HXY-MOSFET-HXY3N10AI

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HXY-MOSFET-HXY3N10AI
HUAXUANYANG  
HXY  
HXY3N10
A
I  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Description  
The  
uses advanced trench technology  
HXY3N10
A
I  
to provide excellent R

DS(ON)

, low gate charge and  
operation with gate voltages as low as 4.5
V
. This  
device is suitable for use as a  
D
S
G
Battery protection or in other Switching application.  
SOT-23  
General Features  
V

DS

= 100V
 
I

D

=3 A  
PIN2 D  
!
R

DS(ON)

< 248mΩ @ V

GS

=10V  
Application  
“
! ”  
“
!
PIN1 G  
“
!
Battery protection  
PIN3 S  
N-Channel MOSFET  
Load switch  
Uninterruptible power supply  
Package Marking and Ordering Information  
Product ID  
Pack  
Marking  
Qty(PCS)  
SOT-23  
MA4  
3000  
HXY3N10
A
I  
Absolute Maximum Ratings (TC=25
℃
unless otherwise specified)  
Symbol  
Parameter  
Rating  
Units  
V
DS  
Drain-Source Voltage  
100  
V
V
V
GS  
±
20  
Gate-Sou
r
ce Voltage  
Continuous Drain Current, V

GS

@ 10V

1  

3
A
A
I

D

@T

A

=25
℃  
I

D

@T

A

=70
℃  
I
DM  
Continuous Drain Current, V

GS

@ 10V

1  

Pulsed Drain Current

2  

1
5
1
A
T
o
tal Power Dissipation

3  

W
P

D

@T

A

=25
℃  
T
STG  
Storage
T
e
mperature Range  
-55 to 150  
-55 to 150  
125  
℃
T

J  

Operating Junction
T
e
mperature Range  
Thermal Resistance Junction-ambient

1  

Thermal Resistance Junction-Case

1  

℃
R

θ

JA  
R

θ

JC  
℃
/W  
℃
/W  
80  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
HXY3N10
A
I  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Electrical Characteristics (T

J

=25
℃
, unless otherwise noted)  
Symbol  
BV
DSS  
Parameter  
Conditions  
V

GS

=0V , I

D

=250uA  
Reference to 25
℃
, I

D

=1mA  
V

GS

=10V , I

D

=1A  
Min.  
100  
—  
Typ.  
—  
Max.  
—  
Unit  
V
Drain-Source Breakdown Voltage  
BVDSS
T
e
mperature Coefficient  
0.067  
210  
244  
—  
△
BV
DSS
/
△
T
J  
V/
℃  
—  
248  
290  
R
DS(ON)  
Static Drain-Source On-Resistance

2  

V

GS

=4.5V , I

D

=0.5A  
—  
m
Ω
 
V
GS(th)  
Gate Threshold Voltage  
1.0  
—  
1.5  
2.5  
—  
V
V

GS

=V

DS

, I

D

=250uA  
△
V

GS(th)  

V

GS(th)

T
e
mperature Coefficient  
-4.2  
mV/
℃  
I
DSS  
I
DSS  
I
GSS  
gfs  
Drain-Source Leakage Current  
Drain-Source Leakage Current  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
1
5
uA  
uA  
nA  
S
V

DS

=80V , V

GS

=0V , T

J

=25
℃  
V

DS

=80V , V

GS

=0V , T

J

=25
℃  
V

GS

=
±
20V , V

DS

=0V  
—  
±
100  
—  
V

DS

=5V , I

D

=1A  
2.4  
2.8  
9.7  
1.6  
1.7  
1.6  
19  
R

g  

V

DS

=0V , V

GS

=0V , f=1MHz  
5.6  
13.6  
2.2  
2.4  
3.2  
34  
Q

g  

T
o
tal Gate Charge (10V)  
Gate-Source Charge  
Gate-Drain Charge  
Q
gs  
Q
gd  
T
d(on)  
T

r  

V

DS

=80V , V

GS

=10V , I

D

=1A  
nC  
ns  
Turn-On Delay Time  
V

DD

=50V , V

GS

=10V ,  
R

G

=3.3  
Rise Time  
T
d(off)  
T

f  

Turn-Off Delay Time  
13.6  
19  
27  
I

D

=1A  
Fall Time  
38  
C
iss  
C
oss  
C
rss  
I
S  
Input Capacitance  
508  
29  
711  
41  
Output Capacitance  
V

DS

=15V , V

GS

=0V , f=1MHz  
pF  
Reverse Transfer Capacitance  
Continuous Source Current

1,4  

Pulsed Source Current

2,4  

Diode Forward Voltage

2  

Reverse Recovery Time  
Reverse Recovery Charge  
16.4  
—  
23  
1.2  
5
A
A
V

G

=V

D

=0V , Force Current  
I
SM  
—  
V
SD  
t
rr  
—  
1.2  
—  
V
V

GS

=0V , I

S

=1A , T

J

=25
℃  
14  
nS  
nC  
I
F
=1A  
,
dI/dt=100A/µs  
,
Q

rr  

9.3  
—  
T

J

=25
℃  
Note :  
1
.The data tested by surface mounted on a 1 inch

2

FR-4 board with 2OZ copper.  
2
.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%  
3.The power dissipation is limited by 150
℃
junction temperature  
4 .The data is theoretically the same as I

D

and I

DM

, in real applications , should be limited by total power dissipation.  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
HXY3N10
A
I  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Typical Characteristics  
265  
260  
255  
250  
245  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
I

D

=1A  
V

GS

=10V  
V

GS

=7V  
V

GS

=5V  
V

GS

=4.5V  
V

GS

=3V  
2
4
6
8
10  
0
0.5  
1
1.5  
2
2.5  
V

DS

, Drain-to-Source Voltage (V)  
V

GS

(V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. Gate-Source  
2
1.6  
1.2  
0.8  
0.4  
0
T

J

=150
℃
 
T

J

=25
℃  
0
0.3  
0.6  
0.9  
V

SD

, Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-Charge Characteristics  
2.4  
1.8  
2.0  
1.6  
1.2  
0.8  
0.4  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T

J

,Junction Temperature (
℃
)  
T

J

, Junction Temperature (
℃
)  
Fig.6 Normalized R

DSON

vs. T

J  

Fig.5 Normalized V

GS(th)

vs. T

J  

Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
HXY3N10
A
I  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
1000  
100  
10  
100.00  
10.00  
1.00  
F=1.0MHz  
Ciss  
100us  
10ms  
100ms  
0.10  
1s  
Coss  
Crss  
0.01  
DC  
T

A

=25
℃
 
Single Pulse  
0.00  
1
5
9
13  
17  
21  
25  
0.1  
1
10  
V

DS

(V)  
100  
1000  
V

DS

Drain to Source Voltage (V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
0.01  
P

DM  

T

ON  

0.001 SINGLE
 
PULSE  
T
D = T

ON

/T  
T

Jpeak

= T

A

+
P

D
M

x R

θJA  

0.0001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
V

DS  

90%  
10%  
V

GS  

T

d(on)  

T

r  

T

on  

T

d(off)  

T

f  

T

off  

Fig.10 Switching Time Waveform  
Fig.11 Gate Charge Waveform  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
HXY3N10
A
I  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
SO
T
-23 Package Outline Dimensions  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min  
Max  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
Min  
Max  
0.045  
0.004  
0.041  
0.020  
0.006  
0.118  
0.055  
0.100  
A
A1  
A2  
b
c
D
E
E1  
e
e1  
L
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
0.035  
0.000  
0.035  
0.012  
0.003  
0.110  
0.047  
0.089  
0.950 T
Y
P  
0.550 REF  
0.037 T
Y
P  
0.022 REF  
1.800  
2.000  
0.071  
0.079  
L1  
θ
0.300  
0°  
0.500  
8°  
0.012  
0°  
0.020  
8
°  
SO
T
-23 Suggested Pad Layout  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
HXY3N10AI  
ELECTRONICS CO.,LTD  
N-Channel Enhancement Mode MOSFET  
Attention  
■ Any and all HUA XUAN YANG ELECTRONICS products described or contained herein do not have specifications that can handle  
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications  
whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your HUA XUAN YANG  
ELECTRONICS representative nearest you before using any HUA XUAN YANG ELECTRONICS products described or contained herein  
in such applications.  
■ HUA XUAN YANG ELECTRONICS assumes no responsibility for equipment failures that result from using products at values that  
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products  
specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein.  
■ Specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein stipulate the performance,  
characteristics, and functions of the described products in the independent state, and are not guarantees of the performance,  
characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and  
states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the  
customer’s products or equipment.  
■ HUA XUAN YANG ELECTRONICS CO.,LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor  
products fail with some probability. It is possible that these probabilistic failures could  
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other  
property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures  
include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design.  
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XUAN YANG ELECTRONICS CO.,LTD.  
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production.  
HUA XUAN YANG ELECTRONICS believes information herein is accurate and reliable, but no guarantees are made or implied regarding  
its use or any infringements of intellectual property rights or other rights of third parties.  
■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc.  
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Shenzhen HuaXuanYang Electronics CO.,LTD