Infineon-Technologies-FS900R08A2P2-B32
| Part # | Infineon-Technologies-FS900R08A2P2-B32 |
Download  | Infineon-Technologies-FS900R08A2P2-B32 |
HybridPACK™ꢀ2ꢀModule
FS900R08A2P2_B32
FinalꢀDataꢀSheet
V3.0,ꢀ2017-06-14
AutomotiveꢀHighꢀPower
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
1ꢀꢀꢀꢀꢀFeaturesꢀ/ꢀDescription
T
T
T
V
CES
= 750V
I
C nom
= 900A
TypicalꢀApplications
• AutomotiveꢀApplications
• HybridꢀElectricalꢀVehiclesꢀ(H)EV
• CommercialꢀAgricultureꢀVehicles
• MotorꢀDrives
•
Optimized for automotive applications with DC link
voltagesꢀupꢀtoꢀ450ꢀV
ElectricalꢀFeatures
• V
CEsat
ꢀꢀwithꢀpositiveꢀTemperatureꢀCoefficient
• LowꢀV
CEsat
• LowꢀSwitchingꢀLosses
• LowꢀQgꢀandꢀCres
• LowꢀInductiveꢀDesign
• T
vjꢀop
ꢀ=ꢀ150°C
•
Short-time extended Operation Temperature
T
vjꢀop
ꢀ=ꢀ175°C
MechanicalꢀFeatures
• 2.5kVꢀACꢀ1minꢀInsulation
• DirectꢀCooledꢀBaseꢀPlate
• HighꢀPowerꢀDensity
• IntegratedꢀNTCꢀtemperatureꢀsensor
• CopperꢀBaseꢀPlate
• IsolatedꢀBaseꢀPlate
• RoHSꢀcompliant
ProductꢀName
OrderingꢀCode
FS900R08A2P2_B32
–
Final Data Sheet
2
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
2ꢀꢀꢀꢀꢀIGBT,Inverter
2.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues
Parameter
Conditions
Symbol
V
CES
I
CN
Value
750
Unit
V
Collector-emitterꢀvoltage
T
vj
= 25°C
Implementedꢀcollectorꢀcurrent
ContinuousꢀDCꢀcollectorꢀcurrent
Repetitiveꢀpeakꢀcollectorꢀcurrent
Totalꢀpowerꢀdissipation
900
A
T
F
= 105°C, T
vj max
= 175°C
t
P
= 1 ms
I
C nom
I
CRM
550
A
1800
1546
+/-20
A
T
F
= 25°C, T
vj max
= 175°C
P
tot
W
V
Gate-emitterꢀpeakꢀvoltage
V
GES
2.2ꢀꢀꢀꢀCharacteristicꢀValues
min. typ. max.
Collector-emitterꢀsaturationꢀvoltage
I
C
= 550 A, V
GE
= 15 V
I
C
= 550 A, V
GE
= 15 V
I
C
= 550 A, V
GE
= 15 V
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
1.10 1.25
1.10
1.10
V
CE sat
V
Gateꢀthresholdꢀvoltage
Gateꢀcharge
I
C
= 13.0 mA, V
CE
= V
GE
T
vj
= 25°C
V
GEth
Q
G
4.90 5.80 6.50
V
µC
Ω
V
GE
= -8 V … 15 V, V
CE
= 400V
5.80
0.5
Internalꢀgateꢀresistor
T
vj
= 25°C
T
vj
= 25°C
T
vj
= 25°C
T
vj
= 25°C
T
vj
= 25°C
R
Gint
C
ies
C
res
I
CES
I
GES
Inputꢀcapacitance
f = 1 MHz, V
CE
= 25 V, V
GE
= 0 V
f = 1 MHz, V
CE
= 25 V, V
GE
= 0 V
V
CE
= 450 V, V
GE
= 0 V
105
0.50
0.5
nF
nF
mA
nA
Reverseꢀtransferꢀcapacitance
Collector-emitterꢀcut-offꢀcurrent
Gate-emitterꢀleakageꢀcurrent
Turn-onꢀdelayꢀtime,ꢀinductiveꢀload
V
CE
= 0 V, V
GE
= 20 V
400
I
C
= 550 A, V
CE
= 400 V
V
GE
= -8 V / +15 V
R
Gon
= 3.3
Ω
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
0.39
0.39
0.39
t
d on
µs
µs
µs
µs
Riseꢀtime,ꢀinductiveꢀload
I
C
= 550 A, V
CE
= 400 V
V
GE
= -8 V / +15 V
R
Gon
= 3.3
Ω
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
0.09
0.11
0.11
t
r
Turn-offꢀdelayꢀtime,ꢀinductiveꢀload
Fallꢀtime,ꢀinductiveꢀload
I
C
= 550 A, V
CE
= 400 V
V
GE
= -8 V / +15 V
R
Goff
= 2.0
Ω
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
0.63
0.71
0.74
t
d off
I
C
= 550 A, V
CE
= 400 V
V
GE
= -8 V / +15 V
R
Goff
= 2.0
Ω
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
0.06
0.08
0.08
t
f
Turn-onꢀenergyꢀlossꢀperꢀpulse
I
C
= 550 A, V
CE
= 400 V, L
S
= 20 nH
V
GE
= -8 V / +15 V
R
Gon
= 3.3
Ω
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
21.0
29.0
30.5
E
on
mJ
di/dt (T
vj
= 150°C) = 4100 A/µs
Turn-offꢀenergyꢀlossꢀperꢀpulse
I
C
= 550 A, V
CE
= 400 V, L
S
= 20 nH
V
GE
= -8 V / +15 V
R
Goff
= 2.0
Ω
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
27.5
36.0
38.5
E
off
mJ
A
dv/dt (T
vj
= 150°C) = 2600 V/µs
SCꢀdata
V
GE
≤
15 V, V
CC
= 400 V
V
CEmax
= V
CES
-L
sCE
·di/dt
I
SC
t
P
≤
4 µs,
T
vj
= 150°C
4500
Thermalꢀresistance,ꢀjunctionꢀtoꢀcoolingꢀfluid perꢀIGBT;ꢀ
∆
V/
∆
tꢀ=ꢀ10ꢀdm³/min
Temperatureꢀunderꢀswitchingꢀconditions
t
op
continuous
R
thJF
T
vj op
0.097 K/W
-40
150
150
°C
t
op max
30h over life time, for 10s within period of 10min
175
Final Data Sheet
3
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
3ꢀꢀꢀꢀꢀDiode,ꢀInverter
3.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues
Parameter
Conditions
Symbol
V
RRM
I
FN
Value
750
Unit
V
Repetitiveꢀpeakꢀreverseꢀvoltage
Implementedꢀforwardꢀcurrent
ContinuousꢀDCꢀforwardꢀcurrent
Repetitiveꢀpeakꢀforwardꢀcurrent
I²tꢀ-ꢀvalue
T
vj
= 25°C
860
A
I
F
550
A
t
P
= 1 ms
I
FRM
1720
A
V
R
= 0 V, t
P
= 10 ms, T
vj
= 125°C
V
R
= 0 V, t
P
= 10 ms, T
vj
= 150°C
19500
19000
A²s
A²s
I²t
3.2ꢀꢀꢀꢀCharacteristicꢀValues
min. typ. max.
Forwardꢀvoltage
I
F
= 550 A, V
GE
= 0 V
I
F
= 550 A, V
GE
= 0 V
I
F
= 550 A, V
GE
= 0 V
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
1.40 1.65
1.30
1.25
V
F
I
RM
Q
r
V
A
Peakꢀreverseꢀrecoveryꢀcurrent
Recoveredꢀcharge
I
F
= 550 A, – di
F
/dt = 4100 A/µs (T
vj
= 150°C)
T
vj
= 25°C
V
R
= 400 V
V
GE
= -8 V
265
385
420
T
vj
= 125°C
T
vj
= 150°C
I
F
= 550 A, – di
F
/dt = 4100 A/µs (T
vj
= 150°C)
T
vj
= 25°C
V
R
= 400 V
V
GE
= -8 V
23.0
49.5
58.5
T
vj
= 125°C
T
vj
= 150°C
µC
mJ
Reverseꢀrecoveryꢀenergy
I
F
= 550 A, – di
F
/dt = 4100 A/µs (T
vj
= 150°C)
T
vj
= 25°C
7.20
15.0
17.5
V
R
= 400 V
V
GE
= -8 V
T
vj
= 125°C
T
vj
= 150°C
E
rec
Thermalꢀresistance,ꢀjunctionꢀtoꢀcoolingꢀfluid perꢀdiode;ꢀ
∆
V/
∆
tꢀ=ꢀ10ꢀdm³/min
R
thJF
T
vj op
0.125 K/W
Temperatureꢀunderꢀswitchingꢀconditions
t
op
continuous
-40
150
150
°C
t
op max
30h over life time, for 10s within period of 10min
175
4ꢀꢀꢀꢀꢀNTC-Thermistor
Parameter
min. typ. max.
Conditions
Symbol
R
25
Value
Unit
k
Ω
%
Ratedꢀresistance
DeviationꢀofꢀR100
Powerꢀdissipation
B-value
T
C
= 25°C
5.00
T
C
= 100°C, R
100
= 493
Ω
T
C
= 25°C
∆
R/R
P
25
5
5
20.0 mW
R
2
= R
25
exp [B
25/50
(1/T
2
– 1/(298,15 K))]
R
2
= R
25
exp [B
25/80
(1/T
2
– 1/(298,15 K))]
R
2
= R
25
exp [B
25/100
(1/T
2
– 1/(298,15 K))]
B
25/50
B
25/80
B
25/100
3375
3411
3433
K
K
K
B-value
B-value
Specificationꢀaccordingꢀtoꢀtheꢀvalidꢀapplicationꢀnote.
Final Data Sheet
4
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
5ꢀꢀꢀꢀꢀModule
Parameter
Conditions
Symbol
Value
2.5
Unit
Isolationꢀtestꢀvoltage
Materialꢀofꢀmoduleꢀbaseplate
Internalꢀisolation
RMS, f = 50 Hz, t = 1 min.
V
ISOL
ꢀ
ꢀ
ꢀ
ꢀ
kV
Cu
ꢀ
ꢀ
basicꢀinsulationꢀ(classꢀ1,ꢀIECꢀ61140)
Al
2
O
3
Creepageꢀdistance
terminalꢀtoꢀheatsink
terminalꢀtoꢀterminal
7.0
5.5
d
Creep
ꢀ
ꢀ
mm
Clearance
terminalꢀtoꢀheatsink
terminalꢀtoꢀterminal
7.0
5.0
d
Clear
CTI
ꢀ
ꢀ
ꢀ
mm
Comperativeꢀtrackingꢀindex
> 200
ꢀ
min. typ. max.
Pressureꢀdropꢀinꢀcoolingꢀcircuit
Maximumꢀpressureꢀinꢀcoolingꢀcircuit
Strayꢀinductanceꢀmodule
∆
V/
∆
t = 10.0 dm³/min; T
F
= 25°C
∆
p
p
119
2.5
mbar
bar
nH
L
sCE
R
CC’+EE’
T
stg
M
14
Moduleꢀleadꢀresistance,ꢀterminalsꢀ-ꢀchip
Storageꢀtemperature
T
F
ꢀ=ꢀ25ꢀ°C,ꢀperꢀswitch
0.80
m
Ω
°C
-40
3.00
2.5
125
Mountingꢀtorqueꢀforꢀmodulꢀmounting
Terminalꢀconnectionꢀtorque
Weight
ScrewꢀM6ꢀbaseplateꢀtoꢀheatsink
ScrewꢀM6
6.00 Nm
M
–
5.0
Nm
g
G
1340
* Kühleraufbau gemäß gültiger Application Note.
* Cooler setup according to the valid application note.
Final Data Sheet
5
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
6ꢀꢀꢀꢀꢀCharacteristicsꢀDiagrams
outputꢀcharacteristicꢀIGBT,Inverterꢀ(typical)
outputꢀcharacteristicꢀIGBT,Inverterꢀ(typical)
I
C
ꢀ=ꢀfꢀ(V
CE
I
C
ꢀ=ꢀfꢀ(V
CE
)
)
V
GE
ꢀ=ꢀ15ꢀV
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
T
vj
ꢀ=ꢀ150°C
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
V
GE
= 19V
V
GE
= 17V
V
GE
= 15V
V
GE
= 13V
V
GE
= 11V
V
GE
= 9V
800
800
700
700
600
600
500
500
400
400
300
300
200
200
100
100
0
0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0
0,0
0,5
1,0
1,5
2,0
V
CE
[V]
2,5
3,0
3,5
4,0
V
CE
[V]
transferꢀcharacteristicꢀIGBT,Inverterꢀ(typical)
switchingꢀlossesꢀIGBT,Inverterꢀ(typical)
I
C
ꢀ=ꢀfꢀ(V
GE
)
E
on
ꢀ=ꢀfꢀ(I
C
),ꢀE
off
ꢀ=ꢀfꢀ(I
C
)
V
CE
ꢀ=ꢀ20ꢀV
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
V
GE
ꢀ=ꢀ±15ꢀV,ꢀR
Gon
ꢀ=ꢀ3.3ꢀ
Ω
,ꢀR
Goff
ꢀ=ꢀ2ꢀ
Ω
,ꢀV
CE
ꢀ=ꢀ400ꢀV
70
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
E
on
, T
vj
= 125°C
E
off
, T
vj
= 125°C
E
on
, T
vj
= 150°C
60
E
off
, T
vj
= 150°C
50
40
30
20
10
0
800
700
600
500
400
300
200
100
0
5
6
7
8
9
10
11
12
0
100 200 300 400 500 600 700 800 900
V
GE
[V]
I
C
[A]
Final Data Sheet
6
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
switchingꢀlossesꢀIGBT,Inverterꢀ(typical)
E
on
ꢀ=ꢀfꢀ(R
G
),ꢀE
off
ꢀ=ꢀfꢀ(R
G
)
transientꢀthermalꢀimpedanceꢀIGBT,Inverterꢀ
Z
thJF
ꢀ=ꢀfꢀ(t)ꢀꢀꢀ(
∆
V/
∆
t=10ꢀdm³/min)
V
GE
ꢀ=ꢀ±15ꢀV,ꢀI
C
ꢀ=ꢀ550ꢀA,ꢀV
CE
ꢀ=ꢀ400ꢀV
180
1
E
on
, T
vj
= 125°C
E
off
, T
vj
= 125°C
E
on
, T
vj
= 150°C
E
off
, T
vj
= 150°C
Z
thJF
: IGBT
160
140
120
100
80
0,1
60
0,01
40
i:
1
2
3
4
5
r
i
[K/W]: 0,0062 0,022 0,0238 0,038 0,01
τ
i
[s]: 0,0005
0,02 0,058 0,45 2,19
20
0
0,001
0,001
0
4
8
12
16
R
G
[
Ω
]
20
24
28
32
0,01
0,1
t [s]
1
10
reverseꢀbiasꢀsafeꢀoperatingꢀareaꢀIGBT,Inverterꢀ(RBSOA)
I
C
ꢀ=ꢀfꢀ(V
CE
thermalꢀimpedanceꢀIGBT,Inverterꢀ
R
thJF
ꢀ=ꢀfꢀ(
∆
V/
∆
t)
)
V
GE
ꢀ=ꢀ±15ꢀV,ꢀR
Goff
ꢀ=ꢀ2ꢀ
Ω
,ꢀT
vj
ꢀ=ꢀ150°C
coolingꢀfluidꢀ=ꢀ50%ꢀwater/50%ꢀethylenglycol
2000
0,104
R
thJF
: IGBT
1800
1600
1400
1200
1000
800
0,102
0,100
0,098
0,096
0,094
0,092
0,090
600
400
I
C
, Modul
I
C
, Chip
200
0
0
100 200 300 400 500 600 700 800
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20
V
CE
[V]
∆
V/
∆
t [dm³/min]
Final Data Sheet
7
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
forwardꢀcharacteristicꢀofꢀDiode,ꢀInverterꢀ(typical)
switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)
I
F
ꢀ=ꢀfꢀ(V
F
)
E
rec
ꢀ=ꢀfꢀ(I
F
)
R
Gon
ꢀ=ꢀ3.3ꢀ
Ω
,ꢀV
CE
ꢀ=ꢀ400ꢀV
1800
22
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 150°C
E
rec
, T
vj
= 125°C
E
rec
, T
vj
= 150°C
1700
20
18
16
14
12
10
8
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
6
4
2
0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0
0
100 200 300 400 500 600 700 800 900
V
F
[V]
I
F
[A]
switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)
E
rec
ꢀ=ꢀfꢀ(R
G
)
transientꢀthermalꢀimpedanceꢀDiode,ꢀInverterꢀ
Z
thJF
=ꢀfꢀ(t)ꢀꢀꢀ(
∆
V/
∆
t=10ꢀdm³/min)
I
F
ꢀ=ꢀ550ꢀA,ꢀV
CE
ꢀ=ꢀ400ꢀV
18
16
14
12
10
8
1
Z
thJF
: Diode
E
rec
, T
vj
= 125°C
E
rec
, T
vj
= 150°C
0,1
6
4
i:
r
i
[K/W]: 0,0112 0,035 0,0373 0,0295 0,012
τ
i
[s]: 0,0006
0,017 0,053
0,39 3,2
1
2
3
4
5
2
0
0,01
0,001
0
4
8
12
16
R
G
[
Ω
]
20
24
28
32
0,01
0,1
t [s]
1
10
Final Data Sheet
8
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
thermalꢀimpedanceꢀDiode,ꢀInverterꢀ
R
thJF
ꢀ=ꢀfꢀ(
∆
V/
∆
t)
NTC-Thermistor-temperatureꢀcharacteristicꢀ(typical)
Rꢀ=ꢀfꢀ(T)
coolingꢀfluidꢀ=ꢀ50%ꢀwater/50%ꢀethylenglycol
0,132
100000
R
thJF
: Diode
R
typ
0,130
0,128
0,126
0,124
0,122
0,120
0,118
10000
1000
100
5
6
7
8
9
10 11 12 13 14 15 16 17 18 19 20
0
20
40
60
80
T
C
[°C]
100
120
140
160
∆
V/
∆
t [dm³/min]
pressureꢀdropꢀinꢀcoolingꢀcircuit
∆
pꢀ=ꢀfꢀ(
∆
V/
∆
t)
coolingꢀfluidꢀ=ꢀ50%ꢀwater/50%ꢀethylenglycol,ꢀT
F
ꢀ=ꢀ25°C
400
∆
p: Modul
360
320
280
240
200
160
120
80
40
0
0
2
4
6
8
10
12
14
16
18
20
∆
V/
∆
t [dm³/min]
Final Data Sheet
9
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
7ꢀꢀꢀꢀꢀCircuitꢀdiagram
P3
P2
P1
T11
C5
C3
C1
T
T12
G5
E5
G3
E3
G1
E1
T21
3
2
1
T
C6
C4
C2
T22
T31
G6
E6
G4
E4
G2
E2
T
T32
N3
N2
N1
Final Data Sheet
10
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
8ꢀꢀꢀꢀꢀPackageꢀoutlines
Drawing: D00044455.00.A
edges general
tolerances surface
ISO 8015 principle of independency
dimensions ISO 14405
GG
1. DIN 16742-TG6
DIN ISO
13715
target geometry according CAD file
DIN EN ISO
1302
2. DIN ISO 2768-mk
with general tolerances
method of least-squares
1
All dimensions refer to module in delivery condition
0
A ( 5 : 1 )
Au coating all side
C ( 5 : 1 )
+
0
,125
15,75
–
0,075
+
–
0
68,75
0,2
+
–
0
0,64
0,3
(213)
D ( 3 : 1 )
A
A
Pin-Fin
pedestal
D
(216)
208,7
B
M6/10 depth
9x
92,2
5
B
0,4
90,7
5
B
0,2
88,05
«
3
A1
«
3
A2
«
3
A3
«
3
A4
D
E
31
27,64
84,5
3
2
1
E3
G3
E5
G5
E1
G1
for PCB mounting
thread forming screw
3,0 10
mm (8x)
22,56
14,94
7,32
P
0,8
4
A
D
–
E
B
-C
24x
L
x
P
0,8
5
AFG
L
C
C3
C1
C5
assembly aid for PCB
P
3 10
mm (2x)
10
9x
Group2
T31
T21
T11
Group4
Group6
Group5
x
0
0
T22
T12
C2
T32
C6
7,32
14,94
22,56
P
0,8
4
A
D
–
E
B
-C
L
2x
Group3
N2
Group1
C4
P
0,8
4
A
D
–
E
B
-C
1
6
B
0,2
G6
E6
G4
L
G2
E2
E4
8x
F
N3
P3
P2
N1
P1
27,64
31
0
3,55
6,2
5
B
0,1
7,7
5
B
0,4
«
3
A8
«
3
A7
«
3
A6
«
3
A5
208,7
C
Group 1, 3, 6 ( 2 : 1 )
K
Group 2, 4, 6 ( 2 : 1 )
I
20,32
20,32
15,24
12,7
5,08
7,62
0
0
P
0,
5
AJ
J
-K
P
0,
5
AH
H
-I
L
4x
L
4x
H
J
Final Data Sheet
11
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
9ꢀꢀꢀꢀꢀLabelꢀCodes
9.1ꢀꢀꢀꢀModuleꢀCode
CodeꢀFormat
Data Matrix
Encoding
ASCII Text
SymbolꢀSize
Standard
16×16
IEC24720 and IEC16022
CodeꢀContent
Content
Digit
Exampleꢀ(below)
Module Serial Number
Module Material Number
Production Order Number
Datecode (Production Year)
Datecode (Production Week)
1 – 5
71549
142846
55054991
15
6 – 11
12 – 19
20 – 21
22 – 23
30
Example
71549142846550549911530
9.2ꢀꢀꢀꢀPackingꢀCode
CodeꢀFormat
Code128
Code Set A
34 digits
Encoding
SymbolꢀSize
Standard
IEC8859-1
CodeꢀContent
Content
Identifier
Digit
Exampleꢀ(below)
Backend Construction Number
Production Lot Number
Serial Number
Date Code
Box Quantity
X
1T
S
9D
Q
2 – 9
95056609
2X0003E0
754389
1139
12 – 19
21 – 25
28 – 31
33 – 34
15
Example
X950566091T2X0003E0S754389D1139Q15
Final Data Sheet
12
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
RevisionꢀHistory
Major changes since previous revision
Revision History
Reference
Date
Description
V3.0
2017-06-14
–
Final Data Sheet
13
V3.0,ꢀꢀ2017-06-14
FS900R08A2P2_B32
HybridPACKªꢀ2ꢀModule
Termsꢀ&ꢀConditionsꢀofꢀusage
ꢀ
Editionꢀ2014-05-30
Publishedꢀby
InfineonꢀTechnologiesꢀAG
81726ꢀMunich,ꢀGermany
©ꢀ2014ꢀInfineonꢀTechnologiesꢀAG
AllꢀRightsꢀReserved.
LegalꢀDisclaimer
Theꢀinformationꢀgivenꢀinꢀthisꢀdocumentꢀshallꢀinꢀnoꢀeventꢀbeꢀregardedꢀasꢀaꢀguaranteeꢀofꢀconditionsꢀorꢀcharacteristics.ꢀWithꢀrespectꢀtoꢀany
examplesꢀorꢀhintsꢀgivenꢀherein,ꢀanyꢀtypicalꢀvaluesꢀstatedꢀhereinꢀand/orꢀanyꢀinformationꢀregardingꢀtheꢀapplicationꢀofꢀtheꢀdevice,ꢀInfineon
Technologiesꢀherebyꢀdisclaimsꢀanyꢀandꢀallꢀwarrantiesꢀandꢀliabilitiesꢀofꢀanyꢀkind,ꢀincludingꢀwithoutꢀlimitation,ꢀwarrantiesꢀofꢀnon-infringementꢀof
intellectualꢀpropertyꢀrightsꢀofꢀanyꢀthirdꢀparty.
Information
Forꢀfurtherꢀinformationꢀonꢀtechnology,ꢀdeliveryꢀtermsꢀandꢀconditionsꢀandꢀprices,ꢀpleaseꢀcontactꢀtheꢀnearestꢀInfineonꢀTechnologiesꢀOffice
(http://www.infineon.com)
Warnings
Dueꢀtoꢀtechnicalꢀrequirements,ꢀcomponentsꢀmayꢀcontainꢀdangerousꢀsubstances.ꢀForꢀinformationꢀonꢀtheꢀtypesꢀinꢀquestion,ꢀpleaseꢀcontactꢀthe
nearestꢀInfineonꢀTechnologiesꢀOffice.
InfineonꢀTechnologiesꢀcomponentsꢀmayꢀbeꢀusedꢀinꢀlife-supportꢀdevicesꢀorꢀsystemsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineon
Technologies,ꢀifꢀaꢀfailureꢀofꢀsuchꢀcomponentsꢀcanꢀreasonablyꢀbeꢀexpectedꢀtoꢀcauseꢀtheꢀfailureꢀofꢀthatꢀlife-supportꢀdeviceꢀorꢀsystemꢀorꢀtoꢀaffect
theꢀsafetyꢀorꢀeffectivenessꢀofꢀthatꢀdeviceꢀorꢀsystem.ꢀLifeꢀsupportꢀdevicesꢀorꢀsystemsꢀareꢀintendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀto
supportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀtheyꢀfail,ꢀitꢀisꢀreasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersons
mayꢀbeꢀendangered.
Trademarks
ꢀ
TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG
AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCIPURSE™,ꢀEconoPACK™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,
DI-POL™,ꢀEasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPIM™,ꢀEconoPACK™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,
HybridPACK™,ꢀI²RF™,ꢀISOFACE™,ꢀIsoPACK™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,
PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPRO-SIL™,ꢀPROFET™,ꢀRASIC™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSINDRION™,
SIPMOS™,ꢀSmartLEWIS™,ꢀSOLIDꢀFLASH™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.
OtherꢀTrademarks
AdvanceꢀDesignꢀSystem™ꢀ(ADS)ꢀofꢀAgilentꢀTechnologies,ꢀAMBA™,ꢀARM™,ꢀMULTI-ICE™,ꢀKEIL™,ꢀPRIMECELL™,ꢀREALVIEW™,ꢀTHUMB™,
µVision™ꢀofꢀARMꢀLimited,ꢀUK.ꢀAUTOSAR™ꢀisꢀlicensedꢀbyꢀAUTOSARꢀdevelopmentꢀpartnership.ꢀBluetooth™ꢀofꢀBluetoothꢀSIGꢀInc.ꢀCAT-iq™ꢀof
DECTꢀForum.ꢀCOLOSSUS™,ꢀFirstGPS™ꢀofꢀTrimbleꢀNavigationꢀLtd.ꢀEMV™ꢀofꢀEMVCo,ꢀLLCꢀ(VisaꢀHoldingsꢀInc.).ꢀEPCOS™ꢀofꢀEpcosꢀAG.
FLEXGO™ꢀofꢀMicrosoftꢀCorporation.ꢀFlexRay™ꢀisꢀlicensedꢀbyꢀFlexRayꢀConsortium.ꢀHYPERTERMINAL™ꢀofꢀHilgraeveꢀIncorporated.ꢀIEC™ꢀof
CommissionꢀElectrotechniqueꢀInternationale.ꢀIrDA™ꢀofꢀInfraredꢀDataꢀAssociationꢀCorporation.ꢀISO™ꢀofꢀINTERNATIONALꢀORGANIZATION
FORꢀSTANDARDIZATION.ꢀMATLAB™ꢀofꢀMathWorks,ꢀInc.ꢀMAXIM™ꢀofꢀMaximꢀIntegratedꢀProducts,ꢀInc.ꢀMICROTEC™,ꢀNUCLEUS™ꢀofꢀMentor
GraphicsꢀCorporation.ꢀMIPI™ꢀofꢀMIPIꢀAlliance,ꢀInc.ꢀMIPS™ꢀofꢀMIPSꢀTechnologies,ꢀInc.,ꢀUSA.ꢀmuRata™ꢀofꢀMURATAꢀMANUFACTURINGꢀCO.,
MICROWAVEꢀOFFICE™ꢀ(MWO)ꢀofꢀAppliedꢀWaveꢀResearchꢀInc.,ꢀOmniVision™ꢀofꢀOmniVisionꢀTechnologies,ꢀInc.ꢀOpenwave™ꢀOpenwave
SystemsꢀInc.ꢀREDꢀHAT™ꢀRedꢀHat,ꢀInc.ꢀRFMD™ꢀRFꢀMicroꢀDevices,ꢀInc.ꢀSIRIUS™ꢀofꢀSiriusꢀSatelliteꢀRadioꢀInc.ꢀSOLARIS™ꢀofꢀSun
Microsystems,ꢀInc.ꢀSPANSION™ꢀofꢀSpansionꢀLLCꢀLtd.ꢀSymbian™ꢀofꢀSymbianꢀSoftwareꢀLimited.ꢀTAIYOꢀYUDEN™ꢀofꢀTaiyoꢀYudenꢀCo.
TEAKLITE™ꢀofꢀCEVA,ꢀInc.ꢀTEKTRONIX™ꢀofꢀTektronixꢀInc.ꢀTOKO™ꢀofꢀTOKOꢀKABUSHIKIꢀKAISHAꢀTA.ꢀUNIX™ꢀofꢀX/OpenꢀCompanyꢀLimited.
VERILOG™,ꢀPALLADIUM™ꢀofꢀCadenceꢀDesignꢀSystems,ꢀInc.ꢀVLYNQ™ꢀofꢀTexasꢀInstrumentsꢀIncorporated.ꢀVXWORKS™,ꢀWINDꢀRIVER™ꢀof
WINDꢀRIVERꢀSYSTEMS,ꢀINC.ꢀZETEX™ꢀofꢀDiodesꢀZetexꢀLimited.
Last update
2011-11-11
Final Data Sheet
14
V3.0,ꢀꢀ2017-06-14
wꢀwꢀwꢀ.ꢀiꢀnꢀfꢀiꢀnꢀeꢀoꢀnꢀ.ꢀcꢀoꢀm
PublishedꢀbyꢀInfineonꢀTechnologiesꢀAG
