Infineon-Technologies-IPD12CN10N-G
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IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
Opti
MOS
™
2 Power-Transistor
Features
Product Summary
V
DS
100
12.4
67
V
• N-channel, normal level
R
DS(on),max
(TO252)
m
W
A
• Excellent gate charge x
R
DS(on)
product (FOM)
• Very low on-resistance
R
DS(on)
I
D
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC
1)
for target application
• Ideal for high-frequency switching and synchronous rectification
• Halogen-free according to IEC61249-2-21
Type
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
Package
Marking
PG-TO263-3
12CN10N
PG-TO252-3
12CN10N
PG-TO262-3
12CN10N
PG-TO220-3
12CN10N
Maximum ratings,
at
T
j
=25 °C, unless otherwise specified
Value
Parameter
Symbol Conditions
Unit
I
D
T
C
=25 °C
T
C
=100 °C
T
C
=25 °C
Continuous drain current
67
48
A
Pulsed drain current
2)
I
D,pulse
E
AS
268
154
I
D
=67 A,
R
GS
=25
W
Avalanche energy, single pulse
mJ
I
D
=67 A,
V
DS
=80 V,
d
i
/d
t
=100 A/µs,
T
j,max
=175 °C
Reverse diode d
v
/d
t
d
v
/d
t
6
kV/µs
Gate source voltage
3)
V
GS
±20
V
P
tot
T
C
=25 °C
Power dissipation
125
W
°C
T
j
,
T
stg
Operating and storage temperature
-55 … 175
55/175/56
IEC climatic category; DIN IEC 68-1
1)
J-STD20 and JESD22
2)
see figure 3
3)
T
=150°C and duty cycle D=0.01 for V
gs
<-5V
jmax
Rev. 1.08
page 1
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
Values
typ.
Parameter
Symbol Conditions
Unit
min.
max.
Thermal characteristics
R
thJC
Thermal resistance, junction – case
–
–
–
–
–
–
–
–
–
–
1.2
62
40
75
50
K/W
R
thJA
minimal footprint
Thermal resistance, junction –
ambient (TO220, TO262, TO263)
6 cm2 cooling area
4)
minimal footprint
Thermal resistance, junction –
ambient (TO252)
6 cm2 cooling area
4)
Electrical characteristics,
at
T
j
=25 °C, unless otherwise specified
Static characteristics
V
(BR)DSS
V
GS
=0 V,
I
D
=1 mA
V
GS(th)
V
DS
=
V
GS
,
I
D
=83 µA
Drain-source breakdown voltage
Gate threshold voltage
100
2
–
–
V
3
4
V
DS
=80 V,
V
GS
=0 V,
T
j
=25 °C
I
DSS
Zero gate voltage drain current
–
0.1
1
µA
V
DS
=80 V,
V
GS
=0 V,
T
j
=125 °C
–
–
–
10
1
100
I
GSS
V
GS
=20 V,
V
DS
=0 V
Gate-source leakage current
100 nA
V
GS
=10 V,
I
D
=67 A,
(TO252)
R
DS(on)
Drain-source on-state resistance
9.3
12.4
12.6
m
W
V
GS
=10 V,
I
D
=67 A,
(TO263)
–
9.5
V
GS
=10 V,
I
D
=67 A,
(TO220, TO262)
–
–
9.8
1.5
77
12.9
R
G
g
fs
Gate resistance
–
–
W
|
V
DS
|>2|
I
D
|
R
DS(on)max
I
D
=67 A
,
Transconductance
39
S
4)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.08
page 2
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
Values
typ.
Parameter
Symbol Conditions
Unit
min.
max.
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
C
iss
–
–
–
–
–
–
–
3250
489
29
4320 pF
650
V
GS
=0 V,
V
DS
=50 V,
f
=1 MHz
C
oss
C
rss
t
d(on)
t
r
44
17
26
32
48
12
ns
V
DD
=50 V,
V
GS
=10 V,
I
D
=33.5 A,
21
t
d(off)
t
f
Turn-off delay time
Fall time
32
R
G,ext
=1.6
W
8
Gate Charge Characteristics
5)
Gate to source charge
Gate to drain charge
Switching charge
Q
gs
–
–
–
–
–
–
18
12
20
49
5.5
52
24
18
29
65
–
nC
Q
gd
V
DD
=50 V,
I
D
=67 A,
V
GS
=0 to 10 V
Q
sw
Q
g
Gate charge total
V
plateau
Q
oss
Gate plateau voltage
Output charge
V
V
DD
=50 V,
V
GS
=0 V
69
nC
Reverse Diode
I
S
Diode continous forward current
Diode pulse current
–
–
–
–
67
A
T
C
=25 °C
I
S,pulse
268
V
GS
=0 V,
I
F
=67 A,
T
j
=25 °C
V
SD
Diode forward voltage
–
1
1.2
–
V
t
rr
Reverse recovery time
–
–
105
255
ns
V
R
=50 V,
I
F
=
I
S
,
d
i
F
/d
t
=100 A/µs
Q
rr
Reverse recovery charge
nC
5)
See figure 16 for gate charge parameter definition
Rev. 1.08
page 3
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
1 Power dissipation
2 Drain current
P
tot
=f(
T
C
)
I
D
=f(
T
C
);
V
GS
≥10 V
140
120
100
80
70
60
50
40
30
20
10
0
60
40
20
0
0
50
100
150
200
0
50
100
150
200
T
C
[°C]
T
C
[°C]
3 Safe operating area
I
D
=f(
V
DS
);
T
C
=25 °C;
D
=0
parameter:
t
p
4 Max. transient thermal impedance
Z
thJC
=f(
t
p
)
parameter:
D
=
t
p
/
T
10
3
10
1
1 µs
10
2
10 µs
10
0
100 µs
0.5
1 ms
DC
10
1
10 ms
0.2
0.1
10
-1
0.05
0.02
10
0
0.01
single pulse
10
-1
10
-2
10
-1
10
0
10
1
10
2
10
3
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
V
DS
[V]
t
p
[s]
Rev. 1.08
page 4
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
5 Typ. output characteristics
I
D
=f(
V
DS
);
T
j
=25 °C
6 Typ. drain-source on resistance
R
DS(on)
=f(
I
D
);
T
j
=25 °C
parameter:
V
GS
parameter:
V
GS
250
30
10 V
8 V
5 V
4.5 V
7 V
25
20
15
10
5
200
150
5.5 V
6.5 V
6 V
100
6 V
10 V
5.5 V
50
5 V
4.5 V
0
0
0
1
2
3
4
5
0
20
40
60
80
V
DS
[V]
I
D
[A]
7 Typ. transfer characteristics
I
D
=f(
V
GS
); |
V
DS
|>2|
I
D
|
R
DS(on)max
parameter:
T
j
8 Typ. forward transconductance
g
fs
=f(
I
D
);
T
j
=25 °C
250
200
150
100
50
100
80
60
40
20
0
175 °C
25 °C
0
0
2
4
6
8
0
20
40
60
80
V
GS
[V]
I
D
[A]
Rev. 1.08
page 5
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R
DS(on)
=f(
T
j
);
I
D
=67 A;
V
GS
=10 V
V
GS(th)
=f(
T
j
);
V
GS
=
V
DS
parameter:
I
D
30
25
20
4
3.5
3
830 µA
83 µA
2.5
2
98 %
15
typ
1.5
1
10
5
0
0.5
0
-60
-20
20
60
100
140
180
-60
-20
20
60
T
j
[°C]
100
140
180
T
j
[°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
I
F
=f(
V
SD
C
=f(
V
DS
);
V
GS
=0 V;
f
=1 MHz
)
parameter:
T
j
10
5
10
3
25 °C
10
4
175 °C
175 °C, 98%
10
2
Ciss
Coss
10
3
25 °C, 98%
10
1
Crss
10
2
10
1
10
0
0
0
20
40
60
80
0.5
1
1.5
2
V
DS
[V]
V
SD
[V]
Rev. 1.08
page 6
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
13 Avalanche characteristics
14 Typ. gate charge
V
GS
=f(
Q
gate
);
I
D
=67 A pulsed
parameter:
V
DD
I
AS
=f(
t
AV
);
R
GS
=25
W
parameter:
T
j(start)
1000
12
10
8
50 V
20 V
100
80 V
6
25 °C
100 °C
150 °C
10
4
2
1
0
1
10
100
1000
0
10
20
30
40
50
t
AV
[µs]
Q
gate
[nC]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V
BR(DSS)
=f(
T
j
);
I
D
=1 mA
115
110
105
100
95
V
GS
Q
g
V
gs(th)
Q
g(th)
Q
sw
Q
gd
Q
gate
Q
gs
90
-60
-20
20
60
100
140
180
T
j
[°C]
Rev. 1.08
page 7
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
PG-TO220-3: Outline
Rev. 1.08
page 8
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
PG-TO262-3-1 (I²PAK)
Rev. 1.08
page 9
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
PG-TO-263 (D²-Pak)
Rev. 1.08
page 10
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
PG-TO252-3: Outline
Rev. 1.08
page 11
2013-07-09
IPB12CN10N G
IPD12CN10N G
IPI12CN10N G
IPP12CN10N G
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev. 1.08
page 12
2013-07-09
