Infineon-Technologies-IPB009N03L-G

Part #Infineon-Technologies-IPB009N03L-G
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Infineon-Technologies-IPB009N03L-G
IPB009N03LꢀG  
MOSFET  
OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
D²-PAKꢀ7pin  
Features  
•ꢀMOSFETꢀforꢀORingꢀandꢀUninterruptibleꢀPowerꢀSupply  
•ꢀQualifiedꢀaccordingꢀtoꢀJEDEC

1)

ꢀꢀforꢀtargetꢀapplications  
•ꢀN-channel  
tab  
•ꢀLogicꢀlevel  
•ꢀUltra-lowꢀon-resistanceꢀ
R

DS(on)  

•ꢀ100%ꢀAvalancheꢀtested  
1
7
•ꢀPb-freeꢀplating;ꢀRoHSꢀcompliant  
Tableꢀ1ꢀꢀꢀꢀꢀKeyꢀPerformanceꢀParameters  
Drain  
Pin 4, tab  
Parameter  
Value  
Unit  
V

DS  

30  
V
Gate  
Pin 1  
R

DS(on),max  

I

D  

0.95  
180  
m
Ω
 
A
Source  
Pin 2,3,5,6,7  
Typeꢀ/ꢀOrderingꢀCode  
Package  
Marking  
RelatedꢀLinks  
IPB009N03L G  
PG-TO263-7  
009N03L  
–

1)

J-STD20 and JESD22  
Final Data Sheet  
1
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
TableꢀofꢀContents  
Description .
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Maximum ratings
 
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3  
Thermal characteristics
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics
 
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4  
Electrical characteristics diagrams
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
6  
Package Outlines
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
10  
Revision History
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
11  
Trademarks .
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
11  
Disclaimer .
 
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
 
11  
Final Data Sheet  
2
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
1ꢀꢀꢀꢀꢀMaximumꢀratings  
atꢀ
T

A

=25ꢀ°C,ꢀunlessꢀotherwiseꢀspecified  
Tableꢀ2ꢀꢀꢀꢀꢀMaximumꢀratings  
Values  
Typ.  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
–
–
–
–
–
–
–
–
180  
180  
180  
180  
V

GS

=10ꢀV,ꢀ
T

C

=25ꢀ°C  
V

GS

=10ꢀV,ꢀ
T

C

=100ꢀ°C  
V

GS

=4.5ꢀV,ꢀ
T

C

=25ꢀ°C  
V

GS

=4.5ꢀV,ꢀ
T

C

=100ꢀ°C  
Continuous drain current  
I

D  

A
Pulsed drain current

1)  

Avalanche current, single pulse

2)  

I

D,pulse  

I

AS  

–
–
–
–
–
–
1260  
100  
A
T

C

=25ꢀ°C  
A
T

C

=25ꢀ°C  
Avalanche energy, single pulse  
E

AS  

610  
mJ  
I

D

=100ꢀA,ꢀ
R

GS

=25ꢀ
Ω  
I

D

=180ꢀA,ꢀ
V

DS

=24ꢀV,ꢀd
i
/d
t
=200ꢀA/µs,  
T

j,max

=175ꢀ°C  
Reverseꢀdiodeꢀd
v
/d
t  
d
v
/d
t  
–
–
6
kV/µs  
Gate source voltage  
Power dissipation  
V

GS  

P

tot  

-20  
–
–
–
20  
V
–
250  
W
T

C

=25ꢀ°C  
IEC climatic category;  
DIN IEC 68-1: 55/175/56  
Operating and storage temperature  
T

j

,ꢀ
T

stg  

-55  
–
175  
°C  
2ꢀꢀꢀꢀꢀThermalꢀcharacteristics  
Tableꢀ3ꢀꢀꢀꢀꢀThermalꢀcharacteristics  
Values  
Typ.  
–
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Thermal resistance, junction – case  
R

thJC  

R

thJA  

–
0.6  
K/W  
K/W  
–
–
SMD version, device on PCB,  
minimal footprint  
–
–
–
–
62  
40  
SMD version, device on PCB,  
6 cm² cooling area

3)  

R

thJA  

K/W  
–

1)

See Diagram 3 for more detailed information  

2)

See Diagram 13 for more detailed information  

3)

Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection.  
PCB is vertical in still air.  
Final Data Sheet  
3
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
3ꢀꢀꢀꢀꢀElectricalꢀcharacteristics  
Tableꢀ4ꢀꢀꢀꢀꢀStaticꢀcharacteristics  
Values  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
30  
1
Typ.  
Max.  
–
Drain-source breakdown voltage  
Gate threshold voltage  
V

(BR)DSS  

V

GS(th)  

–
–
V
V
V

GS

=0ꢀV,ꢀ
I

D

=1ꢀmA  
2.2  
V

DS

=
V

GS

,ꢀ
I

D

=250ꢀµA  
–
–
0.1  
20  
2
200  
V

DS

=30ꢀV,ꢀ
V

GS

=0ꢀV,ꢀ
T

j

=25ꢀ°C  
V

DS

=30ꢀV,ꢀ
V

GS

=0ꢀV,ꢀ
T

j

=125ꢀ°C  
Zero gate voltage drain current  
Gate-source leakage current  
Drain-source on-state resistance  
I

DSS  

µA  
nA  
I

GSS  

–
10  
100  
V

GS

=20ꢀV,ꢀ
V

DS

=0ꢀV  
–
–
0.95  
0.7  
1.3  
0.95  
V

GS

=4.5ꢀV,ꢀ
I

D

=100ꢀA  
V

GS

=10ꢀV,ꢀ
I

D

=100ꢀA  
R

DS(on)  

m
Ω  
Gate resistance  
R

G  

g

fs  

–
1.5  
–
–
Ω
–
Transconductance  
180  
370  
S
|
V

DS

|>2|
I

D

|
R

DS(on)max

,ꢀ
I

D

=100ꢀA  
Tableꢀ5ꢀꢀꢀꢀꢀDynamicꢀcharacteristics  
Values  
Typ.  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Input capacitance  
C

iss  

C

oss  

C

rss  

–
–
–
19000 25000 pF  
5700 7600 pF  
V

GS

=0ꢀV,ꢀ
V

DS

=15ꢀV,ꢀ
f
=1ꢀMHz  
V

GS

=0ꢀV,ꢀ
V

DS

=15ꢀV,ꢀ
f
=1ꢀMHz  
V

GS

=0ꢀV,ꢀ
V

DS

=15ꢀV,ꢀ
f
=1ꢀMHz  
Output capacitance  
Reverse transfer capacitance  
360  
26  
–
–
pF  
ns  
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=100ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
Turn-on delay time  
Rise time  
t

d(on)  

t

r  

t

d(off)  

t

f  

–
–
–
–
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=100ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
14  
–
–
–
ns  
ns  
ns  
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=100ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
Turn-off delay time  
Fall time  
103  
22  
V

DD

=15ꢀV,ꢀ
V

GS

=10ꢀV,ꢀ
I

D

=100ꢀA,  
R

G,ext

=1.6ꢀ
Ω  
Tableꢀ6ꢀꢀꢀꢀꢀGateꢀchargeꢀcharacteristics

1)

ꢀ  
Values  
Typ.  
50  
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
Gate to source charge  
Gate charge at threshold  
Gate to drain charge  
Switching charge  
Q

gs  

–
–
–
–
–
–
–
–
–
–
nC  
nC  
nC  
nC  
nC  
V
V

DD

=15ꢀV,ꢀ
I

D

=100ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=100ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=100ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=100ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=100ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=100ꢀA,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
V

DD

=15ꢀV,ꢀ
I

D

=100ꢀA,ꢀ
V

GS

=0ꢀtoꢀ10ꢀV  
V

DS

=0.1ꢀV,ꢀ
V

GS

=0ꢀtoꢀ4.5ꢀV  
Q

g(th)  

Q

gd  

28  
–
24  
–
Q

sw  

46  
–
Gate charge total  
Q

g  

110  
2.9  
146  
Gate plateau voltage  
Gate charge total  
V

plateau  

Q

g  

–
–
–
–
227  
95  
nC  
nC  
nC  
Gate charge total, sync. FET  
Output charge  
Q

g(sync)  

Q

oss  

148  
V

DD

=15ꢀV,ꢀ
V

GS

=0ꢀV  

1)

See
″
Gate charge waveforms
″
for parameter definition  
Final Data Sheet  
4
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
Tableꢀ7ꢀꢀꢀꢀꢀReverseꢀdiode  
Values  
Typ.  
–
Parameter  
Symbol  
Unit Noteꢀ/ꢀTestꢀCondition  
Min.  
Max.  
180  
1260  
1
Diode continuous forward current  
Diode pulse current  
I

S  

–
–
–
–
A
T

C

=25ꢀ°C  
I

S,pulse  

V

SD  

Q

rr  

–
A
T

C

=25ꢀ°C  
Diode forward voltage  
0.82  
135  
V
V

GS

=0ꢀV,ꢀ
I

F

=100ꢀA,ꢀ
T

j

=25ꢀ°C  
V

R

=15ꢀV,ꢀ
I

F

=
I

S

,ꢀd
i

F

/d
t
=400ꢀA/µs  
Reverse recovery charge  
–
nC  
Final Data Sheet  
5
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
4ꢀꢀꢀꢀꢀElectricalꢀcharacteristicsꢀdiagrams  
Diagramꢀ1:ꢀPowerꢀdissipation  
Diagramꢀ2:ꢀDrainꢀcurrent  
300  
200  
250  
200  
150  
100  
50  
160  
120  
80  
40  
0
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
T

C

ꢀ[°C]  
T

C

ꢀ[°C]  
P

tot

=f(
T

C

)  
I

D

=f(
T

C

);ꢀ
V

GS

≥
10ꢀV  
Diagramꢀ3:ꢀSafeꢀoperatingꢀarea  
Diagramꢀ4:ꢀMax.ꢀtransientꢀthermalꢀimpedance  
10

4  

10

0  

0.5  
1 µs  
10

3  

10 µs  
100 µs  
0.2  
10

-1  

0.1  
10

2  

0.05  
0.02  
DC  
1 ms  
10

-2  

0.01  
10 ms  
10

1  

single pulse  
10

0  

10

-1  

10

-3  

10

0  

10

1  

10

2  

10

-6  

10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

V

DS

ꢀ[V]  
t

p

ꢀ[s]  
I

D

=f(
V

DS

);ꢀ
T

C

=25ꢀ°C;ꢀ
D
=0;ꢀparameter:ꢀ
t

p  

Z

thJC

=f(
t

p

);ꢀparameter:ꢀ
D
=
t

p

/
T  
Final Data Sheet  
6
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
Diagramꢀ5:ꢀTyp.ꢀoutputꢀcharacteristics  
Diagramꢀ6:ꢀTyp.ꢀdrain-sourceꢀonꢀresistance  
1000  
2.0  
5 V  
10 V  
3.2 V  
4.5 V  
800  
600  
400  
200  
0
1.6  
3.5 V  
4 V  
1.2  
0.8  
0.4  
0.0  
4 V  
4.5 V  
6 V  
10 V  
5 V  
3.5 V  
3.2 V  
3 V  
2.8 V  
0
1
2
3
0
40  
80  
120  
160  
200  
V

DS

ꢀ[V]  
I

D

ꢀ[A]  
I

D

=f(
V

DS

);ꢀ
T

j

=25ꢀ°C;ꢀparameter:ꢀ
V

GS  

R

DS(on)

=f(
I

D

);ꢀ
T

j

=25ꢀ°C;ꢀparameter:ꢀ
V

GS  

Diagramꢀ7:ꢀTyp.ꢀtransferꢀcharacteristics  
Diagramꢀ8:ꢀTyp.ꢀforwardꢀtransconductance  
1000  
500  
800  
600  
400  
400  
300  
200  
100  
0
200  
175 °C  
25 °C  
0
0
1
2
3
4
5
0
40  
80  
120  
160  
200  
V

GS

ꢀ[V]  
I

D

ꢀ[A]  
I

D

=f(
V

GS

);ꢀ|
V

DS

|>2|
I

D

|
R

DS(on)max

;ꢀparameter:ꢀ
T

j  

g

fs

=f(
I

D

);ꢀ
T

j

=25ꢀ°C  
Final Data Sheet  
7
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
Diagramꢀ9:ꢀDrain-sourceꢀon-stateꢀresistance  
Diagramꢀ10:ꢀTyp.ꢀgateꢀthresholdꢀvoltage  
1.80  
2.5  
1.60  
1.40  
1.20  
2.0  
1.5  
1.0  
0.5  
0.0  
98 %  
1.00  
0.80  
typ  
0.60  
0.40  
0.20  
0.00  
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
T

j

ꢀ[°C]  
T

j

ꢀ[°C]  
R

DS(on)

=f(
T

j

);ꢀ
I

D

=100ꢀA;ꢀ
V

GS

=10ꢀV  
V

GS(th)

=f(
T

j

);ꢀ
V

GS

=
V

DS

;ꢀ
I

D

=1ꢀmA  
Diagramꢀ11:ꢀTyp.ꢀcapacitances  
Diagramꢀ12:ꢀForwardꢀcharacteristicsꢀofꢀreverseꢀdiode  
10

5  

10

4  

25 °C  
175 °C  
25 °C, 98%  
175 °C, 98%  
10

3  

10

2  

10

1  

10

0  

Ciss  
10

4  

10

3  

10

2  

Coss  
Crss  
0
10  
20  
30  
0.0  
0.5  
1.0  
1.5  
2.0  
V

DS

ꢀ[V]  
V

SD

ꢀ[V]  
C
=f(
V

DS

);ꢀ
V

GS

=0ꢀV;ꢀ
f
=1ꢀMHz  
I

F

=f(
V

SD

);ꢀparameter:ꢀ
T

j  

Final Data Sheet  
8
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
Diagramꢀ13:ꢀAvalancheꢀcharacteristics  
Diagramꢀ14:ꢀTyp.ꢀgateꢀcharge  
10

3  

12  
15 V  
6 V  
10  
8
24 V  
10

2  

25 °C  
150 °C  
100 °C  
6
10

1  

4
2
10

0  

0
10

0  

10

1  

10

2  

10

3  

0
50  
100  
150  
200  
250  
t

AV

ꢀ[µs]  
Q

gate

ꢀ[nC]  
I

AS

=f(
t

AV

);ꢀ
R

GS

=25ꢀ
Ω
;ꢀparameter:ꢀ
T

j(start)  

V

GS

=f(
Q

gate

);ꢀ
I

D

=100ꢀAꢀpulsed;ꢀparameter:ꢀ
V

DD  

Diagramꢀ15:ꢀDrain-sourceꢀbreakdownꢀvoltage  
Gate charge waveforms  
34  
33  
32  
31  
30  
29  
28  
-60  
-20  
20  
60  
100  
140  
180  
T

j

ꢀ[°C]  
V

BR(DSS)

=f(
T

j

);ꢀ
I

D

=1ꢀmA  
Final Data Sheet  
9
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
5ꢀꢀꢀꢀꢀPackageꢀOutlines  
Figureꢀ1ꢀꢀꢀꢀꢀOutlineꢀPG-TO263-7,ꢀdimensionsꢀinꢀmm/inches  
Final Data Sheet  
10  
Rev.ꢀ2.0,ꢀꢀ2016-04-21  

OptiMOS

ª

3ꢀPower-Transistor,ꢀ30ꢀV  
IPB009N03LꢀG  
RevisionꢀHistory  
IPB009N03L G  
Revision:ꢀ2016-04-21,ꢀRev.ꢀ2.0  
Previous Revision  
Revision Date  
2.0  
Subjects (major changes since last revision)  
Release of final version  
2016-04-21  
TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG  
AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCoolGaN™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCoolSiC™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,ꢀDI-POL™,ꢀDrBlade™,  
EasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPACK™,ꢀEconoPIM™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,ꢀHybridPACK™,ꢀInfineon™,  
ISOFACE™,ꢀIsoPACK™,ꢀi-Wafer™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOmniTune™,ꢀOPTIGA™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,  
PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPROFET™,ꢀPRO-SIL™,ꢀRASIC™,ꢀREAL3™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSIPMOS™,ꢀSmartLEWIS™,  
SOLIDꢀFLASH™,ꢀSPOC™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.  
TrademarksꢀupdatedꢀAugustꢀ2015  
OtherꢀTrademarks  
Allꢀreferencedꢀproductꢀorꢀserviceꢀnamesꢀandꢀtrademarksꢀareꢀtheꢀpropertyꢀofꢀtheirꢀrespectiveꢀowners.  
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Publishedꢀby  
InfineonꢀTechnologiesꢀAG  
81726ꢀMünchen,ꢀGermany  
©ꢀ2016ꢀInfineonꢀTechnologiesꢀAG  
AllꢀRightsꢀReserved.  
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Theꢀinformationꢀgivenꢀinꢀthisꢀdocumentꢀshallꢀinꢀnoꢀeventꢀbeꢀregardedꢀasꢀaꢀguaranteeꢀofꢀconditionsꢀorꢀcharacteristics.ꢀWith  
respectꢀtoꢀanyꢀexamplesꢀorꢀhintsꢀgivenꢀherein,ꢀanyꢀtypicalꢀvaluesꢀstatedꢀhereinꢀand/orꢀanyꢀinformationꢀregardingꢀtheꢀapplication  
ofꢀtheꢀdevice,ꢀInfineonꢀTechnologiesꢀherebyꢀdisclaimsꢀanyꢀandꢀallꢀwarrantiesꢀandꢀliabilitiesꢀofꢀanyꢀkind,ꢀincludingꢀwithout  
limitation,ꢀwarrantiesꢀofꢀnon-infringementꢀofꢀintellectualꢀpropertyꢀrightsꢀofꢀanyꢀthirdꢀparty.  
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Forꢀfurtherꢀinformationꢀonꢀtechnology,ꢀdeliveryꢀtermsꢀandꢀconditionsꢀandꢀpricesꢀpleaseꢀcontactꢀyourꢀnearestꢀInfineon  
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).  
Warnings  
Dueꢀtoꢀtechnicalꢀrequirements,ꢀcomponentsꢀmayꢀcontainꢀdangerousꢀsubstances.ꢀForꢀinformationꢀonꢀtheꢀtypesꢀinꢀquestion,  
pleaseꢀcontactꢀtheꢀnearestꢀInfineonꢀTechnologiesꢀOffice.  
TheꢀInfineonꢀTechnologiesꢀcomponentꢀdescribedꢀinꢀthisꢀDataꢀSheetꢀmayꢀbeꢀusedꢀinꢀlife-supportꢀdevicesꢀorꢀsystemsꢀand/or  
automotive,ꢀaviationꢀandꢀaerospaceꢀapplicationsꢀorꢀsystemsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineonꢀTechnologies,ꢀifꢀa  
failureꢀofꢀsuchꢀcomponentsꢀcanꢀreasonablyꢀbeꢀexpectedꢀtoꢀcauseꢀtheꢀfailureꢀofꢀthatꢀlife-support,ꢀautomotive,ꢀaviationꢀand  
aerospaceꢀdeviceꢀorꢀsystemꢀorꢀtoꢀaffectꢀtheꢀsafetyꢀorꢀeffectivenessꢀofꢀthatꢀdeviceꢀorꢀsystem.ꢀLifeꢀsupportꢀdevicesꢀorꢀsystemsꢀare  
intendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀtoꢀsupportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀtheyꢀfail,ꢀitꢀis  
reasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersonsꢀmayꢀbeꢀendangered.  
Final Data Sheet  
11  
Rev.ꢀ2.0,ꢀꢀ2016-04-21