Infineon-Technologies-BCP-49-H6327

Part #Infineon-Technologies-BCP-49-H6327
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Infineon-Technologies-BCP-49-H6327
BCP49  
NPN Silicon Darlington Transistors  
•
For general AF applications  
•
High collector current  
•
High current gain  
4
3
2
1
1)  
•
Pb-free (RoHS compliant) package  
•
Qualified according AEC Q101  
C(2,4)  
B(1)  
E(3)  
EHA00009  
Type  
Marking  
Pin Configuration  
Package  
BCP49  
BCP 49  
1 = B  
2 = C  
3 = E  
4 = C  
SOT223  
Maximum Ratings  
Parameter  
Symbol  
Values  
60  
Unit  
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
DC collector current  
Peak collector current  
Base current  
V
V
V
V
CEO  
CBO  
EBO  
80  
10  
500  
800  
100  
200  
1.5  
mA  
mA  
I
C
I
CM  
I
B
Peak base current  
I
BM  
W
Total power dissipation,
T
= 124 °C  
P
tot  
S
150  
°C  
Junction temperature  
Storage temperature  
T
j
T
-65 … 150  
stg  
Thermal Resistance  
2)  
Junction – soldering point  
R
≤
17  
K/W  
thJS  
1
Pb-containing package may be available upon special request  
2
For calculation of
R  
please refer to Application Note Thermal Resistance  
thJA  
2007-04-27  
1

BCP49  
Electrical Characteristics
at
T
= 25°C, unless otherwise specified.  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
60  
DC Characteristics  
–
–
–
–
–
–
–
–
–
–
–
–
–
V
Collector-emitter breakdown voltage  
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
I
= 1 mA,
I
= 0  
C
B
80  
Collector-base breakdown voltage  
I
= 100 µA,
I
= 0  
C
E
10  
Emitter-base breakdown voltage  
I
= 10 µA,
I
= 0  
E
C
–
100 nA  
Collector cutoff current  
= 60 V,
I
= 0  
I
CBO  
V
CB  
E
–
10  
µA  
Collector cutoff current  
= 60 V,
I
= 0 ,
T
= 150 °C  
I
CBO  
V
CB  
E
A
–
100 nA  
Emitter cutoff current  
= 5 V,
I
= 0  
I
EBO  
V
EB  
C
2000  
4000  
10000  
2000  
–
–
–
–
DC current gain
 
1)  
I
= 100 µA,
V
= 1 V  
h
–
FE  
FE  
FE  
FE  
C
CE  
DC current gain
 
1)  
I
= 10 mA,
V
= 5 V  
h
h
h
C
CE  
DC current gain
 
1)  
I
= 100 mA,
V
= 5 V  
C
CE  
DC current gain
 
1)  
I
= 500 mA,
V
= 5 V  
C
CE  
1) Pulse test: t
≤
300
µ
s, D = 2%  
2007-04-27  
2

BCP49  
Electrical Characteristics
at
T
= 25°C, unless otherwise specified.  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC Characteristics  
–
–
–
–
1
V
Collector-emitter saturation voltage1)  
V
V
CEsat  
BEsat  
I
= 100 mA,
I
= 0.1 mA  
C
B
1.5  
Base-emitter saturation voltage
 
1)  
I
= 100 mA,
I
= 0.1 mA  
C
B
AC Characteristics  
–
–
200  
6.5  
–
–
MHz  
pF  
Transition frequency  
f
T
I
= 50 mA,
V
= 5 V,
f
= 100 MHz  
C
CE  
Collector-base capacitance  
= 10 V,
f
= 1 MHz  
C
cb  
V
CB  
1) Pulse test: t
≤
300
µ
s, D = 2%  
2007-04-27  
3

BCP49  
Total power dissipation
P
=
f
(
T
)  
Collector cutoff current
I  
=
f
(
T
)  
tot  
S
CBO  
A
V
=
V  
CEmax  
CB  
BCP 29/49  
EHP00251  
10

4  

nA  
1650  
mW  
Ι

CBO  

1350  
1200  
1050  
900  
750  
600  
450  
300  
150  
0
max  
10

3  

10

2  

10

1  

10

0  

typ  
0
50  
100  
150  
˚C  
0
15 30 45 60 75 90
 
105 120  
150  
°C  
T
T

A  

S
Transition frequency
f
=
f
(
I
)  
Permissible pulse load  
T
C
V
= 5V  
P
/
P  
=
f
(
t
)  
CE  
totmax  
totDC  
p
BCP 29/49  
EHP00252  
BCP 29/49  
EHP00253  
1
0

3  

1
0

3  

5
P

to
t
m
ax  

P

to
t
D
C  

t

p  

t

p  

T
f

T  

D
=
MHz  
T
1
0

2  

5
D
0
=
0.005  
0.01  
0.02  
0.05  
0.1  
1
0

2  

5
0.2  
0.5  
1
0

1  

5
1
0

1  

1
0

0  

1
0

0  

1
0

1  

1
0

2  

mA  
Ι

C  

1
0

3  

1
0

-6

1
0

-5

1
0

-4

1
0

-3

1
0

-2  

s
1
0

0  

t

p  

2007-04-27  
4

BCP49  
DC current gain
h
=
f
(
I
)  
Collector-emitter saturation voltage  
FE  
C
V
= 5V  
I
=
f
(V  
),
h
= 1000  
CE  
C
CEsat  
FE  
BCP 29/49  
EHP00256  
BCP 29/49  
EHP00255  
10

3  

mA  
1
0

6  

5
Ι

C  

h

FE  

150
˚C  
25
˚C  
-50
˚C  
125
˚C  
25
˚C  
10

2  

5
1
0

5  

5
-55
˚C  
1
0

4  

5
10

1  

5
1
0

3  

10

0  

1
0

-1  

1
0

0  

1
0

1  

1
0

2

mA 1
0

3  

0
0.5  
1.0  
1.5  
V
Ι

C  

V

CEsat  

Collector-base capacitance
C
=
ƒ
(
V  
)
Base-emitter saturation voltage  
cb  
CB  
Emitter-base capacitance
C
=
ƒ
(
V
)  
I
=
f
(
V  
),
h
= 1000  
eb  
EB  
C
BEsat  
FE  
BCP 29/49  
EHP00258  
10

3  

mA  
160  
pF  
Ι

C  

150
˚C  
25
˚C  
120  
100  
80  
60  
40  
20  
0
-50
˚C  
10

2  

5
10

1  

5
CEB  
CCB  
10

0  

0
1.0  
2.0  
3.0  
V
0
4
8
12  
16  
20  
24  
28  
34  
V
VCB0(VEB0  
V

BEsat  

2007-04-27  
5

Package SOT223  
BCP49  
Package Outline  
±0.1  
1.6  
±0.2  
6.5  
A
±0.1  
0.1 MAX.  
3
B
4
3
1
2
2.3  
±0.1  
0.7  
4.6  
0…10˚  
M
0.25  
A
M
0.25  
B
Foot Print  
3.5  
1.2 1.1  
Marking Layout (Example)  
Manufacturer  
2005, 24 CW  
Date code (YYWW)  
BCP52-16  
T
y
pe code  
Pin 1  
Packing  
Reel ø180 mm = 1.000 Pieces/Reel  
Reel ø330 mm = 4.000 Pieces/Reel  
0.3 MAX.  
8
1.75  
6.8  
Pin 1  
2007-04-27  
6

BCP49  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2006.  
All Rights Reserved.  
Attention please!  
The information given in this data sheet shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (

).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2007-04-27  
7