HUAYI-HY3704P

Part #HUAYI-HY3704P
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HUAYI-HY3704P
HY3704P/B  
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
•
40V/176A  
R

DS(ON)

=
3.0
m

(typ.) @ V

GS

=10V  
•
•
•
100% avalanche tested  
Reliable and Rugged  
S
D
G
Lead Free and Gree
n
D
evice
s
A
vailable  
(RoHS Compliant)  
S
D
G
TO-220FB-3L  
TO-263-2L  
Applications  
•
•
Switching application  
Power Management for
 
DC/DC  
N-Channel MOSFET  
Ordering and Marking Information  
Package Code  
P : TO-220FB-3L  
P
B
B: TO-263-2L  
HY3704  
HY3704  
Assembly Material  
G : Lead Free Device  
Date Code  
YYXXX WW  
YYXXXJWW G  
YYXXXJWW G  
Note: HUAYI lead-free products contain molding compounds/die attach materials and 100% matte tin plateTermi-  
Nation finish; which are fully compliant with RoHS. HUAYI lead-free products meet or exceed the lead-Free require-  
ments of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HUAYI defines
“
Green
”  
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous  
material and total of Br and Cl does not exceed 1500ppm by weight).  
HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to this pr  
-oduct and/or to this document at any time without notice.  
1
V1.0  

HY3704P/B  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings
(T

C

=25°C Unless Otherwise Noted)  
V

DSS  

V

GSS  

T

J  

Drain-Source Voltage  
40  
±20  
V
Gate-Source Voltage  
Maximum Junction Temperature  
Storage Temperature Range  
Diode Continuous Forward Current  
175  
°C  
°C  
A
T

STG  

I

S  

-55 to 175  
176  
T

C

=25°C  
Mounted on Large Heat Sink  
I

DM  

Pulsed Drain Current *  
T

C

=25°C  
T

C

=25°C  
T

C

=100°C  
T

C

=25°C  
T

C

=100°C  
648**  
176  
120  
192  
96  
A
A
I

D  

Continuous Drain Current  
P

D  

Maximum Power Dissipation  
W
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
0.78  
62.5  
R

JC  

R

JA  

°C/W  
Avalanche Ratings  
E

AS

Avalanche Energ
y
,
S
ingle Pulsed  
Note
:
 
L=0.5mH  
1.09***  
J
*
Repetitive rating ; pulse width limiited by junction temperature  
** Drain
 
current is limited by junction temperature  
*** VD=32V  
Electrical Characteristics
 
(T

C

= 25
C Unless Otherwise Noted)  
HY3704  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BV

DSS

Drain-Source Breakdown Voltage  
40  
–
–
–
1
V
V

GS

=0V, I

DS

=250
A  
V

DS

=40V, V

GS

=0V  
–
–
I

DSS

Zero Gate Voltage Drain Current  
A  
T

J

=85°C  
–
10  
V

GS(th)

Gate Threshold Voltage  
I

GSS

Gate Leakage Current  
R

DS(ON)  

Diode Characteristics  
2.0  
–
3.0  
–
4.0  
±100  
3.6  
V
V

DS

=V

GS

, I

DS

=250
A  
V

GS

=±20V, V

DS

=0V  
nA  
m
  
*
Drain-Source On-state Resistance
 
V

GS

=10V, I

DS

=8
8
A  
–
3.0  
V

SD

*  
t

rr  

Diode Forward Voltage  
I

SD

=88 A, V

GS

=0V  
–
–
–
0.8  
28  
51  
1.2  
V
Reverse Recovery Time  
Reverse Recovery Charge  
–
–
ns  
nC  
I

SD

=8
8
A
, dl

SD

/dt=100A/
s  
Q

rr  

V1.0  
2

HY3704P/B  
Electrical Characteristics (Cont.)
 
(T

C

= 25
C Unless Otherwise Noted)  
HY3704  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Dynamic Characteristics  
R

G  

C

iss  

C

oss  

C

rss  

t

d(ON)  

T

r  

Gate Resistance  
V

GS

=0V,V

DS

=0V,F=1MHz  
–
–
–
–
–
–
–
–
1.1  
4427  
1028  
538  
28  
–
–
–
–
–
–
–
–
Input Capacitance  
V

GS

=0V,  
V

DS

=25V,  
Frequency=1.0MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
V

DD

=20V, R

G

=6
,  
18  
I

DS

=88A, V

GS

=10V,  
ns  
t

d(OFF)

Turn-off Delay Time  
T

f

Turn-off Fall Time  
Gate Charge Characteristics  
42  
54  
Q

g  

Q

gs  

Q

gd  

Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
–
–
–
122  
29  
–
–
–
V

DS

=32V, V

GS

=10V,  
I

DS

=88A  
nC  
35  
Note * : Pulse test ; pulse width
300
s, duty cycle
2%.  
V1.0  
3

HY3704P/B  
Typical Operating Characteristics  
Power Dissipation  
Drain Current  
275  
187  
175  
250  
200  
150  
100  
50  
limited by package  
150  
125  
100  
75  
50  
25  
T

C

=25

o

C  
0
T

C

=25

o

C,V

G

=10V  
0
0
20 40 60 80
 
100 120 140 160 180 200  
0
20 40 60 80
 
100 120 140 160 180 200  
T
c
–  
Temperature (°C)  
T
c
–
C
ase
T
emperature (°C)  
Case  
Safe Operation Area  
1000  
100us  
10ms  
100  
10  
1ms  
DC  
1
0.1  
1
10  
100  
400  
V

DS

– Drain – Source Voltage (V)  
Thermal Transient Impedance  
1
Duty =
 
0.5  
0.2  
0.1  
0.1  
0.05  
0.01  
0.02  
0.01  
0.001  
Single  
Mounted on minimum pad  
R

JA

: 62.5
 

o

C/W  
0.0001  
0.1  
0.0001  
0.001  
0.01  
1
10  
Square Wave Pulse Duration (sec)  
4
V1.0  

HY3704P/B  
Typical Operating Characteristics
(Cont.)  
Drain-Source On Resistance  
Output Characteristics  
400  
350  
300  
3.9  
3.5  
V

GS

= 5.5,6,7,8,9,10V  
V

GS

=10V  
5V  
250  
200  
150  
3.0  
2.5  
100  
50  
0
4.5V  
4V  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
0
40  
80  
120  
160  
200  
V
DS
– Drain – Source Voltage (V)  
I

D

–
D
rain Current (A)  
Drain-Source On Resistance  
Gate Threshold Voltage  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
8
I

DS

=88A  
I

DS

=250
A  
7
6
5
4
3
2
4
5
6
7
8
9
10  
-50 -25  
0
25 50 75
 
100 125 150 175  
V
GS
– Gate – Source Voltage (V)  
T
j
– Junction
T
emperature (°C)  
5
V1.0  

HY3704P/B  
Typical Operating Characteristics
(Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
175  
100  
V

GS

= 10V  
I

DS

= 88A  
T

j

=175

o

C  
10  
1
T

j

=25

o

C  
R

ON

@T

j

=25

o

C: 3.0m
 
0.1  
-50 -25  
0
25 50 75
 
100 125 150 175  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
T
j
– Junction
T
emperature (°C)  
V
SD
– Source-Drain Voltage (V)  
Capacitance  
Gate Charge  
10  
9
8
7
6
5
4
3
2
1
0
12000  
10500  
Frequency=1MHz  
V

DS

= 32V  
I

DS

= 88A  
9000  
7500  
6000  
4500  
3000  
1500  
0
Ciss  
Coss  
Crss  
0
25  
50  
75  
100  
125  
0
8
16  
24  
32  
40  
V
DS
– Drain – Source Voltage (V)  
Q

G

–
G
ate Charge (nC)  
6
V1.0  

HY3704P/B  
Avalanche Test Circuit  
V

DS  

L
V

DSX(SUS)  

t

p  

DUT  
V

DS  

I

AS  

R

G  

V

DD  

V

DD  

I

L  

tp  
E

AS  

0.01
Ω
 
t

AV  

Avalanche Test Circuit  
V

DS  

R

D  

V
DS  
DUT  
90%  
V

GS  

R

G  

V

DD  

10%  
V

GS  

tp  
t

d(on)

t

r  

t

d(off)

t

f  

7
V1.0  

HY3704P/B  
Package Information  
TO-220FB-3L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
4.37  
1.25  
2.20  
0.70  
1.17  
0.40  
15.10  
8.80  
5.50  
9.70  
7.00  
N
MAX  
4.77  
1.45  
2.60  
0.95  
1.47  
0.65  
16.10  
9.40  
–
A
A1  
A2  
b
4.57  
1.30  
2.40  
0.80  
b2  
c
1.27  
0.50  
D
15.60  
9.10  
D1  
D2  
E
–
10.00  
–
10.30  
–
E3  
e
2.54 BSC  
5.08 BSC  
6.50  
e1  
H1  
L
6.25  
12.75  
–
6.85  
13.80  
3.40  
3.80  
3.00  
13.50  
3.10  
L1  
ĭ3ꢀ  
Q
3.40  
2.60  
3.60  
2.80  
8
V1.0  

HY3704P/B  
TO-263-2L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
4.37  
1.22  
2.49  
0
N
MAX  
4.77  
1.42  
2.89  
0.25  
0.96  
1.47  
0.53  
8.9  
A
A1  
A2  
A3  
b
4.57  
1.27  
2.69  
0.13  
0.81  
1.27  
0.38  
8.7  
0.7  
b1  
c
1.17  
0.3  
D1  
D4  
E
8.5  
6.6  
–
–
9.86  
7.06  
10.16  
–
10.36  
–
E5  
e
2.54 BSC  
15.1  
1.27  
2.3  
H
14.7  
1.07  
2
15.5  
1.47  
2.6  
H2  
L
L1  
L4  
șꢀ  
1.4  
1.55  
0.25 BSC  
5°  
1.7  
0°  
9°  
V1.0  
9

HY3704P/B  
Devices Per Unit  
Package Type  
TO-220FB-3L  
TO-263-2L  
Unit  
Tube  
Tube  
Quantity  
50  
50  
Classification Profile  
10  
V1.0  

HY3704P/B  
Classification Reflow Profiles  
Profile Feature  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
Preheat & Soak  
100
C  
150
C  
60-120 seconds  
150
C  
200
C  
60-120 seconds  
Temperature min (T

smin  

)
Temperature max (T

smax  

)
Time (T

smin

to T

smax

) (t

s

)  
Average ramp-up rate  
(T

smax

to T

P

)  
3
C/second max.  
3
C/second max.  
Liquidous temperature (T

L

)  
Time at liquidous (t

L

)  
183
C  
60-150 seconds  
217
C  
60-150 seconds  
Peak package body Temperature  
(T

p

)*  
See Classification Temp in table 1  
20** seconds  
See Classification Temp in table 2  
30** seconds  
Time (t

P

)** within 5
C of the specified  
classification temperature (T

c

)  
Average ramp-down rate (T

p

to T

smax  

)
6
C/second max.  
6
C/second max.  
6 minutes max.  
8 minutes max.  
Time 25
C to peak temperature  
* Tolerance for peak profile Temperature (T

p

) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (t

p

) is defined as a supplier minimum and a user maximum.  
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)  
Volume mm

3  

Package  
Thickness  
Volume mm

3  

<350  
≥
350  
<2.5 mm  
235
C  
220
C  
220
C  
2.5 mm  
220
C  
Table 2. Pb-free Process – Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm

3  

Volume mm

3  

350-2000  
260
C  
Volume mm

3  

<350  
260
C  
260
C  
250
C  
>2000  
260
C  
245
C  
245
C  
1.6 mm – 2.5 mm  
2.5 mm  
250
C  
245
C  
Reliability Test Program  
Test item  
SOLDERABILITY  
Method  
Description  
JESD-22, B102  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
5 Sec, 245°C  
HTRB  
PCT  
168 Hrs /500 Hrs /1000 Hrs, Bias @ 150°C  
96 Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -55°C~150°C  
TCT  
Customer Service  
Worldwide Sales and Service: sales@hymexa.com  
T
e
chnical Support:
 
T
e

Xi’an Huayi Microelectronics Co., Ltd.  
No.8928,Shangji Road,Economic and
T
e
chnological Development Zone,Xi’an,China  
TEL: (86-029) 86685706  
FAX: (86-029) 86685705  
E-mail: sales@hymexa.com  
V1.0  
11