HXY-MOSFET-AO4410-HXY

Part #HXY-MOSFET-AO4410-HXY
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HXY-MOSFET-AO4410-HXY
HUAXUANYANG  
HXY  
AO4410  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Description  
The  
uses advanced trench technology  
AO4410  
to provide excellent R

DS(ON)

, low gate charge and  
operation with gate voltages as low as 4.5
V
. This  
device is suitable for use as a  
D
D
D
D
G
S
S
S
Battery protection or in other Switching application.  
SOP-8  
General Features  
V

DS

= 30V
 
I

D

=15 A  
PIN2 D  
R

DS(ON)

< 9mΩ
 
@ V

GS

=10V  
!
R

DS(ON)

< 14mΩ
 
@ V

GS

=4
.
5V  
“
! ”  
“
!
PIN1 G  
“
Application  
!
PIN3 S  
Battery protection  
Load switch  
N-Channel MOSFET  
Uninterruptible power supply  
Package Marking and Ordering Information  
Product ID  
Pack  
Marking  
Qty(PCS)  
AO4410  
SOP-8  
4410 XXX YYYY  
3000  
Absolute Maximum Ratings (T

C

=25
℃
unless otherwise noted)  
Symbol  
V
DS  
Parameter  
Limit  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
30  
V
±20  
V
A
V
GS  
Drain Current-Continuous  
15.0  
I

D  

8.2  
A
A
I

D

(7
0
℃
)  
Drain Current-Continuous(T

C

=70
℃
)  
Pulsed Drain Current  
42  
1.5  
I
DM  
Maximum Power Dissipation  
W
P

D  

E
AS  
Single pulse avalanche energy

(Note 5)  

Operating Junction and Storage
T
e
mperature Range  
Thermal Resistance,Junction-to-Case

(Note 2)  

62  
mJ  
℃
-55
T
o
1
50  
36  
T
J
,T
STG  
R
θJC  
℃
/W  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
AO4410  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV

DSS  

Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Min.  
30  
—  
—  
—  
1.2  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
△
BV

DSS

/
△
T

J  

Reference to 25
℃
, I

D

=1mA  
V

GS

=10V , I

D

=10A  
0.027  
7.5  
11  
—  
V/
℃  
9
R

DS(ON)  

Static Drain-Source On-Resistance

2  

m
 
V

GS

=4.5V , I

D

=8A  
14  
V

GS(th)  

Gate Threshold Voltage  
1.5  
-5.8  
—  
2.5  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

Temperature Coefficient  
mV/
℃  
V

DS

=24V , V

GS

=0V , T

J

=25
℃  
V

DS

=24V , V

GS

=0V , T

J

=55
℃  
1
I

DSS  

Drain-Source Leakage Current  
uA  
—  
5
V

GS

=
±
20V , V

DS

=0V  
I

GSS  

gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
±
100  
—  
nA  
S
V

DS

=5V , I

D

=10A  
5.8  
2.2  
12.6  
4.2  
5.1  
6.2  
59  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
3.8  
17.6  
5.9  
7.1  
12.4  
106  
55  
Q

g  

Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
V

DS

=15V , V

GS

=4.5V , I

D

=10A  
nC  
ns  
Q

gs  

Q

gd  

T

d(on)  

T

r  

V

DD

=15V , V

GS

=10V , R

G

=3.3
  
I

D

=10A  
T

d(off)  

T

f  

Turn-Off Delay Time  
Fall Time  
27.6  
8.4  
1317  
163  
131  
16.8  
1845  
228.2  
183.4  
C

iss  

C

oss  

C

rss  

Input Capacitance  
V

DS

=15V , V

GS

=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
V

G

=V

D

=0V , Force Current  
V

GS

=0V , I

S

=1A , T

J

=25
℃  
Min.  
—  
Typ.  
—  
Max.  
10.3  
42  
Unit  
A
I

S  

I

SM  

V

SD  

t

rr  

Continuous Source Current

1,5  

Pulsed Source Current

2,5  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
—  
—  
A
—  
—  
1.2  
—  
V
—  
12.5  
5
nS  
nC  
I
F
=10A , dI/dt=100A/µs , T

J

=25
℃  
Q

rr  

—  
—  
Note :  
1.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width
 
≦
300us , duty cycle
 
≦
2%  
3.The EAS data shows Max. rating . The test condition is V

DD

=25V,V

GS

=10V,L=0.1mH,I

AS

=35A  
4.The power dissipation is limited by 150
℃
junction temperature  
5.The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
AO4410  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Typical Characteristics  
12  
11  
9
42  
35  
28  
21  
14  
7
I

D

=10A  
V

GS

=10V  
V

GS

=7V  
V

GS

=5V  
V

GS

=4.5V  
V

GS

=3V  
8
6
0
2
4
6
8
10  
0
0.5  
1
1.5  
2
2.5  
3
V

DS

, Drain-to-Source Voltage (V)  
V

GS

(V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. Gate-Source  
12  
10  
8
T

J

=150
℃
T

J

=25
℃  
6
4
2
0
0
0.3  
0.6  
0.9  
V

SD

, Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics of reverse  
Fig.4 Gate-Charge Characteristics  
1.8  
1.4  
1.0  
0.6  
0.2  
1.8  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T

J

,Junction Temperature (
℃
)  
T

J

, Junction Temperature (
℃
)  
Fig.5 Normalized V

GS(th)

vs. T

J  

Fig.6 Normalized R

DSON

vs. T

J  

Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
AO4410  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
10000  
1000  
100  
100.00  
10.00  
1.00  
F=1.0MHz  
Ciss  
100us  
1ms  
10ms  
Coss  
Crss  
100ms  
0.10  
DC  
T

A

=25

o

C  
Single Pulse  
10  
0.01  
1
5
9
13  
17  
21  
25  
0.01  
0.1  
1
10  
100  
V

DS

, Drain to Source Voltage (V)  
V

DS

(V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.01  
0.05  
0.01  
P

DM  

T

ON  

T
D =
T

ON

/T  
SINGLE  
T

Jpeak

=
T

C

+P

D
M

XR

θJC  

0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
1
2
BV

DSS  

BV

DSS

-V

DD  

EAS=  
BV

DSS  

L x I

AS

2

x  
V

DS  

90%  
V

DD  

I

AS  

10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

V

GS  

Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Switching Waveform  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
AO4410  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
SO
P-8
Package Outline Dimensions  
Dimensions In Millimeters  
Dimensions In Inches  
Sy
m
bo l  
M
i
n  
1.350  
0.100  
1.
3
50  
0.330  
0.170  
4.800  
Max  
1.
7
50  
0.250  
1.5
5
0  
0.510  
0.250  
5.000  
M
i
n  
0.053  
0.004  
0.0
53  
0.013  
0.007  
0.189  
Max  
0.069  
0.010  
0.0
61  
0.020  
0.010  
0.197  
A
A1  
A2  
b
c
D
e
1.270(BSC)  
0.050(BSC)  
E
5.800  
3.800  
0.400  
0°  
6.200  
4.000  
1.270  
8°  
0.228  
0.150  
0.016  
0°  
0.244  
0.157  
0.050  
8°  
E1  
L
θ
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
AO4410  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Attention  
■ Any and all HUA XUAN YANG ELECTRONICS products described or contained herein do not have specifications that can handle  
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications  
whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your HUA XUAN YANG  
ELECTRONICS representative nearest you before using any HUA XUAN YANG ELECTRONICS products described or contained herein  
in such applications.  
■ HUA XUAN YANG ELECTRONICS assumes no responsibility for equipment failures that result from using products at values that  
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products  
specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein.  
■ Specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein stipulate the performance,  
characteristics, and functions of the described products in the independent state, and are not guarantees of the performance,  
characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and  
states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the  
customer’s products or equipment.  
■ HUA XUAN YANG ELECTRONICS CO.,LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor  
products fail with some probability. It is possible that these probabilistic failures could  
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other  
property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures  
include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design.  
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are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the  
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XUAN YANG ELECTRONICS CO.,LTD.  
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production.  
HUA XUAN YANG ELECTRONICS believes information herein is accurate and reliable, but no guarantees are made or implied regarding  
its use or any infringements of intellectual property rights or other rights of third parties.  
■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc.  
When designing equipment, refer to the “Delivery Specification” for the HUA XUAN YANG ELECTRONICS product that you intend to use.  
Shenzhen HuaXuanYang Electronics CO.,LTD