Infineon-Technologies-IKP06N60T

Part #Infineon-Technologies-IKP06N60T
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Infineon-Technologies-IKP06N60T
IKP06N60T  
p
TRENCHSTOP
™
Series  
Low Loss DuoPack : IGBT in TRENCHSTOP
™
and Fieldstop technology with soft,  
fast recovery anti-parallel Emitter Controlled HE diode  
Features  
C
E
Very low
 
V

CE(sat)

1.5V (typ.)  
Maximum Junction Temperature 175°C  
Short circuit withstand time 5
s  
Designed for :  
G
– Variable Speed Drive for washing machines, air conditioners and induction  
cooking  
– Uninterrupted Power Supply  
TRENCHSTOP
™
and Fieldstop technology for 600V applications offers :  
– very tight parameter distribution  
– high ruggedness, temperature stable behaviour  
Low EMI  
PG-TO220-3  
Very soft, fast recovery anti-parallel Emitter Controlled HE diode  
Qualified according to JEDEC

1

for target applications  
Pb-free lead plating; RoHS compliant  
Complete product spectrum and PSpice Models :

Type  
V

CE  

I

C;Tc=100°C

V

CE(sat
),Tj=25°C

T

j,max  

6A 1.5V  
Marking  
Package  
IKP06N60T  
600V  
K06T60  
PG-TO220-3  
175
C  
Maximum Ratings  
Parameter  
Symbol  
V

C E  

Value  
Unit  
Collector-emitter voltage
,
T

j

≥ 25
C  
600  
V
DC collector current, limited by
T

jmax  

T

C

= 25
C  
T

C

= 100
C  
12  
6
I

C  

Pulsed collector current,
t

p

limited by
T

jmax  

I

C
p ul s  

–
18  
18  
A
Turn off safe operating area,
V

CE

= 600V,
T

j

= 175
C,
t

p

= 1µs  
Diode forward current, limited by
T

jmax  

T

C

= 25
C  
T

C

= 100
C  
12  
6
I

F  

Diode pulsed current,
t

p

limited by
T

jmax  

I

F
p ul s  

V

G E  

18  
Gate-emitter voltage  
V
20  
Short circuit withstand time

2)  

V

GE

= 15V,
V

CC

400V,
T

j

150
C  
t

S
C  

5
s  
Power dissipation  
T

C

= 25
C  
P

t
o
t  

88  
W
Operating junction temperature  
Storage temperature  
T

j  

-40…+175  
-55…+150  
T

s
t g  

C  
Soldering temperature  
wavesoldering, 1.6 mm (0.063 in.) from case for 10s  
260  

1

J-STD-020 and JESD-022  

2)

Allowed number of short circuits: <1000; time between short circuits: >1s.  
1
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
Thermal Resistance  
Parameter  
Symbol  
Conditions  
Max. Value  
Unit  
Characteristic  
IGBT thermal resistance,  
junction – case  
R

t
h
JC  

R

t
h
JC D  

R

t
h
JA  

1.7  
2.6  
62  
K/W  
Diode thermal resistance,  
junction – case  
Thermal resistance,  
junction – ambient  
Electrical Characteristic,
at
T

j

= 25
C, unless otherwise specified  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Static Characteristic  
Collector-emitter breakdown voltage
 
V

(
B
R )C ES
 

V

G E

=
0V,  
I

C

=
0.25mA  
600  
–
–
V
Collector-emitter saturation voltage  
V

C
E
( sat )
 

V

G E
 

=
1
5V,
I

C

=
6A  
–
–
1.5  
1.8  
2.05  
T

j

=25
C  
T

j

=175
C  
V

G E

=
0V,
I

F

=
6A  
T

j

=25
C  
Diode forward voltage  
V

F  

–
–
1.6  
1.6  
2.05  
–
T

j

=175
C  
I

C

=
0.18mA,  
V

C E

=
V

G E  

Gate-emitter threshold voltage  
V

G
E
( t h)  

4.1  
4.6  
5.7  
Zero gate voltage collector current  
I

C
E S  

V

C E

=
600V
,  
V

G E

=
0V  
µA  
T

j

=25
C  
–
–
–
–
–
–
40  
700  
100  
–
T

j

=175
C  
Gate-emitter leakage current  
Transconductance  
I

G
E S  

g

f
s  

V

C E

=
0V,
V

G E

=20V  
V

C E

=
20V,
I

C

=
6A  
–
nA  
S
3.6  
none  
Integrated gate resistor  
R

G
i
nt  

Ω
Dynamic Characteristic  
Input capacitance  
C

i
s
s  

V

C E

=
25V,  
V

G E

=
0V,  
f
=
1MHz  
–
–
–
–
368  
28  
–
–
–
–
pF  
Output capacitance  
Reverse transfer capacitance  
Gate charge  
C

o
s s  

C

r
s s  

11  
Q

G
at e  

V

C C

=
480V,
I

C

=6A  
V

G E

=
15V  
42  
nC  
nH  
A
Internal emitter inductance  
measured 5mm (0.197 in.) from case  
Short circuit collector current

1)  

L

E  

–
–
7
–
–
I

C
( SC )  

55  
V

G E

=
15V,
t

S
C

5
s  
V

C C
 

=
4
00V,  
T

j

=
2
5
C  

1)

Allowed number of short circuits: <1000; time between short circuits: >1s.  
2
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
Switching Characteristic, Inductive Load,
at
T

j

=25
C  
Value  
Unit  
Parameter  
Symbol  
Conditions  
min.  
typ.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
T

j

=
25
C
,  
t

d
( o n)  

t

r  

t

d
( of f)  

t

f  

–
–
–
–
–
–
–
9
–
–
–
–
–
–
–
ns  
V

C C

=
400V,
I

C

=
6A,  
V

G E

=
0/15V,
r

G

=
23
,  
L

=
60nH,
C

=
40pF  
6
Turn-off delay time  
Fall time  
130  
58  
L

,
C

f
rom Fig. E  
Energy losses include  
“tail” and diode reverse  
recovery.  
Turn-on energy  
E

o n  

E

o
f
f  

E

t s  

0.09  
0.11  
0.2  
mJ  
Turn-off energy  
Total switching energy  
Anti-Parallel Diode Characteristic  
Diode reverse recovery time  
Diode reverse recovery charge  
t

r
r  

–
–
–
–
123  
190  
5.3  
–
–
–
–
ns  
T

j

=25
C
,  
Q

r
r  

nC  
A
V

R

=
400V,
I

F

=
6A,  
di

F

/
dt
=550A/
s  
Diode peak reverse recovery current
 
I

r
r m  

Diode peak rate of fall of reverse  
recovery current during
t

b  

di

r
r

/
dt  
450  
A/
s  
Switching Characteristic, Inductive Load,
at
T

j

=175
C  
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
IGBT Characteristic  
Turn-on delay time  
Rise time  
T

j

=
175
C
,  
t

d
( o n)  

t

r  

t

d
( of f)  

t

f  

–
–
–
–
–
–
–
9
8
–
–
–
–
–
–
–
ns  
V

C C

=
400V,
I

C

=
6A,  
V

G E

=
0/15V,
r

G

=
23
,  
L

=
60nH,
C

=
40pF  
Turn-off delay time  
Fall time  
165  
84  
L

,
C

f
rom Fig. E  
Energy losses include  
“tail” and diode reverse  
recovery.  
Turn-on energy  
E

o n  

E

o
f
f  

E

t s  

0.14  
0.18  
0.335  
mJ  
Turn-off energy  
Total switching energy  
Anti-Parallel Diode Characteristic  
Diode reverse recovery time  
Diode reverse recovery charge  
t

r
r  

–
–
–
–
180  
500  
7.6  
–
–
–
–
ns  
T

j

=175
C  
Q

r
r  

nC  
A
V

R

=
400V,
I

F

=
6A,  
di

F

/
dt
=550A/
s  
Diode peak reverse recovery current
 
I

r
r m  

Diode peak rate of fall of reverse  
recovery current during
t

b  

di

r
r

/
dt  
285  
A/
s  
3
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
t

p

=1µs  
10A  
18A  
15A  
12A  
9A  
5µs  
10µs  
T

C

=80°C  
50µs  
T

C

=110°C  
1A  
6A  
I

c  

500µs  
3A  
5ms  
DC  
I

c  

0,1A  
0A  
100Hz  
1kHz  
10kHz  
100kHz  
1V  
10V  
100V  
1000V  
f
,
SWITCHING FREQUENCY  
V

CE

,
COLLECTOR
–
EMITTER VOLTAGE  
Figure 1.
 
Collector current as a function of  
switching frequency  
Figure 2.
 
Safe operating area  
(
D =
0,
T

C

= 25
C,  
(
T

j

175
C,
D =
0.5,
V

CE

= 400V,  
V

GE

= 0/15V,
r

G

= 23
)  
T

j

175
C;
V

GE

=0/15V)  
80W  
60W  
40W  
20W  
0W  
15A  
10A  
5A  
0A  
25°C  
75°C  
125°C  
25°C  
50°C  
75°C 100°C
 
125°C 150°C  
T

C

,
CASE TEMPERATURE  
T

C

,
CASE TEMPERATURE  
Figure 3.
 
Power dissipation as a function of  
case temperature  
Figure 4.
 
Collector current as a function of  
case temperature  
(
T

j

175
C)  
(
V

GE

15V,
T

j

175
C)  
4
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
15A  
12A  
9A  
15A  
V

G
E

=20V  
V

G
E

=20V  
15V  
12A  
9A  
6A  
3A  
0A  
15V  
13V  
11V  
9V  
13V  
11V  
9V  
7V  
7V  
6A  
3A  
0A  
0V  
1V  
2V  
3V  
0V  
1V  
2V  
3V  
V

CE

,
COLLECTOR
–
EMITTER VOLTAGE  
V

CE

,
COLLECTOR
–
EMITTER VOLTAGE  
Figure 5.
 
Typical output characteristic  
Figure 6.
 
Typical output characteristic  
(
T

j

= 25°C)  
(
T

j

= 175°C)  
I

C

=12A  
I

C

=6A  
2,5V  
2,0V  
1,5V  
1,0V  
0,5V  
0,0V  
15A  
12A  
9A  
I

C

=3A  
6A  
T

J

=
175°C  
3A  
25°C  
0A  
-50°C  
0°C  
50°C  
100°C  
0V  
2V  
4V  
6V  
8V  
10V  
V

GE

,
GATE-EMITTER VOLTAGE  
T

J

,
JUNCTION TEMPERATURE  
Figure 7.
 
Typical transfer characteristic  
Figure 8.
 
Typical collector-emitter  
saturation voltage as a function of  
(V

CE

=20V)  
junction temperature  
(
V

GE

= 15V)  
5
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
t

d(off)  

t

d(off)  

100ns  
t

f  

t

f  

100ns  
10ns  
1ns  
t

d(on)  

t

r  

t

d(on)  

10ns  
t

r  

1ns  
  
0A  
3A  
6A  
9A  
12A  
15A  
  
  
  
  
I

C

,
COLLECTOR CURRENT  
R

G

,
GATE RESISTOR  
Figure 9.
 
Typical switching times as a  
function of collector current  
(inductive load,
T

J

=175°C,  
Figure 10. Typical switching times as a  
function of gate resistor  
(inductive load,
T

J

=175°C,  
V

CE

= 400V, V

GE

= 0/15V,
r

G

= 23Ω,  
Dynamic test circuit in Figure E)  
V

CE

= 400V, V

GE

= 0/15V,
I

C

= 6A,  
Dynamic test circuit in Figure E)  
6V  
5V  
4V  
3V  
2V  
1V  
0V  
t

d(off)  

100ns  
10ns  
1ns  
max.  
typ.  
t

f  

t

d(on)  

min.  
t

r  

50°C  
100°C  
150°C  
-50°C  
0°C  
50°C  
100°C  
150°C  
T

J

,
JUNCTION TEMPERATURE  
T

J

,
JUNCTION TEMPERATURE  
Figure 11. Typical switching times as a  
function of junction temperature  
(inductive load,
V

CE

= 400V,  
Figure 12. Gate-emitter threshold voltage as  
a function of junction temperature  
(
I

C

= 0.18mA)  
V

GE

= 0/15V,
I

C

= 6A,
r

G

= 23Ω,  
Dynamic test circuit in Figure E)  
6
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
*)
E

on

and
E

ts

include losses  
*)
E

on

and
E

ts

include losses  
due to diode recovery  
due to diode recovery  
E

ts

*  
0,6 mJ  
0,5 mJ  
0,4 mJ  
0,3 mJ  
0,2 mJ  
0,1 mJ  
0,0 mJ  
0,4 mJ  
E

ts

*  
0,3 mJ  
E

on  

*
E

off  

0,2 mJ  
E

off  

E

on

*  
0,1 mJ  
0,0 mJ  
0A  
2A  
4A  
6A  
8A  
10A  
  
  
  
  
I

C

,
COLLECTOR CURRENT  
R

G

,
GATE RESISTOR  
Figure 13. Typical switching energy losses  
as a function of collector current  
(inductive load,
T

J

=175°C,  
Figure 14. Typical switching energy losses  
as a function of gate resistor  
(inductive load,
T

J

=175°C,  
V

CE

=400V, V

GE

=0/15V,
r

G

=23Ω,  
Dynamic test circuit in Figure E)  
V

CE

= 400V, V

GE

= 0/15V,
I

C

= 6A,  
Dynamic test circuit in Figure E)  
*)
E

on

and
E

ts

include losses  
*)
E

on

a
nd
E

ts

include losses  
due to diode recovery  
0,4mJ  
due to diode recovery  
0,5mJ  
E

ts

*  
0,4mJ  
0,3mJ  
0,2mJ  
0,1mJ  
0,0mJ  
0,3mJ  
E

off  

E

ts

*  
0,2mJ  
E

off  

E

on  

*
0,1mJ  
E

on  

*
0,0mJ  
50°C  
100°C  
150°C  
200V  
300V  
400V  
500V  
T

J

,
JUNCTION TEMPERATURE  
V

CE

,
COLLECTOR
–
EMITTER VOLTAGE  
Figure 15. Typical switching energy losses  
as a function of junction  
Figure 16. Typical switching energy losses  
as a function of collector emitter  
voltage  
temperature  
(inductive load,
V

CE

=400V,  
V

GE

= 0/15V,
I

C

= 6A,
r

G

= 23Ω,  
Dynamic test circuit in Figure E)  
(inductive load,
T

J

= 175°C,  
V

GE

= 0/15V,
I

C

= 6A,
r

G

= 23Ω,  
Dynamic test circuit in Figure E)  
7
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
1nF  
C

iss  

15V  
10V  
5V  
120V  
100pF  
480V  
C

oss  

C

rss  

10pF  
0V  
0nC  
10nC 20nC 30nC 40nC 50nC  
0V  
10V  
20V  
Q

GE

,
GATE CHARGE  
V

CE

,
COLLECTOR
–
EMITTER VOLTAGE  
Figure 17. Typical gate charge  
Figure 18. Typical capacitance as a function  
of collector-emitter voltage  
(
I

C

= 6 A)  
(
V

GE

=0V,
f
= 1 MHz)  
12µs  
10µs  
8µs  
80A  
60A  
40A  
20A  
0A  
6µs  
4µs  
2µs  
0µs  
10V  
11V  
12V  
13V  
14V  
12V  
14V  
16V  
18V  
V

GE

,
GATE
–
EMITTETR VOLTAGE  
V

GE

,
GATE
–
EMITETR VOLTAGE  
Figure 19. Typical short circuit collector  
current as a function of gate-  
emitter voltage  
Figure 20. Short circuit withstand time as a  
function of gate-emitter voltage  
(
V

CE

=400V
,
start at
T

J

=
25°C,  
T

Jmax

<150°C)  
(
V

CE

400V,
T

j

150
C)  
8
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
D
=0.5  
10

0

K/W  
10

-1

K/W  
10

-2

K/W  
10

0

K/W  
10

-1

K/W  
10

-2

K/W  
D
=0.5  
0.2  
R
, ( K / W )  
0.2520  
0.4578  
1.054  
0.7822  
R

1  

,
( s )
  
4.849*10

-2  

1.014*10

-2  

1.309*10

-3  

1.343*10

-4  

R

2  

0.2  
R
, ( K / W )  
0.3837  
0.4533  
0.5877  
0.2483  
,
( s )
  
5.047*10

-2  

4.758*10

-3  

4.965*10

-4  

4.717*10

-5  

R

2  

0.1  
0.1  
0.05  
0.05  
R

1  

0.02  
0.01  
C

1

=

1

/
R

1

C

2

=

2

/
R

2  

0.02  
0.01  
C

1

=

1

/
R

1

C

2

=

2

/
R

2  

single pulse  
single pulse  
1µs 10µs
 
100µs 1ms
 
10ms 100ms  
1µs 10µs
 
100µs 1ms
 
10ms 100ms  
t

P

,
PULSE WIDTH  
t

P

,
PULSE WIDTH  
Figure 21. IGBT transient thermal  
impedance  
Figure 22. Diode transient thermal  
impedance as a function of pulse  
(
D = t

p

/
T
)  
width  
(
D
=
t

P

/
T
)  
250ns  
200ns  
0,5µC  
0,4µC  
0,3µC  
0,2µC  
0,1µC  
0,0µC  
T

J

=175°C  
T

J

=175°C  
150ns  
100ns  
50ns  
0ns  
T

J

=25°C  
T

J

=25°C  
200A/µs 400A/µs 600A/µs 800A/µs  
200A/µs  
400A/µs  
600A/µs  
800A/µs  
di

F

/dt
,
DIODE CURRENT SLOPE  
di

F

/dt
,
DIODE CURRENT SLOPE  
Figure 23. Typical reverse recovery time as  
a function of diode current slope  
(
V

R

= 400V,
I

F

= 6A,  
Figure 24. Typical reverse recovery charge  
as a function of diode current  
slope  
Dynamic test circuit in Figure E)  
(
V

R

=400V,
I

F

=6 A,  
Dynamic test circuit in Figure E)  
9
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
T

J

=175°C  
-500A/µs  
-400A/µs  
-300A/µs  
-200A/µs  
-100A/µs  
0A/µs  
T

J

=25°C  
8A  
6A  
4A  
2A  
0A  
T

J

=25°C  
T

J

=175°C  
200A/µs 400A/µs 600A/µs 800A/µs  
200A/µs  
400A/µs  
600A/µs  
800A/µs  
di

F

/dt
,
DIODE CURRENT SLOPE  
di

F

/dt
,
DIODE CURRENT SLOPE  
Figure 25. Typical reverse recovery current  
as a function of diode current  
slope  
Figure 26. Typical diode peak rate of fall of  
reverse recovery current as a  
function of diode current slope  
(
V

R

= 400V,
I

F

= 6A,  
(
V

R

= 400V,
I

F

= 6A,  
Dynamic test circuit in Figure E)  
Dynamic test circuit in Figure E)  
10A  
8A  
2,0V
I

F

=12A  
6A  
1,5V  
6A  
3A  
1,0V  
4A  
T

J

=175°C  
0,5V  
0,0V  
2A  
25°C  
0A  
0°C  
50°C  
100°C  
150°C  
0V  
1V  
2V  
V

F

,
FORWARD VOLTAGE  
T

J

,
JUNCTION TEMPERATURE  
Figure 27. Typical diode forward current as  
a function of forward voltage  
Figure 28. Typical diode forward voltage as a  
function of junction temperature  
10  
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
PG-TO220-3  
11  
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
i,v  
t
=t
+
t  
S F  
di /dt  
r r  
F
Q
=Q
+
Q  
r r  
S
F
t
r r  
I
t
t
F
S
F
t
Q
10%
I  
r r m  
Q
S
F
I
r r m  
di /dt  
V
r r  
r r m  
R
90%
I  
Figure C. Definition of diodes  
switching characteristics  

1  

2  

n  

r

1  

r

2  

r

n  

T (t)  
j
p(t)  
r

2  

r

1  

r

n  

Figure A. Definition of switching times  
T
C
Figure D. Thermal equivalent  
circuit  
Figure B. Definition of switching losses  
12  
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS  

IKP06N60T  
p
TRENCHSTOP
™
Series  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2013 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or  
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual  
property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact the nearest  
Infineon Technologies Office (

)
.  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information on the  
types in question, please contact the nearest Infineon Technologies Office.  
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or  
systems and/or automotive, aviation and aerospace applications or systems only with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the  
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or  
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the  
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable  
to assume that the health of the user or other persons may be endangered.  
13  
Rev. 2.5
 
20.09.2013  
IFAG IPC TD VLS