Infineon-Technologies-BFP410H6327

Part #Infineon-Technologies-BFP410H6327
Download 
Infineon-Technologies-BFP410H6327
BFP410  
Low Noise Silicon Bipolar RF Transistor  
•
Low current device suitable e.g. for handhelds  
•
For high frequency oscillators e.g. DRO for LNB  
3
2
1
4
•
For ISM band applications like  
Automatic Meter Reading, Sensors etc.  
•
Transit frequency
f
= 25 GHz  
T
•
Pb-free (RoHS compliant) and halogen-free package  
with visible leads  
•
Qualification report according to AEC-Q101 available  
ESD
(
E
lectro
s
tatic
d
ischarge) sensitive device, observe handling precaution!  
Type  
BFP410  
Marking  
AKs  
Pin Configuration  
1=B 2=E 3=C 4=E  
Package  
SOT343  
–
–
Maximum Ratings
at
T
= 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Value  
Unit  
V
Collector-emitter voltage  
V
CEO  
T
= 25 °C  
4.5  
4.1  
13  
13  
1.5  
40  
A
T
= -55 °C  
A
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
V
V
V
CES  
CBO  
EBO  
mA  
mW  
°C  
I
C
6
150  
Base current  
Total power dissipation  
I
B
1)  
P
tot  
T
≤
100 °C  
S
150  
Junction temperature  
T
J
Storage temperature  
T
-55 … 150  
Stg  
1
T
is measured on the emitter lead at the soldering point to the pcb  
S
1
2013-08-16  

BFP410  
Thermal Resistance  
Parameter  
Junction – soldering point  
Symbol  
Value  
335  
Unit  
K/W  
1)  
R
thJS  
Electrical Characteristics
at
T
= 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
DC Characteristics  
4.5  
5
–
V
Collector-emitter breakdown voltage  
V
(BR)CEO  
I
= 1 mA,
I
= 0  
C
B
nA  
Collector-emitter cutoff current  
I
CES  
V
V
= 2 V,
V
= 0  
–
–
1
2
30  
50  
CE  
BE  
= 5 V,
V
= 0 ,
 
T
= 85 °C  
CE  
BE  
A
(verified by random sampling)  
–
–
1
30  
Collector-base cutoff current  
I
CBO  
V
= 2 V,
I
= 0  
E
CB  
0.001  
95  
0.6 µA  
130  
Emitter-base cutoff current  
= 0.5 V,
I
= 0  
I
EBO  
V
EB  
C
60  
–
DC current gain  
I
= 13 mA,
V
= 2 V, pulse measured  
h
FE  
C
CE  

1

For the definition of
R

thJS

please refer to Application Note AN077 (Thermal Resistance Calculation)  
2
2013-08-16  

BFP410  
Electrical Characteristics
at
T
= 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
AC Characteristics
(verified by random sampling)  
Transition frequency  
18  
25  
–
GHz  
f
T
I
= 20 mA,
V
= 2 V,
f
= 2 GHz  
C
CE  
–
–
–
0.09  
0.17 pF  
Collector-base capacitance  
= 2 V,
f
= 1 MHz,
V
= 0 ,  
emitter grounded  
C
C
C
cb  
ce  
eb  
V
CB  
BE  
0.35  
0.45  
–
–
Collector emitter capacitance  
V
= 2 V,
f
= 1 MHz,
V
= 0 ,  
CE  
BE  
base grounded  
Emitter-base capacitance  
V
= 0.5 V,
f
= 1 MHz,
V
= 0 ,  
EB  
CB  
collector grounded  
–
–
1.2  
–
–
dB  
dB  
Minimum noise figure  
NF  
min  
I
= 2 mA,
V
= 2 V,
f
= 2 GHz,
 
Z
=
Z  
C
CE  
S
Sopt  
1)  
Power gain, maximum stable  
G
21.5  
ms  
I
= 20 mA,
V
= 2 V,
Z
=
Z
,  
C
CE  
S
Sopt  
Z
=
Z  
,
f
= 2 GHz  
L
Lopt  
2
Insertion power gain  
= 2 V,
I
= 20 mA,
f
= 2 GHz,  
|
S
|  
–
–
–
18.5  
23.5  
10.5  
–
–
–
21  
V
CE  
C
Z
=
Z
= 50
Ω  
S
L
2)  
Third order intercept point at output  
IP3  
dBm  
V
= 2 V,
I
= 20 mA,
f
= 2 GHz,  
CE  
C
Z
=
Z
= 50
Ω  
S
L
1dB compression point at output  
P
-1dB  
I
= 20 mA,
V
= 2 V,
Z
=
Z
= 50
Ω
,  
C
CE  
S
L
f
= 2 GHz  
1
G
= |
S
/
S  
21 12  
|
ms  

2

IP3 value depends on termination of all intermodulation frequency components.  
Termination used for this measurement is 50
Ω
from 0.1 MHz to 6 GHz  
3
2013-08-16  

BFP410  
Total power dissipation
P
=
ƒ
(
T
)  
Collector-base capacitance
C
=
ƒ
(
V
)  
tot  
S
cb  
CB  
f
= 1MHz  
0.3  
pF  
180  
mW  
140  
120  
100  
80  
0.2  
0.15  
0.1  
60  
40  
0.05  
20  
0
0
0
V
0
20  
40  
60  
80 100
 
120  
160  
0.5  
1
1.5  
2
2.5  
3
4
°C  
V
T
CB  
S
2
Transition frequency
f
=
ƒ
(
I
)  
Power gain
G
,
G
, |
S
| =
 
ƒ
(
f
)  
T
C
ma  
ms  
21  
f
= 2 GHz  
V
= 2 V,
I
= 13 mA  
CE  
C
V
= parameter in V  
CE  
45  
26  
GHz  
3 to 4V  
dB  
2V  
1V  
22  
20  
18  
16  
14  
12  
10  
8
35  
30  
25  
20  
15  
10  
5
Gms  
|S21|²  
2
0.5V  
Gma  
6
4
2
0
mA  
GHz  
0
4
8
12  
16  
20  
24  
32  
0
4
6
10  
I
f
C
4
2013-08-16  

BFP410  
Power gain
G
,
G
=
ƒ
(
I
)  
Power gain
G
,
G
=
ƒ
(
V
)  
ma ms
 
CE  
ma  
ms  
C
V
= 2V  
I
= 13 mA  
CE  
C
f
= parameter in GHz  
f
= parameter in GHz  
40  
40  
0.15GHz  
dB  
dB  
0.15GHz  
0.45GHz  
0.9GHz  
32  
28  
24  
20  
16  
12  
8
32  
28  
24  
20  
16  
12  
8
0.45GHz  
0.9GHz  
1.5GHz  
1.9GHz  
2.4GHz  
1.5GHz  
1.9GHz  
2.4GHz  
3.5GHz  
5.5GHz  
3.5GHz  
5.5GHz  
10GHz  
10GHz  
4
4
0
0
mA  
V
0
4
8
12 16 20 24 28  
36  
0
1
2
3
4
6
I
V
CE  
C
Noise figure
F
=
ƒ
(
I
)  
Noise figure
F
=
ƒ
(
I
)  
C
C
V
= 2 V,
Z =
 
Z  
V
= 2 V,
f
= 2 GHz  
CE  
S
Sopt  
CE  
4.5  
4
dB  
dB  
3.5  
3
3
2.5  
2
2.5  
2
1.5  
1
1.5  
1
f= 10.0
 
GHz  
f= 5.5 GHz  
f= 2.4 GHz  
f= 1.8 GHz  
f= 0.9 GHz  
f= 0.45
 
GHz  
ZS=50Ohm  
ZS=ZSopt  
0.5  
0
0.5  
0
mA  
mA  
0
4
8
12  
16  
20  
24  
30  
0
4
8
12  
16  
24  
I
I
C
C
5
2013-08-16  

BFP410  
Collector current
I
=
ƒ
(
V
)  
Collector current
I
=
ƒ
(
V
)  
C CE  
C
BE  
V
=2 V  
Parameter
I  
CE  
B
10

2  

25  
mA  
10

1  

10

0  

mA  
160µA  
90µA  
15  
10  
5
10

-1  

10

-2  

10

-3  

10

-4  

20µA  
0
0
V
V
0.2  
0.4  
0.6  
0.8  
1.2  
1
2
3
5
V
V
CE  
BE  
DC current gain
h
=
ƒ
(
I
)  
FE  
C
V
= 2 V  
CE  
10

3  

10

2  

10

1  

10

0  

10

-1  

10

0  

10

1  

10

2  

mA  
I
C
6
2013-08-16  

Package SOT343  
BFP410  
7
2013-08-16  

BFP410  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (
<www.infineon.com>
).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
8
2013-08-16