HUAYI-HY3008P
| Part # | HUAYI-HY3008P |
Download  | HUAYI-HY3008P |
HY3008P/M/B/ MF /PL/PM
N-Channel Enhancement Mode MOSFET
Feature
Pin Description
z
80V/100A
R
DS(ON)
= 6.6m
Ω
(typ.)@V
GS
= 10V
S
D
G
z
z
z
100% Avalanche Tested
Reliable and Rugged
S
D
G
S
D
G
Lead- Free Devices Available
(RoHS Compliant)
TO-220FB-3L
TO-263-2L
TO-220FB-3M
Applications
S
D
z
z
Switching application
Power management for inverter systems
G
S
S
D
D
G
G
TO-220MF-3L
TO-3PM-3L
TO-3P
M
-3S
N-Channe
l
M
OSFET
Ordering and Marking Information
Package Code
P
M
B
HY3008
HY3008 HY3008
P :TO-220FB-3L
B:TO-263-2L
PM:TO-3PM-3S
M:TO-220FB-3S
MF:TO-220MF-3L
PL:TO-3PM-3L
YYXXXJWW G
YYXXXJWW G
YYXXXJWW G
MF
PM
PL
Date Code
YYXXX WW
Assembly Material
G:Lead Free
HY3008
HY3008 HY3008
YYXXXJWW G
YYXXXJWW G
YYXXXJWW G
Note: HUAYI lead -free products contain molding compounds/die attach materials and 100% matte tin plate Termi-
Nation finish;which are fully compliant with RoHS. HUAYI lead -free products meet or exceed the lead-Free require-
ments of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HUAYI defines
“
Green
”
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous
material and total of Br and Cl does not exceed 1500ppm by weight).
HUAYI reserves
the right to make changes, corrections, enhancements, modifications, and improvements to this pr
-oduct and/or to this document at any time without notice.
V1.0
1
HY3008P/M/B/ MF /PL/PM
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings
(
T
c
=25°C Unless Otherwise Noted)
V
DSS
V
GSS
T
J
Drain-Source Voltage
80
±25
V
V
Gate-Source Voltage
Maximum Junction
T
e
mperature
Storage
T
emperature Range
Source Current-Continuous(Body Diode)
-55 to 175
-55 to 175
100
°C
°C
A
T
STG
I
S
T
c
=25°C
Mounted on Large Heat Sink
I
DM
Pulsed Drain Current *
T
c
=25°C
T
c
=25°C
T
c
=100°C
T
c
=25°C
T
c
=100°C
400**
100
A
A
I
D
Continuous Drain Current
70
A
200
W
P
D
Maximum Power Dissipation
100
W
R
T
J
C
R
T
J
A
E
AS
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient **
SinglePulsed-Avalanche Energy ***
0.75
62.5
407***
°C/W
°C/W
mJ
L=0.3 mH
Note:
*
Repetitive rating
˗
pulse width limited by max.junction temperature.
** Surface
mounted on 1in2 FR-4 board.
*** Limited
by T
J
max , starting T
J
=25°C
, L =
0.3mH
, R
G
= 25
Ω
,
V
GS
=10V
.
Electrical Characteristics
(Tc =25°C Unless Otherwise Noted)
HY3008
Symbol
Parameter
Test Conditions
Unit
Min
Typ.
Max
Static Characteristics
V
GS
=
0V
,I
DS
= 250
μ
A
BV
DSS
Drain-Source Breakdown Voltage
80
–
–
–
–
1
V
V
DS
=
80
V
,
V
GS
=0V
μ
A
μ
A
V
I
DSS
Drain-to-Source Leakage Current
T
J
=125°C
–
–
50
4
V
DS
=V
GS
, I
DS
= 250
μ
A
V
GS
=
f
25
V
,
V
DS
=0V
V
GS
= 10V,I
DS
= 50A
V
GS(th)
I
GSS
Gate Threshold Voltage
2
–
3
Gate-Source Leakage Current
Drain-Source On-State Resistance
–
±100
8.5
nA
m
Ω
R
DS(ON)
–
6.6
Diode Characteristics
Diode Forward Voltage
I
SD
=50A,V
GS
=0V
–
–
–
0.8
62
1
–
V
V
SD
t
rr
Reverse Recovery Time
Reverse Recovery Charge
ns
nC
I
SD
=50A,dI
SD
/dt
=100A/
μ
s
Q
rr
127
–
V1.0
2
HY3008P/M/B/ MF /PL/PM
Electrical Characteristics (Cont.)
(Tc =25°C Unless Otherwise Noted)
HY3008
Typ.
Symbol
Parameter
Test Conditions
Unit
Min
Max
Dynamic Characteristics
R
G
C
iss
C
oss
C
rss
t
d(ON)
T
r
Gate Resistance
V
GS
=0V
,
V
DS
=0V,F=1MHz
V
GS
=
0V
,
–
–
–
–
–
–
–
1.0
3150
440
199
23
–
–
–
–
–
–
–
–
Ω
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Turn-on Rise Time
Turn-off Delay Time
Turn-off Fall Time
V
DS
=
25V
,
pF
Frequency=1.0MHz
39
V
DD
= 40V,
R
G
=3
Ω
,
ns
I
DS
= 50A,V
GS
= 10V
t
d(OFF)
T
f
55
33
Gate Charge
Characteristics
Q
g
Q
gs
Q
gd
Total Gate Charge
–
–
–
67
14
22
–
–
–
V
DS
= 64V, V
GS
= 10V,
I
D
s
= 50A
nC
Gate-Source Charge
Gate-Drain Charge
Note: *Pulse test
ˈ
pulse width
≤
300us
ˈ
duty cycle
≤
2%
V1.0
3
HY3008P/M/B/ MF /PL/PM
Typical Operating Characteristics
Figure 1: Power Dissipation
Figure 2: Drain Current
T
c
-Case
T
emperature(
ć
)
T
c
-Case
T
emperature(
ć
)
Figure 3: Safe Operation Area
Figure 4: Thermal Transient Impedance
V
DS
-Drain-Source Voltage(V)
Maximum Effective Transient Thermal
Impedance, Junction-to-Case
Figure 5: Output Characteristics
Figure 6: Drain-Source On Resistance
V
DS
-Drain-Source Voltage (V)
I
D
-Drain Current(A)
V1.0
4
HY3008P/M/B/ MF /PL/PM
Typical Operating Characteristics(Cont.)
Figure 7: On-Resistance vs. Temperature
Figure 8: Source-Drain Diode Forward
Tj-Junction
T
e
mperature (
ć
)
V
SD
-Source-Drain Voltage(V)
Figure 9: Capacitance Characteristics
Figure 10: Gate Charge Characteristics
V
DS
-Drain-Source Voltage (V)
Q
G
-Gate Charge (
Q&
)
V1.0
5
HY3008P/M/B/ MF /PL/PM
Avalanche Test Circuit
Switching Time Test Circuit
Gate Charge Test Circuit
V1.0
6
HY3008P/M/B/ MF /PL/PM
Device Per Unit
Package Type
Unit
Quantity
TO-220FB-3L
Tube
50
Package Information
TO-220FB-3L
COMMON DIMENSIONS
mm
NOM
4.57
SYMBOL
MIN
4.37
1.25
2.20
0.70
1.17
0.40
15.10
8.80
5.50
9.70
7.00
MAX
4.77
1.45
2.60
0.95
1.47
0.65
16.10
9.40
–
A
A1
A2
b
1.30
2.40
0.80
b2
c
1.27
0.50
D
15.60
9.10
D1
D2
E
–
10.00
–
10.30
–
E3
e
2.54 BSC
5.08 BSC
6.50
e1
H1
L
6.25
12.75
–
6.85
13.80
3.40
3.80
3.00
13.50
3.10
L1
Φ
P
Q
3.40
2.60
3.60
2.80
V1.0
7
HY3008P/M/B/ MF /PL/PM
Device Per Unit
Package Type
Unit
Quantity
TO-220FB-3S
Tube
50
Package Information
TO-220FB-3S
COMMON DIMENSIONS
mm
NOM
4.57
SYMBOL
MIN
4.37
1.25
2.20
0.70
1.17
0.40
15.10
8.10
5.50
9.70
7.00
MAX
4.77
1.45
2.60
0.95
1.47
0.65
16.10
9.40
–
A
A1
A2
b
1.30
2.40
0.80
b2
c
1.27
0.50
D
15.60
9.10
D1
D2
E
–
10.00
–
10.30
–
E3
e
2.54 BSC
5.08 BSC
6.50
e1
H1
L
6.25
6.80
–
6.85
7.20
3.40
3.80
3.00
7.00
L1
Φ
P
Q
3.10
3.40
2.60
3.60
2.80
V1.0
8
HY3008P/M/B/ MF /PL/PM
Device Per Unit
Package Type
Unit
Quantity
TO-263-2L
Reel
50
Package Information
TO-263-2L
COMMON DIMENSIONS
mm
NOM
4.57
1.27
2.69
0.13
0.81
1.27
0.38
8.7
SYMBOL
MIN
4.37
1.22
2.49
0
MAX
4.77
1.42
2.89
0.25
0.96
1.47
0.53
8.9
A
A1
A2
A3
b
0.7
b1
c
1.17
0.3
D1
D4
E
8.5
6.6
–
–
9.86
7.06
10.16
–
10.36
–
E5
e
2.54 BSC
15.1
1.27
2.3
H
14.7
1.07
2
15.5
1.47
2.6
H2
L
L1
L4
θ
1.4
1.55
0.25 BSC
5°
1.7
0°
9°
V1.0
9
HY3008P/M/B/ MF /PL/PM
Device Per Unit
Package Type
Unit
Quantity
TO-220MF-3L
Tube
50
Package Information
TO-220MF-3L
COMMON DIMENSIONS
mm
NOM
10.16
4.70
SYMBOL
MIN
9.96
4.50
2.34
0.30
2.56
0.40
1.20
15.57
MAX
10.36
4.90
2.74
0.60
2.96
0.65
1.35
16.17
E
A
A1
A2
A4
c
2.54
0.45
2.76
0.50
c1
D
1.30
15.87
6.70REF
2.54BSC
12.98
3.03
H1
e
L
12.68
2.93
3.03
3.15
3.15
1.25
1.18
0.70
13.28
3.13
3.38
3.65
3.45
1.55
1.43
0.95
L1
Φ
P
Φ
P3
F3
G3
b1
b2
3.18
3.45
3.30
1.35
1.28
0.80
V1.0
10
HY3008P/M/B/ MF /PL/PM
Device Per Unit
Package Type
Unit
Quantity
TO-3PM-3L
Tube
50
Package Information
TO-3PM-3L
V1.0
11
HY3008P/M/B/ MF /PL/PM
Device Per Unit
Package Type
Unit
Quantity
TO-3PM-3S
Tube
50
Package Information
TO-3PM-3S
V1.0
12
HY3008P/M/B/ MF /PL/PM
Classification Profile
Classification Reflow Profiles
Profile Feature
Preheat & Soak
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
150 °C
200 °C
Temperature min (T
smin
)
Temperature max (T
smax
)
60-120 seconds
60-120 seconds
Time (Tsmin to Tsmax) (t
Average ramp-up rate
s
)
3 °C/second max.
3°C/second max.
(T
smax
to T
Liquidous temperature (T
Time at liquidous (t
Peak package body Temperature
(T )*
Time (t
classification temperature (T
Average ramp-down rate (T to T
smax
Time 25°C to peak temperature
P
)
L
)
183 °C
217 °C
L
)
60-150 seconds
60-150 seconds
See Classification Temp in table 1
SeeClassification Tempin table 2
p
P
)** within 5°C of the specified
20** seconds
30** seconds
c
)
p
)
6 °C/second max.
6 minutes max.
6 °C/second max.
8 minutes max.
*Tolerance for peak profile Temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
V1.0
13
HY3008P/M/B/ MF /PL/PM
T
a
ble 1.SnPb Eutectic Process
–
Classification
T
emperatures (Tc)
Package
Thickness
˘
2.5 mm
≥
2.5 mm
Volume mm
Ϣ
<350
Volume mm
Ϣ
ı
350
235 °C
220 °C
220 °C
220 °C
T
a
ble 2.Pb-free Process
–
Classification
T
emperatures (
T
c
)
Package
Thickness
<1.6 mm
Volume mm
Ϣ
<350
Volume mm
Ϣ
350-2000
260 °C
Volume mm
Ϣ
ı
2000
260 °C
260 °C
1.6 mm
–
2.5 mm
ı
2.5 mm
260 °C
250 °C
245 °C
250 °C
245 °C
245 °C
Reliability Test Program
Test item
SOLDERABILITY
HTRB
Method
Description
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
5 Sec, 245°C
168 Hrs /500 Hrs /1000 Hrs, Bias @ 150°C
96 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -55°C~150°C
PCT
TCT
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V1.0
14
