Infineon-Technologies-BSC052N03LS

Part #Infineon-Technologies-BSC052N03LS
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Infineon-Technologies-BSC052N03LS
BSC052N03LS  
MOSFET  
OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
SuperSO8  
5
8
6
7
7
Features  
6
5
8
•ꢀOptimizedꢀforꢀhighꢀperformanceꢀBuckꢀconverter  
•ꢀVeryꢀlowꢀon-resistanceꢀ
R

DS(on)

ꢀ@ꢀ
V

GS

=4.5ꢀV  
•ꢀ100%ꢀavalancheꢀtested  
•ꢀSuperiorꢀthermalꢀresistance  
4
3
•ꢀN-channel  
1
•ꢀQualifiedꢀaccordingꢀtoꢀJEDEC

1)

ꢀꢀforꢀtargetꢀapplications  
•ꢀPb-freeꢀleadꢀꢀplating;ꢀRoHSꢀcompliant  
•ꢀHalogen-freeꢀaccordingꢀtoꢀIEC61249-2-21  
2
2
3
1
4
Tableꢀ1ꢀꢀꢀꢀꢀKeyꢀPerformanceꢀParameters  
S 1  
8 D  
7 D  
Parameter  
Value  
Unit  
S 2  
S 3  
G 4  
V

DS  

30  
V
6 D  
5 D  
R

DS(on),max  

I

D  

5.2  
57  
m
Ω
 
A
Q

GD  

1.9  
12  
nC  
nC  
Q

G

(0V..10V)  
Typeꢀ/ꢀOrderingꢀCode  
Package  
Marking  
RelatedꢀLinks  
BSC052N03LS  
PG-TDSON-8  
052N03LS  
–

1)

J-STD20 and JESD22  
Final Data Sheet  
1
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
TableꢀofꢀContents  
Description .
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Maximum ratings
 
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3  
Thermal characteristics
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics
 
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4  
Electrical characteristics diagrams
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
6  
Package Outlines
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
10  
Revision History
 
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13  
Trademarks .
 
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13  
Disclaimer .
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
13  
Final Data Sheet  
2
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
1ꢀꢀꢀꢀꢀMaximumꢀratings  
atꢀ
T

j

=25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified  
Tableꢀ2ꢀꢀꢀꢀꢀMaximumꢀratings  
Values  
Typ.  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
–
–
–
–
–
–
–
–
–
–
57  
36  
48  
31  
17  
V

GS

=10ꢀV,ꢀ
T

C

=25ꢀ°C  
V

GS

=10ꢀV,ꢀ
T

C

=100ꢀ°C  
V

GS

=4.5ꢀV,ꢀ
T

C

=25ꢀ°C  
Continuous drain current  
I

D  

A
V

GS

=4.5ꢀV,ꢀ
T

C

=100ꢀ°C  
V

GS

=10ꢀV,ꢀ
T

A

=25ꢀ°C,ꢀ
R

thJA

=50ꢀK/W

1)  

Pulsed drain current

2)  

I

D,pulse  

I

AS  

–
–
–
–
–
228  
35  
A
T

C

=25ꢀ°C  
Avalanche current, single pulse

3)  

Avalanche energy, single pulse  
Gate source voltage  
–
A
T

C

=25ꢀ°C  
E

AS  

V

GS  

–
12  
mJ  
V
I

D

=35ꢀA,ꢀ
R

GS

=25ꢀ
Ω  
-20  
20  
–
–
–
–
–
28  
2.5  
T

C

=25ꢀ°C  
Power dissipation  
P

tot  

–
T

A

=25ꢀ°C,ꢀ
R

thJA

=50ꢀK/W

1)  

IEC climatic category;  
DIN IEC 68-1: 55/150/56  
Operating and storage temperature  
T

j

,ꢀ
T

stg  

-55  
–
150  
°C  
2ꢀꢀꢀꢀꢀThermalꢀcharacteristics  
Tableꢀ3ꢀꢀꢀꢀꢀThermalꢀcharacteristics  
Values  
Typ.  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Thermal resistance, junction – case,  
bottom  
R

thJC  

R

thJC  

R

thJA  

–
–
–
–
4.5  
K/W  
K/W  
K/W  
–
–
–
Thermal resistance, junction – case,  
top  
–
–
20  
50  
Device on PCB,  
6 cm

2

cooling area

1)  

1)

Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  

2)

See figure 3 for more detailed information  

3)

See figure 13 for more detailed information  
Final Data Sheet  
3
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
3ꢀꢀꢀꢀꢀElectricalꢀcharacteristics  
atꢀ
T

j

=25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified  
Tableꢀ4ꢀꢀꢀꢀꢀStaticꢀcharacteristics  
Values  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
30  
Typ.  
Max.  
Drain-source breakdown voltage  
Gate threshold voltage  
V

(BR)DSS  

V

GS(th)  

–
–
–
V
V
V

GS

=0ꢀV,ꢀ
I

D

=1ꢀmA  
1.2  
2
V

DS

=
V

GS

,ꢀ
I

D

=250ꢀµA  
–
–
0.1  
10  
1
100  
V

DS

=30ꢀV,ꢀ
V

GS

=0ꢀV,ꢀ
T

j

=25ꢀ°C  
V

DS

=30ꢀV,ꢀ
V

GS

=0ꢀV,ꢀ
T

j

=125ꢀ°C  
Zero gate voltage drain current  
Gate-source leakage current  
Drain-source on-state resistance  
I

DSS  

µA  
nA  
I

GSS  

–
10  
100  
V

GS

=20ꢀV,ꢀ
V

DS

=0ꢀV  
–
–
5.8  
4.3  
7.2  
5.2  
V

GS

=4.5ꢀV,ꢀ
I

D

=30ꢀA  
V

GS

=10ꢀV,ꢀ
I

D

=30ꢀA  
R

DS(on)  

m
Ω  
Gate resistance  
R

G  

g

fs  

0.3  
38  
0.65  
75  
1.3  
–
Ω
–
Transconductance  
S
|
V

DS

|>2|
I

D

|
R

DS(on)max

,ꢀ
I

D

=30ꢀA  
Tableꢀ5ꢀꢀꢀꢀꢀDynamicꢀcharacteristics  
Values  
Typ.  
770  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Input capacitance  
C

iss  

C

oss  

C

rss  

–
–
–
1024 pF  
V

GS

=0ꢀV,ꢀ
V

DS

=15ꢀV,ꢀ
f
=1ꢀMHz  
V

GS

=0ꢀV,ꢀ
V

DS

=15ꢀV,ꢀ
f
=1ꢀMHz  
V

GS

=0ꢀV,ꢀ
V

DS

=15ꢀV,ꢀ
f
=1ꢀMHz  
Output capacitance  
300  
399  
–
pF  
pF  
Reverse transfer capacitance  
44  
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=30ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
Turn-on delay time  
Rise time  
t

d(on)  

t

r  

t

d(off)  

t

f  

–
–
–
–
2.4  
3.6  
13  
–
–
–
–
ns  
ns  
ns  
ns  
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=30ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=30ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
Turn-off delay time  
Fall time  
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=30ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
2.4  
Tableꢀ6ꢀꢀꢀꢀꢀGateꢀchargeꢀcharacteristics

1)

ꢀ  
Values  
Typ.  
2.2  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Gate to source charge  
Gate charge at threshold  
Gate to drain charge  
Switching charge  
Q

gs  

–
–
–
–
–
–
–
–
–
3
nC  
nC  
nC  
nC  
nC  
V
V

DD

=15ꢀV,ꢀ
I

D

=30ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=30ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=30ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=30ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=30ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=30ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=30ꢀA,ꢀ
V

GS

=0ꢀtoꢀ10ꢀV  
V

DS

=0.1ꢀV,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
Q

g(th)  

Q

gd  

1.2  
–
1.9  
3
Q

sw  

2.9  
–
Gate charge total  
Q

g  

5.9  
7.8  
–
Gate plateau voltage  
Gate charge total  
V

plateau  

Q

g  

2.8  
12  
16  
–
nC  
nC  
nC  
Gate charge total, sync. FET  
Output charge  
Q

g(sync)  

Q

oss  

4.8  
7.7  
10  
V

DD

=15ꢀV,ꢀ
V

GS

=0ꢀV  

1)

See
″
Gate charge waveforms
″
for parameter definition  
Final Data Sheet  
4
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
Tableꢀ7ꢀꢀꢀꢀꢀReverseꢀdiode  
Values  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Typ.  
Max.  
28  
112  
1
Diode continuous forward current  
Diode pulse current  
I

S  

–
–
–
–
–
A
T

C

=25ꢀ°C  
I

S,pulse  

V

SD  

Q

rr  

–
A
T

C

=25ꢀ°C  
Diode forward voltage  
0.9  
5
V
V

GS

=0ꢀV,ꢀ
I

F

=30ꢀA,ꢀ
T

j

=25ꢀ°C  
V

R

=15ꢀV,ꢀ
I

F

=
I

S

,ꢀd
i

F

/d
t
=400ꢀA/µs  
Reverse recovery charge  
–
nC  
Final Data Sheet  
5
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
4ꢀꢀꢀꢀꢀElectricalꢀcharacteristicsꢀdiagrams  
Diagramꢀ1:ꢀPowerꢀdissipation  
Diagramꢀ2:ꢀDrainꢀcurrent  
30  
60  
25  
20  
15  
10  
5
50  
40  
30  
20  
10  
0
0
0
40  
80  
120  
160  
0
40  
80  
120  
160  
T

C

ꢀ[°C]  
T

C

ꢀ[°C]  
P

tot

=f(
T

C

)  
I

D

=f(
T

C

);ꢀ
V

GS

≥
10ꢀV  
Diagramꢀ3:ꢀSafeꢀoperatingꢀarea  
Diagramꢀ4:ꢀMax.ꢀtransientꢀthermalꢀimpedance  
10

3  

10

1  

1 µs  
0.5  
10

2  

10

1  

10

0  

10

-1  

10 µs  
10

0  

0.2  
100 µs  
0.1  
0.05  
0.02  
1 ms  
DC  
0.01  
10

-1  

single pulse  
10

-2  

10

-1  

10

0  

10

1  

10

2  

10

-6  

10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

V

DS

ꢀ[V]  
t

p

ꢀ[s]  
I

D

=f(
V

DS

);ꢀ
T

C

=25ꢀ°C;ꢀ
D
=0;ꢀparameter:ꢀ
t

p  

Z

thJC

=f(
t

p

);ꢀparameter:ꢀ
D
=
t

p

/
T  
Final Data Sheet  
6
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
Diagramꢀ5:ꢀTyp.ꢀoutputꢀcharacteristics  
Diagramꢀ6:ꢀTyp.ꢀdrain-sourceꢀonꢀresistance  
240  
7
10 V  
5 V  
8 V  
4.5 V  
6
200  
160  
120  
80  
4.5 V  
5 V  
5
8 V  
10 V  
4
3
2
1
0
3.3 V  
40  
0
0
1
2
3
0
10  
20  
30  
40  
50  
V

DS

ꢀ[V]  
I

D

ꢀ[A]  
I

D

=f(
V

DS

);ꢀ
T

j

=25ꢀ°C;ꢀparameter:ꢀ
V

GS  

R

DS(on)

=f(
I

D

);ꢀ
T

j

=25ꢀ°C;ꢀparameter:ꢀ
V

GS  

Diagramꢀ7:ꢀTyp.ꢀtransferꢀcharacteristics  
Diagramꢀ8:ꢀTyp.ꢀforwardꢀtransconductance  
240  
160  
200  
160  
120  
80  
120  
80  
40  
0
40  
150 °C  
25 °C  
0
0
1
2
3
4
5
0
20  
40  
60  
80  
100  
V

GS

ꢀ[V]  
I

D

ꢀ[A]  
I

D

=f(
V

GS

);ꢀ|
V

DS

|>2|
I

D

|
R

DS(on)max

;ꢀparameter:ꢀ
T

j  

g

fs

=f(
I

D

);ꢀ
T

j

=25ꢀ°C  
Final Data Sheet  
7
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
Diagramꢀ9:ꢀDrain-sourceꢀon-stateꢀresistance  
Diagramꢀ10:ꢀTyp.ꢀgateꢀthresholdꢀvoltage  
8
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
6
typ  
4
2
0
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
T

j

ꢀ[°C]  
T

j

ꢀ[°C]  
R

DS(on)

=f(
T

j

);ꢀ
I

D

=30ꢀA;ꢀ
V

GS

=10ꢀV  
V

GS(th)

=f(
T

j

);ꢀ
V

GS

=
V

DS

;ꢀ
I

D

=250ꢀµA  
Diagramꢀ11:ꢀTyp.ꢀcapacitances  
Diagramꢀ12:ꢀForwardꢀcharacteristicsꢀofꢀreverseꢀdiode  
10

4  

10

3  

25 °C  
150 °C  
10

2  

10

1  

10

0  

10

-1  

10

3  

10

2  

10

1  

Ciss  
Coss  
Crss  
0
5
10  
15  
20  
25  
30  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V

DS

ꢀ[V]  
V

SD

ꢀ[V]  
C
=f(
V

DS

);ꢀ
V

GS

=0ꢀV;ꢀ
f
=1ꢀMHz  
I

F

=f(
V

SD

);ꢀparameter:ꢀ
T

j  

Final Data Sheet  
8
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
Diagramꢀ13:ꢀAvalancheꢀcharacteristics  
Diagramꢀ14:ꢀTyp.ꢀgateꢀcharge  
10

2  

12  
15 V  
24 V  
10  
8
6V  
25 °C  
10

1  

6
100 °C  
125 °C  
4
2
10

0  

0
10

0  

10

1  

10

2  

10

3  

0
4
8
12  
16  
t

AV

ꢀ[µs]  
Q

gate

ꢀ[nC]  
I

AS

=f(
t

AV

);ꢀ
R

GS

=25ꢀ
Ω
;ꢀparameter:ꢀ
T

j(start)  

V

GS

=f(
Q

gate

);ꢀ
I

D

=30ꢀAꢀpulsed;ꢀparameter:ꢀ
V

DD  

Diagramꢀ15:ꢀDrain-sourceꢀbreakdownꢀvoltage  
Diagram Gate charge waveforms  
34  
32  
30  
28  
26  
24  
22  
20  
-60  
-20  
20  
60  
100  
140  
180  
T

j

ꢀ[°C]  
V

BR(DSS)

=f(
T

j

);ꢀ
I

D

=1ꢀmA  
Final Data Sheet  
9
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
5ꢀꢀꢀꢀꢀPackageꢀOutlines  
DOCUMENT NO.  
Z8B00003332  
REVISION  
07  
MILLIMETERS  
DIMENSION  
MIN.  
0.90  
0.15  
0.34  
4.80  
3.90  
0.03  
5.70  
5.90  
3.88  
MAX.  
1.20  
0.35  
0.54  
5.35  
4.40  
0.23  
6.10  
6.42  
4.31  
SCALE 10:1  
A
A1  
b
3mm  
0
1
2
D
D1  
D2  
E
EUROPEAN PROJECTION  
E1  
E2  
e
1.27  
L
0.45  
0.45  
0.71  
0.69  
ISSUE DATE  
06.06.2019  
M
Figureꢀ1ꢀꢀꢀꢀꢀOutlineꢀPG-TDSON-8,ꢀdimensionsꢀinꢀmm  
Final Data Sheet  
10  
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
Dimension in mm  
Figureꢀ2ꢀꢀꢀꢀꢀOutlineꢀTapeꢀ(TDSON-8)  
Final Data Sheet  
11  
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMOS

TM

ꢀPower-MOSFET,ꢀ30ꢀV  
BSC052N03LS  
PG-TDSON-8: Recommen
de
d Bo
a
rdpads & Apertures  
1.905  
1.905  
1.27  
3x  
0.6  
1.27  
3x  
0.5  
1.6  
0.2  
1.5  
0.5  
1.27  
3x  
1.27  
3x  
0.4  
1.905  
1.905  
copper  
solder mask  
stencil apertures  
all dimensions in mm  
Figure 3
 
Outline Boardpads (TDSON-8), dimensions in mm  
Final Data Sheet  
12  
Rev.ꢀ2.3,ꢀꢀ2019-11-04  

OptiMO
S

TM

Power-MOSFET , 30 V  
BSC052N03LS  
Revision History  
BSC052N03LS  
Revision: 2019-11-04, Rev. 2.3  
Previous Revision  
Revision Date  
Subjects (major changes since last revision)  
Update package drawings  
2.3  
2019-11-04  
Trademarks  
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Published by  
Infineon Technologies AG  
81726 München, Germany  
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Final Data Sheet  
13  
Rev. 2.3,
 
2019-11-04