell density,  
which provide excellent RDSON and gate charge  
for most of the synchronous buck converter  
applications.  
V

DS  

150  
46  
V
R

DS(ON),max  

I

D  

mΩ  
A
30  
The HSU28N15 meet the RoHS and Green  
Product requirement, 100% EAS guaranteed with  
full function reliability approved.  
TO252 Pin Configuration  
l
Super Low Gate Charge  
Green Device Available  
Excellent Cdv/dt effect decline  
Advanced high cell density Trench  
technology  
l
l
l
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
150  
Units  
V
V

DS  

Drain-Source Voltage  
V

GS  

I

D

@T

C

=25
℃  
I

D

@T

C

=100
℃  
I

DM  

±
20  
V
Gate-Sou
r
ce Voltage  
Continuous Drain Current, V

GS

@ 10V

1  

Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

30  
22  
A
A
60  
A
EAS  
Single Pulse Avalanche Energy

3  

216  
mJ  
A
I

AS  

Avalanche Current  
38  
P

D

@T

C

=25
℃  
T

STG  

Total Power Dissipation

3  

115  
W
℃
℃
Storage
T
e
mperature Range  
Operating Junction Temperature Range  
-55 to 175  
-55 to 175  
T

J  

Thermal Data  
Symbol  
R

θJA  

Parameter  
Typ.  
—  
Max.  
55  
Unit  
℃
/W  
℃
/W  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction-Case

1  

R

θJC  

—  
1.3  
1
V
e
r 2.0  

HSU28N15  
N-Ch 150V Fast Switching MOSFETs  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
150  
—  
Typ.  
—  
Max.  
—  
Unit  
V
BV

DSS  

Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance

2  

Static Drain-Source On-Resistance

2  

Gate Threshold Voltage  
V

GS

=10V , I

D

=20A  
35  
46  
50  
2.5  
1
m
Ω
 
m
Ω  
V
R

DS(ON)  

V

GS(th)  

I

DSS  

V

GS

=4.5V , I

D

=20A  
—  
37  
V

GS

=V

DS

, I

D

=250uA  
1.2  
—  
—  
V

DS

=120V , V

GS

=0V , T

J

=25
℃  
V

DS

=120V , V

GS

=0V , T

J

=55
℃  
—  
Drain-Source Leakage Current  
uA  
—  
—  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
—  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=20A  
—  
55  
Q

g  

—  
40  
—  
V

DS

=75V , V

GS

=4.5V , I

D

=10A  
nC  
Q

gs  

Q

gd  

T

d(on)  

T

r  

—  
10  
—  
—  
21  
—  
Turn-On Delay Time  
Rise Time  
—  
18  
—  
V

DD

=50V , V

GS

=4.5V , R

G

=3.3
Ω  
—  
20  
—  
ns  
I

D

=10A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
—  
65  
—  
—  
15  
—  
C

iss  

C

oss  

C

rss  

Input Capacitance  
—  
3755  
207  
160  
—  
V

DS

=25V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
—  
—  
—  
—  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=1A , T

J

=25
℃  
I
F
=10A , dI/dt=100A/µs ,  
T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
30  
Unit  
A
I

S  

V

SD  

t

rr  

Continuous Source Current

1,5  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
1.2  
—  
V
—  
35  
nS  
nC  
Q

rr  

—  
120  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=25V,V

GS

=10V,L=0.3mH,I

AS

=38A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
2
V
e
r 2.0  

HSU28N15  
N-Ch 150V Fast Switching MOSFETs  
Typical Characteristics  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. Gate-Source  
10  
8
6
T

J

=150
℃
 
T

J

=25
℃  
4
2
0
0.00  
0.25  
0.50  
0.75  
1.00  
V

SD

, Source-to-Drain Voltage (V)  
Fig.4 Gate-Charge Characteristics  
Fig.3 Forward Characteristics Of Reverse  
2.5  
2.0  
1.5  
1.0  
0.5  
1.8  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T ,
 
Junction Temperature (
 
)  
℃
J
T ,Junction
 
Temperature (  
)
℃
J
Fig.6 Normalized R

DSON

vs. T

J  

Fig.5 Normalized V

GS(th)

vs. T

J  

3
V
e
r 2.0  

HSU28N15  
N-Ch 150V Fast Switching MOSFETs  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
P

DM  

T

ON  

0.01  
T
SINGLE  
D =
T

ON

/T  
T

Jpeak

=
T

C

+P

D
M

XR

θJC  

0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
1
2
BV

DSS  

BV

DSS

-V

DD  

EAS=  
BV

DSS  

L x I

AS

2

x  
V

DS  

90%  
V

DD  

I

AS  

10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

V

GS  

Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Switching  
4
V
e
r 2.0  

HSU28N15  
N-Ch 150V Fast Switching MOSFETs  
Ordering Information  
Part Number  
Package code  
TO252-2  
Packaging  
HSU28N15  
2500/Tape&Reel  
5
V
e
r 2.0