Infineon-Technologies-BCW-66KG-E6327

Part #Infineon-Technologies-BCW-66KG-E6327
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Infineon-Technologies-BCW-66KG-E6327
BCW66K  
NPN Silicon AF Transistors  
•
For general AF applications  
•
High current gain  
•
Low collector-emitter saturation voltage  
•
Complementary type: BCW68 (PNP)  
•
Pb-free (RoHS compliant) package  
•
Qualified according AEC Q101  
2
1
3
Type  
Marking  
EFs  
EGs  
Pin Configuration  
Package  
BCW66KF  
BCW66KG  
BCW66KH  
1=B  
1=B  
1=B  
2=E  
2=E  
2=E  
3=C  
3=C  
3=C  
SOT23  
SOT23  
SOT23  
EHs  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
45  
75  
5
800  
1
V
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
V
V
V
CEO  
CBO  
EBO  
mA  
A
I
C
Peak collector current,
t
≤
10 ms  
I
p
CM  
100  
200  
500  
mA  
Base current  
Peak base current  
Total power dissipation-  
I
B
I
BM  
mW  
°C  
P
tot  
T
≤
115 °C  
S
150  
Junction temperature  
Storage temperature  
T
j
T
-65 … 150  
stg  
Thermal Resistance  
Parameter  
Junction – soldering point  
Symbol  
Value  
≤
70  
Unit  
K/W  
1)  
R
thJS  
2011-09-30  
1

BCW66K  
Electrical Characteristics
at
T
= 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC Characteristics  
Collector-emitter breakdown voltage  
45  
–
–
–
–
–
–
V
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
I
= 10 mA,
I
= 0  
C
B
Collector-base breakdown voltage  
I
= 10 µA,
I
= 0  
75  
5
C
E
Emitter-base breakdown voltage  
I
= 10 µA,
I
= 0  
E
C
Collector-base cutoff current  
I
µA  
CBO  
V
V
= 45 V,
I
= 0  
–
–
–
–
–
–
0.02  
20  
20  
CB  
CB  
E
= 45 V,
I
= 0 ,
T
= 150 °C  
E
A
nA  
–
Emitter-base cutoff current  
I
EBO  
V
= 5 V,
I
= 0  
EB  
C
2)  
DC current gain  
h
FE  
I
= 100 µA – 10 mA,
V
= 1 V, hFE-grp.F  
75  
–
–
–
–
–
–
C
CE  
I
= 100 µA – 10 mA,
V
= 1 V, hFE-grp.G  
110  
180  
100  
160  
250  
40  
C
CE  
I
= 100 µA – 10 mA,
V
= 1 V, hFE-grp.H  
C
CE  
I
= 100 mA,
V
= 1 V, hFE-grp.F  
160  
250  
350  
–
250  
400  
630  
–
C
CE  
I
= 100 mA,
V
= 1 V, hFE-grp.G  
C
CE  
I
= 100 mA,
V
= 1 V, hFE-grp.H  
C
CE  
I
= 500 mA,
V
= 1 V, hFE-grp.F, G, H  
C
CE  
2)  
Collector-emitter saturation voltage  
I
= 100 mA,
I
= 10 mA  
V
V
CEsat  
–
–
–
–
0.3  
0.45  
C
B
I
= 500 mA,
I
= 50 mA  
C
B
2)  
Base emitter saturation voltage  
I
= 100 mA,
I
= 10 mA  
V
BEsat  
–
–
–
–
1.25  
1.25  
C
B
I
= 500 mA,
I
= 50 mA  
C
B
1
For calculation of
R  
please refer to Application Note AN077 (Thermal Resistance Calculation)  
thJA  
Pulse test: t < 300µs; D < 2%  
2
2011-09-30  
2

BCW66K  
Electrical Characteristics
at
T
= 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
AC Characteristics  
–
–
–
170  
3
–
–
–
MHz  
pF  
Transition frequency  
f
T
I
= 50 mA,
V
= 5 V,
f
= 20 MHz  
C
CE  
Collector-base capacitance  
= 10 V,
f
= 1 MHz  
C
C
cb  
eb  
V
CB  
40  
Emitter-base capacitance  
= 0.5 V,
f
= 1 MHz  
V
EB  
2011-09-30  
3

BCW66K  
DC current gain
h
=
ƒ
(
I
)  
Collector-emitter saturation voltage  
FE  
C
V
= 1 V  
I
=
ƒ
(
V  
),
h
= 10  
CE  
C
CEsat  
FE  
BCW 65/66  
EHP00396  
BCW 65/66  
EHP00395  
1
0

3  

1
0

3  

mA  
5
100 ˚C  
150 ˚C  
25 ˚C  
-50 ˚C  
h

FE  

Ι

C  

25 ˚C  
1
0

2  

5
1
0

2  

5
-50 ˚C  
1
0

1  

5
1
0

1  

5
10

0  

5
1
0

-1  

1
0

0  

1
0

-1  

5 1
0

0  

5 1
0

1  

5 1
0

2  

Ι

C  

1
0

3  

mA  
0
200  
400  
600  
800  
mV  
V

CE sat  

Base-emitter saturation voltage  
Collector cutoff current
I  
=
ƒ
(
T
)  
CBO A  
I
=
ƒ
(
V  
),
h
= 10  
V
=
V  
C
BEsat  
FE  
CB CEmax  
BCW 65/66  
EHP00394  
BCW 65/66  
EHP00393  
1
0

3  

mA  
10

5  

nA  
150 ˚C  
25 ˚C  
-50 ˚C  
Ι

CB0  

Ι

C  

10

4  

5
1
0

2  

5
10

3  

5
max  
typ  
1
0

1  

5
10

2  

5
10

0  

5
10

1  

5
10

0  

1
0

-1  

0
50  
100  
150  
˚C  
T

A  

0
1
2
3
V
4
V

BE sat  

2011-09-30  
4

BCW66K  
Transition frequency
f
=
ƒ
(
I
)  
Collector-base capacitance
C
=
ƒ
(
V
)  
cb CB  
T
C
V
= 5 V  
Emitter-base capacitance
C
=
ƒ
(
V
)  
CE  
eb  
EB  
BCW 65/66  
EHP00391  
1
0

3  

75  
pF  
MHz  
5
f

T  

60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
CEB  
1
0

2  

5
CCB  
2
1
0

1  

0
1
0

0  

1
0

1  

1
0

2  

mA 1
0

3  

V
0
4
6
8
10 12 14 16  
20  
RTF-1  
Ι

C  

Total power dissipation
P
=
ƒ
(
T
)  
Permissible Pulse Load  
tot  
S
P
/
P  
=
ƒ
(
t
)  
totmax totDC  
p
BCW 65/66  
EHP00392  
1
0

3  

550  
P

to
t
m
ax  

P

to
t
D
C  

t

p  

5
t

p  

T
D
=
450  
400  
350  
300  
250  
200  
150  
100  
50  
T
1
0

2  

5
D
0
=
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
1
0

1  

5
1
0

0  

0
1
0

-6

1
0

-5

1
0

-4

1
0

-3

1
0

-2  

s
1
0

0  

0
15 30 45 60 75 90
 
105 120  
150  
t

p  

2011-09-30  
5

Package SOT23  
BCW66K  
Package Outline  
0.1  
1
0.1 MAX.  
0.1  
2.9  
B
3
1
2
1)  
+0.1  
0.4  
A
-0.05  
0.08…0.15  
0…8˚  
C
0.95  
1.9  
0.25 B
 
C  
1) Lead width can be 0.6 max. in dambar area  
M
M
0.2  
A
Foot Print  
0.8  
0.8  
1.2  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
EH  
s
Pin 1  
BCW66  
T
y
pe code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.9  
1.15  
3.15  
Pin 1  
2011-09-30  
6

BCW66K  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (
<www.infineon.com>
).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
2011-09-30  
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