HXY-MOSFET-IRF9388TRPBF-HXY

Part #HXY-MOSFET-IRF9388TRPBF-HXY
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HXY-MOSFET-IRF9388TRPBF-HXY
HUAXUANYANG  
HXY  
IRF9388TRPBF  
ELECTRONICS CO.,LTD  
P-Channel Enhancement Mode MOSFET  
Description  
The IRF9388TRPB
F
u
ses
 
advanced trench technology  
to provide excellent R

DS(ON)

, low gate charge and  
operation with gate voltages as low as 2.5
V
. This  
device is suitable for use as a  
D
D
D
D
G
S
S
S
Battery protection or in other Switching application.  
SOP-8  
General Features  
V

DS

= -30V
 
I

D

= -12A  
R

DS(ON)

< 13mΩ@ V

GS

=-10V  
Application  
D
G
Battery protection  
S
Load switch  
P-Channel MOSFET  
Uninterruptible power supply  
Package Marking and Ordering Information  
Product ID  
Pack  
Marking  
Qty(PCS)  
SOP-8  
4407 XXXX  
3000  
IRF9388TRPBF  
Absolute Maximum Ratings
(Tc=25
℃
unless otherwise noted )  
Symbol Parameter  
Drain-Source Voltage  
Rating  
-30  
Units  
V
DS  
V
GS  
V
V
A
Gate-Source Voltage  
+20  
Drain Current

3

, V

GS

@ 10V  
-12  
I

D

@T

A

=25
℃
 
I

D

@T

A

=70
℃  
Drain Current

3

, V

GS

@ 10V  
-9.1  
A
Pulsed Drain Current

1  

T
o
tal Power Dissipation  
-40  
2.5  
A
I
DM  
W
P

D

@T

A

=25
℃  
Storage
T
emperature Range  
-55 to 150  
-55 to 150  
50  
℃
℃
T
STG  
T

J  

Operating Junction
T
emperature Range  
Rthj-a  
Maximum Thermal Resistance, Junction-  
ambient

3  

℃
/W  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
IRF9388TRPBF  
ELECTRONICS CO.,LTD  
P-Channel Enhancement Mode MOSFET  
Electrical Characteristics@T

j

=25

o

C(unless otherwise specified)  
Symbol  
Parameter  
T
e
st Conditions  
Min. Typ. Max.
 
Units  
BV

DSS  

Drain-Source Breakdown Voltage
 
V

GS

=0
V
,
I

D

=-250uA  
-30  
–
–
–
V
R
DS(ON)  
Static Drain-Source On-  
Resistance

2  

V

GS

=-10
V
,
I

D

=-10A  
V

GS

=-4.5
V
,
I

D

=-6A  
V

DS

=V

GS

, I

D

=-250uA  
10  
13  
m
Ω
 
–
15  
–
25  
m
Ω  
Gate Threshold Voltage  
-1  
-2.5  
V
V
GS(th)  
g

fs  

Forward Transconductance  
Drain-Source Leakage Current  
Gate-Source Leakage  
T
o
tal Gate Charge  
V

DS

=-10
V
,
I

D

=-10A  
V

DS

=-24
V
,
V

GS

=0V  
V

GS

=+20
V
,
V

DS

=0V  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
22  
–
–
S
I
DSS  
I
GSS  
Q

g  

-10  
uA  
–
+100 nA  
I

D

=-6A  
28  
7
45  
–
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V

DS

=-15V  
V

GS

=-4.5V  
Q

gs  

Q

gd  

Gate-Source Charge  
Gate-Drain (“Miller”) Charge  
Turn-on Delay Time  
Rise Time  
11  
13  
10  
80  
37  
–
V

DS

=-15V  
I

D

=-1A  
–
t
d(on)  
t

r  

–
R

G

=3.3
Ω  
V

GS

=-10V  
Turn-off Delay Time  
Fall Time  
–
t
d(off)  
t

f  

–
C

iss  

C
oss  
C

rss  

R

g  

Input Capacitance  
2940 4700
 
pF  
V

GS

=0V V

DS

.
=-  
15V f=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
290  
210  
6.2  
–
–
–
pF  
pF  
Ω
f=1.0MHz  
12.4  
-1.2  
–
V
SD  
t
rr  
Forward On Voltage

2  

Reverse Recovery Time  
I

S

=-2.1A, V

GS

=0V  
V
19  
ns  
I

S

=-10A,
V

GS

=0
V
,  
dI/dt=100A/µs  
Q

rr  

Reverse Recovery Charge  
–
6
–
nC  
Notes:  
1.Pulse width limited by Max. junction temperature.  
2.Pulse test  
3.Surface mounted on 1 in

2

copper pad of FR4 board, t < 10s ; 125
℃
/W when mounted on Min. copper pad.  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
IRF9388TRPBF  
ELECTRONICS CO.,LTD  
P-Channel Enhancement Mode MOSFET  
Typical Performance Characteristics  
40  
40  
30  
20  
10  
0
T

A

=25

o

C  
-10V  
T

A

=150

o

C  
-10
-8.0V  
-7.0V  
-8.0V  
-7.0
-6.0V  
-5.0
-4.5V  
30  
-6.0V  
-5.0V  
-4.5V  
V

G

=-4.
0
V

G

=-4.
0
V  
20  
10  
0
0
1
2
3
4
5
0
1
2
3
4
5
-V

DS

, Drain-to-Source
V
o
ltage (V)  
–
V

DS

, Drain-to-Source
V
o
ltage (V)  
Fig 2
 
Typical Output Characteristics  
Fig 1. Typical Output Characteristics  
.
2.0  
I

D

=-10A  
V

G

=-10V  
20  
16  
12  
8
I

D

=-6A  
T

A

=25

o

C  
1.6  
1.2  
0.8  
0.4  
.
-100  
-50  
0
50  
100  
150  
2
4
6
8
10  
T

j

, Junction
T
emperature (

o

C)  
-V

GS

, Gate-to-Source
V
o
ltage (V)  
Fig 3. On-Resistance
 
v.s. Gate Voltage  
Fig 4. Normalized On-Resistance
 
v.s. Junction  
T
e
mperature  
2.0  
10  
I

D

= -1mA  
1.6  
8
T

j

=25

o

C  
T

j

=150

o

C  
1.2  
0.8  
0.4  
0.0  
6
4
2
-100  
-50  
0
50  
100  
150  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
T

j

, Junction
T
emperature (

o

C)  
–
-V

SD

, Source-to-Drain Voltage (V)  
Fig 6. Gate Threshold
V
o
ltage v.s.  
Junction
T
e
mperatur  
Reverse Diode  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
IRF9388TRPBF  
ELECTRONICS CO.,LTD  
P-Channel Enhancement Mode MOSFET  
8
6
4
2
0
f=1.0MHz  
5000  
4000  
3000  
2000  
1000  
I

D

= -6A  
V

DS

= -15V  
C

iss  

C

oss  

C

rss  

0
0
10  
20  
30  
40  
50  
1
5
9
13  
17  
21  
25  
29  
33  
37  
Q

G

,
T
o
tal Gate Charge (nC)  
-V

DS

, Drain-to-Source
V
o
ltage (V)  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
-V

DS

, Drain-to-Source
V
o
ltage (V)  
Fig 10. Effective Transient Thermal Impedance  
Fig 9. Maximum Safe Operating Area  
16  
40  
30  
20  
10  
0
V

DS

= -10V  
12  
8
T

j

=150

o

C  
T

j

=2
5

o

C  
4
0
0
1
2
3
4
5
6
25  
50  
75  
100  
125  
150  
T

A

, Ambient
T
emperature (
 

o

C )  
-V

GS

, Gate-to-Source
V
o
ltage (V)  
Fig 12. Drain Current v.s. Ambient
Temperature  
Fig 11. Transfer Characteristics  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
IRF9388TRPBF  
ELECTRONICS CO.,LTD  
P-Channel Enhancement Mode MOSFET  
2
1.6  
1.2  
0.8  
0.4  
0
3
2.5  
2
I

D

= -1mA  
1.5  
1
0.5  
0
0
50  
100  
150  
-100  
-50  
0
50  
100  
150  
T

A

, Ambient
T
emperature(

o

C)  
T
, Junction
T
emperature (

o

C)  
j
Fig 14.
T
o
tal Power Dissipation  
Fig 13. Normalized BV

DSS

v.s.  
Junction
T
e
mperature  
100  
T

j

=25

o

C  
80  
60  
40  
20  
0
-4.5V  
V

GS

= -10V  
0
10  
20  
30  
40  
50  
-I

D

, Drain Current (A)  
Fig 15. Typ. Drain-Source on State Resistance  
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
IRF9388TRPBF  
ELECTRONICS CO.,LTD  
P-Channel Enhancement Mode MOSFET  
SO
P-8
Package Outline Dimensions  
Dimensions In Millimeters  
Dimensions In Inches  
Sy
m
bo l  
M
i
n  
1.350  
0.100  
1.
3
50  
0.330  
0.170  
4.800  
Max  
1.
7
50  
0.250  
1.5
5
0  
0.510  
0.250  
5.000  
M
i
n  
0.053  
0.004  
0.0
53  
0.013  
0.007  
0.189  
Max  
0.069  
0.010  
0.0
61  
0.020  
0.010  
0.197  
A
A1  
A2  
b
c
D
e
1.270(BSC)  
0.050(BSC)  
E
5.800  
3.800  
0.400  
0°  
6.200  
4.000  
1.270  
8°  
0.228  
0.150  
0.016  
0°  
0.244  
0.157  
0.050  
8°  
E1  
L
θ
Shenzhen HuaXuanYang Electronics CO.,LTD  

HUAXUANYANG  
HXY  
IRF9388TRPBF  
ELECTRONICS CO.,LTD  
P-Channel Enhancement Mode MOSFET  
Attention  
■ Any and all HUA XUAN YANG ELECTRONICS products described or contained herein do not have specifications that can handle  
applications that require extremely high levels of reliability, such as life-support systems, aircraft’s control systems, or other applications  
whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your HUA XUAN YANG  
ELECTRONICS representative nearest you before using any HUA XUAN YANG ELECTRONICS products described or contained herein  
in such applications.  
■ HUA XUAN YANG ELECTRONICS assumes no responsibility for equipment failures that result from using products at values that  
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products  
specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein.  
■ Specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein stipulate the performance,  
characteristics, and functions of the described products in the independent state, and are not guarantees of the performance,  
characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and  
states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the  
customer’s products or equipment.  
■ HUA XUAN YANG ELECTRONICS CO.,LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor  
products fail with some probability. It is possible that these probabilistic failures could  
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other  
property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures  
include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design.  
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XUAN YANG ELECTRONICS CO.,LTD.  
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HUA XUAN YANG ELECTRONICS believes information herein is accurate and reliable, but no guarantees are made or implied regarding  
its use or any infringements of intellectual property rights or other rights of third parties.  
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Shenzhen HuaXuanYang Electronics CO.,LTD