Infineon-Technologies-BSC430N25NSFD
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BSC430N25NSFD
MOSFET
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
TSON-8-3
8
7
6
5
5
6
Features
7
8
•ꢀN-channel,ꢀnormalꢀlevel
•ꢀExcellentꢀgateꢀchargeꢀxꢀ
R
DS(on)
ꢀproductꢀ(FOM)
•ꢀVeryꢀlowꢀon-resistanceꢀ
R
DS(on)
Pin 1
2
4
3
3
2
4
1
•ꢀPb-freeꢀleadꢀplating;ꢀRoHSꢀcompliant
•ꢀHalogen-freeꢀaccordingꢀtoꢀIEC61249-2-21
•ꢀIdealꢀforꢀhigh-frequencyꢀswitchingꢀandꢀsynchronousꢀrectification
•ꢀ175°Cꢀrated
ProductꢀValidation:
Qualifiedꢀforꢀindustrialꢀapplicationsꢀaccordingꢀtoꢀtheꢀrelevantꢀtestsꢀof
JEDEC47/20/22
S 1
8 D
7 D
S 2
S 3
G 4
Tableꢀ1ꢀꢀꢀꢀꢀKeyꢀPerformanceꢀParameters
Parameter
Value
250
43
Unit
6 D
5 D
V
DS
V
R
DS(on),max
I
D
m
Ω
A
36
Typeꢀ/ꢀOrderingꢀCode
Package
Marking
RelatedꢀLinks
BSC430N25NSFD
TSON-8-3
430N25F
–
Final Data Sheet
1
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
TableꢀofꢀContents
Description .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
Thermal characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4
Electrical characteristics diagrams
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
Package Outlines
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
Revision History
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
Trademarks .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
Disclaimer .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
Final Data Sheet
2
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
1ꢀꢀꢀꢀꢀMaximumꢀratings
atꢀ
T
A
=25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified
Tableꢀ2ꢀꢀꢀꢀꢀMaximumꢀratings
Values
Typ.
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Max.
–
–
–
–
36
26
T
C
=25ꢀ°C
A
Continuous drain current
I
D
T
C
=100ꢀ°C
Pulsed drain current
1)
I
D,pulse
E
AS
–
–
–
–
144
159
A
T
C
=25ꢀ°C
Avalanche energy, single pulse
mJ
I
D
=23ꢀA,ꢀ
R
GS
=25ꢀ
Ω
I
D
=36ꢀA,ꢀ
V
DS
=125ꢀV,
d
i
/d
t
=1500ꢀA/µs,ꢀ
T
j,max
=175ꢀ°C
Reverseꢀdiodeꢀd
v
/d
t
d
v
/d
t
–
–
60
kV/µs
Gate source voltage
Power dissipation
V
GS
P
tot
-20
–
–
–
20
V
–
214
W
T
C
=25ꢀ°C
IEC climatic category;
DIN IEC 68-1: 55/175/56
Operating and storage temperature
T
j
,ꢀ
T
stg
-55
–
175
°C
2ꢀꢀꢀꢀꢀThermalꢀcharacteristics
at Tj=25 °C, unless otherwise specified
Tableꢀ3ꢀꢀꢀꢀꢀThermalꢀcharacteristics
Values
Typ.
0.4
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Max.
Thermal resistance, junction – case
R
thJC
R
thJA
–
0.7
K/W
K/W
–
–
Thermal resistance, junction
– ambient,
minimal footprint
–
–
–
–
75
50
Thermal resistance, junction
– ambient,
6 cm
2
cooling area
2)
R
thJA
K/W
–
1)
See Diagram 3
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm thick) copper area for drain connection.
PCB is vertical in still air.
Final Data Sheet
3
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
3ꢀꢀꢀꢀꢀElectricalꢀcharacteristics
atꢀ
T
j
=25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified
Tableꢀ4ꢀꢀꢀꢀꢀStaticꢀcharacteristics
Values
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
250
2
Typ.
Max.
Drain-source breakdown voltage
Gate threshold voltage
V
(BR)DSS
V
GS(th)
–
–
V
V
V
GS
=0ꢀV,ꢀ
I
D
=1ꢀmA
3
4
V
DS
=
V
GS
,ꢀ
I
D
=137ꢀµA
–
–
0.1
10
1
100
V
DS
=200ꢀV,ꢀ
V
GS
=0ꢀV,ꢀ
T
j
=25ꢀ°C
V
DS
=200ꢀV,ꢀ
V
GS
=0ꢀV,ꢀ
T
j
=125ꢀ°C
Zero gate voltage drain current
I
DSS
µA
nA
Gate-source leakage current
Drain-source on-state resistance
Gate resistance
1)
I
GSS
R
DS(on)
R
G
–
1
100
43
5.4
–
V
GS
=20ꢀV,ꢀ
V
DS
=0ꢀV
–
34
3.6
73
m
Ω
V
GS
=10ꢀV,ꢀ
I
D
=36ꢀA
–
Ω
–
Transconductance
g
fs
37
S
|
V
DS
|>2|
I
D
|
R
DS(on)max
,ꢀ
I
D
=36ꢀA
Tableꢀ5ꢀꢀꢀꢀꢀDynamicꢀcharacteristics
Values
Typ.
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Max.
Input capacitance
1)
Output capacitance
1)
Reverse transfer capacitance
1)
C
iss
C
oss
C
rss
–
–
–
2770 3680 pF
V
GS
=0ꢀV,ꢀ
V
DS
=125ꢀV,ꢀ
f
=1ꢀMHz
V
GS
=0ꢀV,ꢀ
V
DS
=125ꢀV,ꢀ
f
=1ꢀMHz
V
GS
=0ꢀV,ꢀ
V
DS
=125ꢀV,ꢀ
f
=1ꢀMHz
157
6
209
10
pF
pF
V
DD
=125ꢀV,ꢀ
V
GS
=10ꢀV,ꢀ
I
D
=16.5ꢀA,
R
G,ext
=1.6ꢀ
Ω
Turn-on delay time
Rise time
t
d(on)
t
r
t
d(off)
t
f
–
–
–
–
8
–
–
–
–
ns
ns
ns
ns
V
DD
=125ꢀV,ꢀ
V
GS
=10ꢀV,ꢀ
I
D
=16.5ꢀA,
R
G,ext
=1.6ꢀ
Ω
6
V
DD
=125ꢀV,ꢀ
V
GS
=10ꢀV,ꢀ
I
D
=16.5ꢀA,
R
G,ext
=1.6ꢀ
Ω
Turn-off delay time
Fall time
29
10
V
DD
=125ꢀV,ꢀ
V
GS
=10ꢀV,ꢀ
I
D
=16.5ꢀA,
R
G,ext
=1.6ꢀ
Ω
Tableꢀ6ꢀꢀꢀꢀꢀGateꢀchargeꢀcharacteristics
2)
ꢀ
Values
Typ.
13
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Max.
Gate to source charge
Gate to drain charge
1)
Switching charge
Gate charge total
1)
Gate plateau voltage
Output charge
1)
Q
gs
–
–
–
–
–
–
–
nC
nC
nC
nC
V
V
DD
=125ꢀV,ꢀ
I
D
=36ꢀA,ꢀ
V
GS
=0ꢀtoꢀ10ꢀV
V
DD
=125ꢀV,ꢀ
I
D
=36ꢀA,ꢀ
V
GS
=0ꢀtoꢀ10ꢀV
V
DD
=125ꢀV,ꢀ
I
D
=36ꢀA,ꢀ
V
GS
=0ꢀtoꢀ10ꢀV
V
DD
=125ꢀV,ꢀ
I
D
=36ꢀA,ꢀ
V
GS
=0ꢀtoꢀ10ꢀV
V
DD
=125ꢀV,ꢀ
I
D
=36ꢀA,ꢀ
V
GS
=0ꢀtoꢀ10ꢀV
V
DD
=125ꢀV,ꢀ
V
GS
=0ꢀV
Q
gd
4.1
–
Q
sw
Q
g
8.3
–
34
42
–
V
plateau
Q
oss
4.5
74
99
nC
1)
Defined by design. Not subject to production test
2)
See
″
Gate charge waveforms
″
for parameter definition
Final Data Sheet
4
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
Tableꢀ7ꢀꢀꢀꢀꢀReverseꢀdiode
Values
Parameter
Symbol
Unit Noteꢀ/ꢀTestꢀCondition
Min.
Typ.
Max.
36
Diode continous forward current
Diode pulse current
1)
Diode hard commutation current
2)
I
S
–
–
–
–
–
A
A
A
V
T
C
=25ꢀ°C
I
S,pulse
I
S,hard
V
SD
–
144
36
T
C
=25ꢀ°C
–
T
C
=25ꢀ°C,ꢀd
i
/d
t
=1500ꢀA/µs
V
GS
=0ꢀV,ꢀ
I
F
=36ꢀA,ꢀ
T
j
=25ꢀ°C
Diode forward voltage
0.9
1.2
V
R
=125ꢀV,ꢀ
I
F
=12.5ꢀA,
d
i
F
/d
t
=100ꢀA/µs
Reverse recovery time
3)
t
rr
–
–
96
–
–
ns
V
R
=125ꢀV,ꢀ
I
F
=12.5ꢀA,
d
i
F
/d
t
=100ꢀA/µs
Reverse recovery charge
3)
Q
rr
227
nC
1)
Diode pulse current is defined by thermal and/or package limits
2)
Maximum allowed hard-commutated current through diode at di/dt=1500 A/µs
3)
Defined by design. Not subject to production test
Final Data Sheet
5
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
4ꢀꢀꢀꢀꢀElectricalꢀcharacteristicsꢀdiagrams
Diagramꢀ1:ꢀPowerꢀdissipation
Diagramꢀ2:ꢀDrainꢀcurrent
240
40
200
160
120
80
30
20
10
0
40
0
0
25
50
75
100
125
150
175
200
0
50
100
150
200
T
C
ꢀ[°C]
T
C
ꢀ[°C]
P
tot
=f(
T
C
)
I
D
=f(
T
C
);ꢀ
V
GS
>=10ꢀV
Diagramꢀ3:ꢀSafeꢀoperatingꢀarea
Diagramꢀ4:ꢀMax.ꢀtransientꢀthermalꢀimpedance
10
3
10
0
1 µs
0.5
0.2
10
2
10
1
10
0
10
-1
10 µs
100 µs
1 ms
10
-1
0.1
0.05
0.02
10 ms
DC
0.01
single pulse
10
-2
10
-1
10
0
10
1
10
2
10
3
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
V
DS
ꢀ[V]
t
p
ꢀ[s]
I
D
=f(
V
DS
);ꢀ
T
C
=25ꢀ°C;ꢀ
D
=0;ꢀparameter:ꢀ
t
p
Z
thJC
=f(
t
p
);ꢀparameter:ꢀ
D
=
t
p
/
T
Final Data Sheet
6
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
Diagramꢀ5:ꢀTyp.ꢀoutputꢀcharacteristics
Diagramꢀ6:ꢀTyp.ꢀdrain-sourceꢀonꢀresistance
120
100
100
80
60
10 V
7 V
80
5 V
60
4.5 V
5 V
40
7 V
40
10 V
4.5 V
20
0
20
0
0
1
2
3
4
5
0
10
20
30
40
V
DS
ꢀ[V]
I
D
ꢀ[A]
I
D
=f(
V
DS
);ꢀ
T
j
=25ꢀ°C;ꢀparameter:ꢀ
V
GS
R
DS(on)
=f(
I
D
);ꢀ
T
j
=25ꢀ°C;ꢀparameter:ꢀ
V
GS
Diagramꢀ7:ꢀTyp.ꢀtransferꢀcharacteristics
Diagramꢀ8:ꢀTyp.ꢀforwardꢀtransconductance
60
80
70
60
50
40
30
20
10
0
40
20
175 °C
25 °C
0
0
2
4
6
0
10
20
30
40
V
GS
ꢀ[V]
I
D
ꢀ[A]
I
D
=f(
V
GS
);ꢀ|
V
DS
|>2|
I
D
|
R
DS(on)max
;ꢀparameter:ꢀ
T
j
g
fs
=f(
I
D
);ꢀ
T
j
=25ꢀ°C
Final Data Sheet
7
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
Diagramꢀ9:ꢀDrain-sourceꢀon-stateꢀresistance
Diagramꢀ10:ꢀTyp.ꢀgateꢀthresholdꢀvoltage
120
4.0
3.5
100
80
1370 µA
3.0
137 µA
2.5
60
2.0
1.5
1.0
0.5
0.0
max
40
20
0
typ
-60
-20
20
60
100
140
180
-60
-20
20
60
100
140
180
T
j
ꢀ[°C]
T
j
ꢀ[°C]
R
DS(on)
=f(
T
j
);ꢀ
I
D
=37ꢀA;ꢀ
V
GS
=10ꢀV
V
GS(th)
=f(
T
j
);ꢀ
V
GS
=
V
DS
;ꢀparameter:ꢀ
I
D
Diagramꢀ11:ꢀTyp.ꢀcapacitances
Diagramꢀ12:ꢀForwardꢀcharacteristicsꢀofꢀreverseꢀdiode
10
4
10
3
25 °C
175 °C
25°C, 98%
175°C, 98%
Ciss
10
3
10
2
10
1
10
0
Coss
10
2
Crss
10
1
10
0
0
40
80
120
160
0.0
0.5
1.0
1.5
2.0
V
DS
ꢀ[V]
V
SD
ꢀ[V]
C
=f(
V
DS
);ꢀ
V
GS
=0ꢀV;ꢀ
f
=1ꢀMHz
I
F
=f(
V
SD
);ꢀparameter:ꢀ
T
j
Final Data Sheet
8
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
Diagramꢀ13:ꢀAvalancheꢀcharacteristics
Diagramꢀ14:ꢀTyp.ꢀgateꢀcharge
10
2
10
8
6
200 V
25 °C
125 V
50 V
10
1
100 °C
4
2
0
150 °C
10
0
10
0
10
1
10
2
10
3
0
10
20
30
40
t
AV
ꢀ[µs]
Q
gate
ꢀ[nC]
I
AS
=f(
t
AV
);ꢀ
R
GS
=25ꢀ
Ω
;ꢀparameter:ꢀ
T
j(start)
V
GS
=f(
Q
gate
);ꢀ
I
D
=37ꢀAꢀpulsed;ꢀparameter:ꢀ
V
DD
Diagramꢀ15:ꢀDrain-sourceꢀbreakdownꢀvoltage
Diagram Gate charge waveforms
280
270
260
250
240
230
220
-60
-20
20
60
100
140
180
T
j
ꢀ[°C]
V
BR(DSS)
=f(
T
j
);ꢀ
I
D
=1ꢀmA
Final Data Sheet
9
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
5ꢀꢀꢀꢀꢀPackageꢀOutlines
DOCUMENT NO.
Z8B00187559
MILLIMETERS
DIMENSION
REVISION
MIN.
MAX.
1.10
0.54
0.05
01
A
b
–
0.34
–
SCALE 10:1
b1
c
0.20
0
1
2mm
D
4.90
4.25
5.90
4.00
3.14
0.20
5.10
4.45
6.10
4.20
3.34
0.40
D1
E
EUROPEAN PROJECTION
E1
E2
E3
e
1.27
(0.37)
K2
L
0.60
0.43
0.80
0.63
ISSUE DATE
14.12.2017
L1
L2
(0.25)
Figureꢀ1ꢀꢀꢀꢀꢀOutlineꢀTSON-8-3,ꢀdimensionsꢀinꢀmm/inches
Final Data Sheet
10
Rev.ꢀ2.1,ꢀꢀ2018-05-14
OptiMOS
TM
FDꢀPower-Transistor,ꢀ250ꢀV
BSC430N25NSFD
RevisionꢀHistory
BSC430N25NSFD
Revision:ꢀ2018-05-14,ꢀRev.ꢀ2.1
Previous Revision
Revision Date
Subjects (major changes since last revision)
2.0
2.1
Release of final version
Insert Rg max
2018-03-14
2018-05-14
TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG
AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCoolGaN™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCoolSiC™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,ꢀDI-POL™,ꢀDrBlade™,
EasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPACK™,ꢀEconoPIM™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,ꢀHybridPACK™,ꢀInfineon™,
ISOFACE™,ꢀIsoPACK™,ꢀi-Wafer™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOmniTune™,ꢀOPTIGA™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,
PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPROFET™,ꢀPRO-SIL™,ꢀRASIC™,ꢀREAL3™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSIPMOS™,ꢀSmartLEWIS™,
SOLIDꢀFLASH™,ꢀSPOC™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.
TrademarksꢀupdatedꢀAugustꢀ2015
OtherꢀTrademarks
Allꢀreferencedꢀproductꢀorꢀserviceꢀnamesꢀandꢀtrademarksꢀareꢀtheꢀpropertyꢀofꢀtheirꢀrespectiveꢀowners.
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©ꢀ2018ꢀInfineonꢀTechnologiesꢀAG
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LegalꢀDisclaimer
Theꢀinformationꢀgivenꢀinꢀthisꢀdocumentꢀshallꢀinꢀnoꢀeventꢀbeꢀregardedꢀasꢀaꢀguaranteeꢀofꢀconditionsꢀorꢀcharacteristicsꢀ
(“Beschaffenheitsgarantie”)ꢀ.
Withꢀrespectꢀtoꢀanyꢀexamples,ꢀhintsꢀorꢀanyꢀtypicalꢀvaluesꢀstatedꢀhereinꢀand/orꢀanyꢀinformationꢀregardingꢀtheꢀapplicationꢀofꢀthe
product,ꢀInfineonꢀTechnologiesꢀherebyꢀdisclaimsꢀanyꢀandꢀallꢀwarrantiesꢀandꢀliabilitiesꢀofꢀanyꢀkind,ꢀincludingꢀwithoutꢀlimitation
warrantiesꢀofꢀnon-infringementꢀofꢀintellectualꢀpropertyꢀrightsꢀofꢀanyꢀthirdꢀparty.
Inꢀaddition,ꢀanyꢀinformationꢀgivenꢀinꢀthisꢀdocumentꢀisꢀsubjectꢀtoꢀcustomer’sꢀcomplianceꢀwithꢀitsꢀobligationsꢀstatedꢀinꢀthis
documentꢀandꢀanyꢀapplicableꢀlegalꢀrequirements,ꢀnormsꢀandꢀstandardsꢀconcerningꢀcustomer’sꢀproductsꢀandꢀanyꢀuseꢀofꢀthe
productꢀofꢀInfineonꢀTechnologiesꢀinꢀcustomer’sꢀapplications.
Theꢀdataꢀcontainedꢀinꢀthisꢀdocumentꢀisꢀexclusivelyꢀintendedꢀforꢀtechnicallyꢀtrainedꢀstaff.ꢀItꢀisꢀtheꢀresponsibilityꢀofꢀcustomer’s
technicalꢀdepartmentsꢀtoꢀevaluateꢀtheꢀsuitabilityꢀofꢀtheꢀproductꢀforꢀtheꢀintendedꢀapplicationꢀandꢀtheꢀcompletenessꢀofꢀtheꢀproduct
informationꢀgivenꢀinꢀthisꢀdocumentꢀwithꢀrespectꢀtoꢀsuchꢀapplication.
Information
Forꢀfurtherꢀinformationꢀonꢀtechnology,ꢀdeliveryꢀtermsꢀandꢀconditionsꢀandꢀpricesꢀpleaseꢀcontactꢀyourꢀnearestꢀInfineon
Warnings
Dueꢀtoꢀtechnicalꢀrequirements,ꢀcomponentsꢀmayꢀcontainꢀdangerousꢀsubstances.ꢀForꢀinformationꢀonꢀtheꢀtypesꢀinꢀquestion,
pleaseꢀcontactꢀtheꢀnearestꢀInfineonꢀTechnologiesꢀOffice.
TheꢀInfineonꢀTechnologiesꢀcomponentꢀdescribedꢀinꢀthisꢀDataꢀSheetꢀmayꢀbeꢀusedꢀinꢀlife-supportꢀdevicesꢀorꢀsystemsꢀand/or
automotive,ꢀaviationꢀandꢀaerospaceꢀapplicationsꢀorꢀsystemsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineonꢀTechnologies,ꢀifꢀa
failureꢀofꢀsuchꢀcomponentsꢀcanꢀreasonablyꢀbeꢀexpectedꢀtoꢀcauseꢀtheꢀfailureꢀofꢀthatꢀlife-support,ꢀautomotive,ꢀaviationꢀand
aerospaceꢀdeviceꢀorꢀsystemꢀorꢀtoꢀaffectꢀtheꢀsafetyꢀorꢀeffectivenessꢀofꢀthatꢀdeviceꢀorꢀsystem.ꢀLifeꢀsupportꢀdevicesꢀorꢀsystemsꢀare
intendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀtoꢀsupportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀtheyꢀfail,ꢀitꢀis
reasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersonsꢀmayꢀbeꢀendangered.
Final Data Sheet
11
Rev.ꢀ2.1,ꢀꢀ2018-05-14
