HUAYI-HY4306B

Part #HUAYI-HY4306B
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HUAYI-HY4306B
HY4306P/B  
N-Channel Enhancement Mode MOSFET  
Features  
Pin Description  
•
60V/230A  
R

DS(ON)

=
2.6
m

(typ.) @ V

GS

=10V  
•
•
•
100% avalanche tested  
Reliable and Rugged  
S
D
G
S
D
Lead Free and Gree
n
D
evice
s
A
vailable  
(RoHS Compliant)  
G
TO-220FB-3L  
TO-263-2L  
Applications  
Switching application  
Power Management for Inverter Systems.  
N-Channel MOSFET  
Ordering and Marking Information  
Package Code  
P : TO-220FB-3L  
P
B
B: TO-263-2L  
HY4306  
HY4306  
Assembly Material  
G : Lead Free Device  
Date Code  
YYXXX WW  
YYXXXJWW G  
YYXXXJWW G  
Note: HUAYI lead -free products contain molding compounds/die attach materials and 100% matte tin plate  
Termination finish;which are fully compliant with RoHS. HUAYI lead -free products meet or exceed the lead-  
Free requirements of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature.  
HUAYI defines
 
“Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed  
900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).  
HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to  
this pr-oduct and/or to this document at any time without notice.  
V1.0  
1

HY4306P/B  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
Common Ratings
(T

C

=25°C Unless Otherwise Noted)  
V

DSS  

V

GSS  

T

J  

Drain-Source Voltage  
60  
±25  
V
Gate-Source Voltage  
Maximum Junction Temperature  
Storage Temperature Range  
Diode Continuous Forward Current  
175  
°C  
°C  
A
T

STG  

I

S  

-55 to 175  
230  
T

C

=25°C  
Mounted on Large Heat Sink  
I

DM  

Pulsed Drain Current *  
T

C

=25°C  
T

C

=25°C  
T

C

=100°C  
T

C

=25°C  
T

C

=100°C  
880**  
230  
A
A
I

D  

Continuous Drain Current  
155  
258  
P

D  

Maximum Power Dissipation  
W
129  
Thermal Resistance-Junction to Case  
Thermal Resistance-Junction to Ambient  
0.58  
62.5  
R

JC  

R

JA  

°C/W  
Avalanche Ratings  
E

AS

Avalanche Energ
y
,
S
ingle Pulsed  
Note
:
 
L=0.5mH  
1.4***  
J
*
Repetitive rating ; pulse width limiited by junction temperature  
** Drain
 
current is limited by junction temperature  
*** VD=48V  
Electrical Characteristics
 
(T

C

= 25
C Unless Otherwise Noted)  
HY4306  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Static Characteristics  
BV

DSS

Drain-Source Breakdown Voltage  
60  
–
–
–
1
V
V

GS

=0V, I

DS

=250
A  
V

DS

=60V, V

GS

=0V  
–
–
I

DSS

Zero Gate Voltage Drain Current  
A  
T

J

=85°C  
–
10  
V

GS(th)

Gate Threshold Voltage  
I

GSS

Gate Leakage Current  
R

DS(ON)  

Diode Characteristics  
2.0  
–
3.0  
–
4.0  
±100  
3.0  
V
V

DS

=V

GS

, I

DS

=250
A  
V

GS

=±25V, V

DS

=0V  
nA  
m
  
*
Drain-Source On-state Resistance
 
V

GS

=10V, I

DS

=115 A  
–
2.6  
V

SD

*  
t

rr  

Diode Forward Voltage  
I

SD

=115A, V

GS

=0V  
–
–
–
0.8  
48  
72  
1.2  
V
Reverse Recovery Time  
Reverse Recovery Charge  
–
–
ns  
nC  
I

SD

=115 A,dl

SD

/dt=100A/
s  
Q

rr  

V1.0  
2

HY4306P/B  
Electrical Characteristics (Cont.)
 

(T

C

= 25
C Unless Otherwise Noted)  

HY4306  
Symbol  
Parameter  
Test Conditions  
Unit  
Min. Typ. Max.  
Dynamic Characteristics  
R

G  

C

iss  

C

oss  

C

rss  

t

d(ON)  

T

r  

Gate Resistance  
V

GS

=0V,V

DS

=0V,F=1MHz  
–
–
–
–
–
–
–
–
2.2  
7219  
1093  
558  
26  
–
–
–
–
–
–
–
–
Input Capacitance  
V

GS

=0V,  
V

DS

=25V,  
Frequency=1.0MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Turn-on Rise Time  
V

DD

=30V, R

G

=6
,  
I

DS

=115A,
V

GS

=10V,  
18  
ns  
t

d(OFF)

Turn-off Delay Time  
T

f

Turn-off Fall Time  
Gate Charge Characteristics  
40  
54  
Q

g  

Q

gs  

Q

gd  

Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
–
–
–
171  
30  
–
–
–
V

DS

=48V, V

GS

=10V,  
I

DS

=115A  
nC  
63  
Note * : Pulse test ; pulse width
300
s, duty cycle
2%.  
V1.0  
3

HY4306P/B  
Typical Operating Characteristics  
Drain Current  
Power Dissipation  
250  
225  
200  
350  
limited by package  
300  
250  
200  
150  
100  
50  
175  
150  
125  
100  
75  
50  
T

C

=25

o

C,V

G

=10V  
T

C

=25

o

C  
0
25  
0
20 40 60 80
 
100 120 140 160 180 200  
0
20 40 60 80
 
100 120 140 160 180 200  
T

C

–  
Temperature (°C)  
T

C

– Case
T
emperature (°C)  
Case  
Safe Operation Area  
1000  
t
i
m
i
100us  
1ms  
) L  
100  
10  
1
s(on  
Rd  
10ms  
DC  
T

C

=25

o

C  
0.1  
0.01  
0.1  
1
10  
100 300  
V

DS

– Drain – Source Voltage (V)  
Thermal Transient Impedance  
10  
1
Duty =
 
0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
0.01  
0.01  
Single  
Mounted on minimum pad  
R

JA

: 62.5

o

C/W  
0.001  
0.1  
0.0001  
0.001  
0.01  
1
10  
Square Wave Pulse Duration (sec)  
4
V1.0  

HY4306P/B  
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Output Characteristics  
400  
350  
300  
4.5  
4.0  
V

GS

= 5.5,6,7,8,9,10V  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
5V  
250  
V

GS

=10V  
200  
150  
100  
50  
0
4.5V  
4V  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
0
50  
100  
150  
200  
2
5
0  
V

DS

– Drain – Source Voltage (V)  
I

D

–
D
rain Current (A)  
Gate-Source On Resistance  
Gate Threshold Voltage  
7
6
5
4
3
2
1
0
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I

DS

=250
μ
A  
I

DS

= 115A  
-50 -25  
0
25 50 75
 
100 125 150  
3
4
5
6
7
8
9
10  
V

GS

– Gate – Source Voltage (V)  
T

j

– Junction
T
e
mperature (
°
C)  
5
V1.0  

HY4306P/B  
Typical Operating Characteristics (Cont.)  
Drain-Source On Resistance  
Source-Drain Diode Forward  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
200  
100  
V

GS

= 10V  
I

DS

= 115A  
T

j

=25

o

C  
10  
T

j

=150

o

C  
1
R

ON

@T

j

=25

o

C: 2.6m
Ω  
0.1  
-50 -25  
0
25 50 75
 
100 125 150  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
T

j

– Junction
T
emperature (
°
C)  
V

SD

– Source – Drain Voltage (V)  
Capacitance  
Gate Charge  
10  
12000  
10500  
Frequency=1MHz  
V

DS

= 48V  
I

DS

= 115A  
9
8
7
6
5
4
3
2
1
0
9000  
7500  
6000  
4500  
3000  
1500  
0
Ciss  
Coss  
Crss  
0
35  
75  
105  
140  
175  
0
8
16  
24  
32  
40  
V

DS

– Drain – Source Voltage (V)  
Q

G

–
G
ate Charge (nC)  
6
V1.0  

HY4306P/B  
Avalanche Test Circuit  
Switching Time Test Circuit  
Gate Charge Test Circuit  
7
V1.0  

HY4306P/B  
Device Per Unit  
Package Type  
Unit  
Quantity  
TO-220FB-3L  
Tube  
50  
Package Information  
TO-220FB-3L  
COMMON DIMENSIONS  
mm  
NOM  
4.57  
SYMBOL  
MIN  
4.37  
1.25  
2.20  
0.70  
1.17  
0.40  
15.10  
8.80  
5.50  
9.70  
7.00  
MAX  
4.77  
1.45  
2.60  
0.95  
1.47  
0.65  
16.10  
9.40  
–
A
A1  
A2  
b
1.30  
2.40  
0.80  
b2  
c
1.27  
0.50  
D
15.60  
9.10  
D1  
D2  
E
–
10.00  
–
10.30  
–
E3  
e
2.54 BSC  
5.08 BSC  
6.50  
e1  
H1  
L
6.25  
12.75  
–
6.85  
13.80  
3.40  
3.80  
3.00  
13.50  
3.10  
L1  
Φ
P  
Q
3.40  
2.60  
3.60  
2.80  
8
V1.0  

HY4306P/B  
Device Per Unit  
Package Type  
Unit  
Quantity  
TO-263-2L  
Reel  
50  
Package Information  
TO-263-2L  
COMMON DIMENSIONS  
mm  
SYMBOL  
MIN  
4.37  
1.22  
2.49  
0
NOM  
4.57  
1.27  
2.69  
0.13  
0.81  
1.27  
0.38  
8.7  
MAX  
4.77  
1.42  
2.89  
0.25  
0.96  
1.47  
0.53  
8.9  
A
A1  
A2  
A3  
b
0.7  
b1  
c
1.17  
0.3  
D1  
D4  
E
8.5  
6.6  
–
–
9.86  
7.06  
10.16  
–
10.36  
–
E5  
e
2.54 BSC  
15.1  
1.27  
2.3  
H
14.7  
1.07  
2
15.5  
1.47  
2.6  
H2  
L
L1  
L4  
θ
1.4  
1.55  
0.25 BSC  
5°  
1.7  
0°  
9°  
9
V1.0  

HY4306P/B  
Classification Profile  
Classification Reflow Profiles  
Profile Feature  
Preheat & Soak  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
100
C  
150
C  
60-120 seconds  
150
C  
200
C  
60-120 seconds  
Temperature min (T

smin  

)
Temperature max (T

smax  

)
Time (T

smin

to T

smax

) (t

s

)  
Average ramp-up rate  
(T

smax

to T

P

)  
3
C/second max.  
3
C/second max.  
Liquidous temperature (T

L

)  
Time at liquidous (t

L

)  
183
C  
60-150 seconds  
217
C  
60-150 seconds  
Peak package body Temperature  
(T

p

)*  
See Classification Temp in table 1  
20** seconds  
See Classification Temp in table 2  
30** seconds  
Time (t

P

)** within 5
C of the specified  
classification temperature (T

c

)  
Average ramp-down rate (T

p

to T

smax  

)
6
C/second max.  
6
C/second max.  
6 minutes max.  
8 minutes max.  
Time 25
C to peak temperature  
* Tolerance for peak profile Temperature (T

p

) is defined as a supplier minimum and a user maximum.  
** Tolerance for time at peak profile temperature (t

p

) is defined as a supplier minimum and a user maximum.  
10  
V1.0  

HY4306P/B  
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)  
Volume mm

3  

<350  
Volume mm

3  

Package  
Thickness  
≥
350  
<2.5 mm  
235
C  
220
C  
220
C  
2.5 mm  
220
C  
Table 2. Pb-free Process – Classification Temperatures (Tc)  
Package  
Thickness  
<1.6 mm  
Volume mm

3  

<350  
Volume mm

3  

350-2000  
260
C  
Volume mm

3  

>2000  
260
C  
245
C  
245
C  
260
C  
260
C  
250
C  
1.6 mm – 2.5 mm  
2.5 mm  
250
C  
245
C  
Reliability Test Program  
Test item  
SOLDERABILITY  
Method  
JESD-22, B102  
Description  
5 Sec, 245°C  
HTRB  
PCT  
JESD-22, A108  
JESD-22, A102  
JESD-22, A104  
16
8
H
rs /500 Hrs /1000 Hrs, Bias @
1
5
0
°
C  
96Hrs, 100%RH, 2atm, 121°C  
500 Cycles, -55°C~150°C  
TCT  
Customer Service  
Worldwide Sales and Service: sales@hymexa.com  
T
e
chnical Support:
T
e

Xi’an Huayi Microelectronics Co., Ltd.  
No.8928,Shangji Road,Economic and
T
echnological Development Zone,Xi’an,China  
TEL: (86-029) 86685706  
FAX: (86-029) 86685705  
E-mail: sales@hymexa.com  
11  
V1.0