Infineon-Technologies-IRF9953TRPBF

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Infineon-Technologies-IRF9953TRPBF
PD – 95477  
IRF9953PbF  
HEXFET

®

Power MOSFET  
l
Generation V Technology  
l
Ultra Low On-Resistance  
l
Dual P-Channel MOSFET  
l
Surface Mount  
l
Very Low Gate Charge and  
Switching Losses  
1
2
3
4
8
S1  
G1  
D1  
V

DSS

= -30V  
7
D1  
6
S2  
D2  
5
G2  
D2  
R

DS(on)

= 0.25
Ω  
l
Fully Avalanche Rated  
l
Lead-Free  
Top View  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low
 
on-resistance per silicon area.
 
This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
Recommended upgrade:
 
IRF7306 or IRF7316  
Lower profile/smaller equivalent:
 
IRF7506  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powe
r
a
pplications. Wit
h
t
hes
e
i
mprovements
,
m
ultiple  
device
s
c
a
n
b
e
u
se
d
i
n
a
n
a
pplicatio
n
w
it
h
d
ramatically  
reduced board space.
 
The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
SO-8  
Absolute Maximum Ratings ( T

A

= 25°C Unless Otherwise Noted)  
Symbol  
V

DS  

V

GS  

Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
-30  
± 20  
-2.3  
V
T

A

= 25°C  
T

A

= 70°C  
Continuous Drain Current
ꢀ
 
I

D  

-1.8  
A
Pulsed  
Drain  
-10  
CurrentI  
DM  
Continuous Source Current (Diode Conduction)  
I

S  

1.6  
T

A

= 25°C  
T

A

= 70°C  
2.0  
1.3  
Maximum Power Dissipation
ꢀ  
P
D
W
Single Pulse Avalanche Energy  
Avalanche  
E

AS  

57  
mJ  
A
CurrentI

AR  

-1.3  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt
ƒ  
Junction and Storage Temperature Range  
E

AR  

0.20  
V/  
mJ  
dv/dt-5.0  
T

J,

T

STG  

ns  
-55 to + 150  
°C  
Thermal Resistance Ratings  
Parameter  
Symbol  
Limit  
Units  
Maximum Junction-to-Ambient
ꢀ  
R

θ
JA  

62.5  
°C/W  
7/16/04  

IRF9953PbF  
Electrical Characteristics @ T

J

= 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
V

(BR)DSS  

Drain-to-Source Breakdown Voltage  
-30 ––– –––  
V
V

GS

= 0V, I

D

= -250µA  
∆
V

(BR)DSS

/
∆
T

J

Breakdown Voltage Temp. Coefficient
 
––– 0.015 –––
 
V/°C Reference
 
to 25°C, I

D

= -1mA  
––– 0.165
 
0.250  
––– 0.290
 
0.400  
-1.0 ––– –––  
––– -2.4 –––  
––– ––– -2.0  
––– ––– -25  
––– ––– 100  
––– –––
 
-100  
V

GS

= 10V, I

D

= -1.0A
„  
V

GS

= 4.5V, I

D

= -0.50A
„  
V

DS

= V

GS

, I

D

= -250µA  
V

DS

= -15V, I

D

= -2.3A  
V

DS

= 24V, V

GS

= 0V  
V

DS

= 24V, V

GS

= 0V, T

J

= 55°C  
V

GS

= -20V  
R

DS(on)  

Static Drain-to-Source On-Resistance  
Ω
V

GS(th)  

g

fs  

Gate Threshold Voltage  
V
S
Forward Transconductance  
I

DSS  

I

GSS  

Drain-to-Source Leakage Current  
µA  
nA  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
V

GS

= 20V  
Q

g  

––– 6.1  
12  
I

D

= -2.3A  
Q

gs  

Q

gd  

t

d(on)  

t

r  

Gate-to-Source Charge  
Gate-to-Drain (“Miller”) Charge  
Turn-On Delay Time  
––– 1.7 3.4  
––– 1.1 2.2  
nC V

DS

= -10V  
V

GS

= -10V, See Fig. 10
„  
––– 9.7  
––– 14  
––– 20  
––– 6.9  
19  
28  
40  
14  
V

DD

= -10V  
I

D

= -1.0A  
Ris
e
T
ime  
ns  
pF  
t

d(off)  

t

f  

Turn-Off Delay Time  
Fal
l
T
ime  
R

G

= 6.0
Ω  
R

D

= 10
Ω
„  
V

GS

= 0V  
C

iss  

C

oss  

C

rss  

Input Capacitance  
––– 190 –––  
––– 120 –––  
––– 61 –––  
Output Capacitance  
V

DS

= -15V  
ƒ = 1.0MHz, See Fig. 5  
Reverse Transfer Capacitance  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
showing the  
D
S
I

S  

––– ––– 1.3  
A
I

S
M  

Pulsed  
Source  
egral reverse  
G
Currentint  
––– –––
 
16  
(Body Diode)
  
p-n junction diode.  
V

SD  

t

rr  

Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
––– 0.82
 
1.2  
V
T

J

= 25°C, I

S

= -1.25A, V

GS

= 0V
ƒ  
T

J

= 25°C, I

F

= -1.25A  
––– 27  
––– 31  
54  
62  
ns  
nC  
Q

rr  

di/dt = -100A/µs
ƒ  
Notes:  

Repetitive rating;
 
pulse width limited by  
ƒ
I

SD

≤
-1.3A, di/dt
≤
-92A/µs, V

DD

≤
V

(BR)DSS  

T

J

≤
150°C  
,
max. junction temperature. ( See fig. 11 )  
‚
Starting T

J

= 25°C, L = 67mH  
R

G

= 25
Ω
, I

AS

= -1.3A.  
„
Pulse width
≤
300µs; duty cycle
≤
2%.  
ꢀ
Surface mounted on FR-4 board,
 
t
≤
10sec.  

IRF9953PbF  
100  
10  
1
100  
10  
1
VGS  
– 15V  
– 10V  
VGS  
– 15V  
– 10V  
TOP  
TOP  
– 7.0V  
– 5.5V  
– 4.5V  
– 4.0V  
– 3.5V  
– 7.0V  
– 5.5V  
– 4.5V  
– 4.0V  
– 3.5V  
BOTTOM – 3.0V  
BOTTOM – 3.0V  
-3.0V  
-3.0V  
20µs PULSE WIDTH  
20µs PULSE WIDTH  
T
J
= 25°C  
T
J
= 150°C  
A
A
0.1  
0.1  
0.1  
1
10  
0.1  
1
10  
-V ,
 
Drain-to-Source Voltage (V)  
DS  
-V ,
 
Drain-to-Source Voltage (V)  
DS  
Fig 2.
 
Typical Output Characteristics  
Fig 1.
 
Typical Output Characteristics  
100  
100  
10  
1
10  
T

J

= 25°C  
T

J

= 150°C  
T =
 
150°C  
J
T =
 
25°C  
J
1
V

DS

= -10V  
20µs PULSE WIDTH  

8.0

A  
V
= 0V  
GS  
0.1  
A
0.1  
3.0  
4.0  
5.0  
6.0  
7.0  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
–
V

GS

, Gate-to-Source Voltage (V)  
-V ,
 
Source-to-Drain Voltage (V)  
SD  
Fig 4.
 
Typical Source-Drain Diode  
Fig 3.
 
Typical Transfer Characteristics  
Forward Voltage  

IRF9953PbF  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
2.0  
-1.0A  
=
I
D
1.5  
1.0  
0.5  
0.0  
V
= -4.5V  
GS  
V
GS  
= -10V  
V
=
–
10V  
GS  
A
-60 -40 -20  
0
20 40 60 80
 
100 120 140 160  
°
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
T ,
 
Junction Temperature (
 
C)  
J
-I ,
 
Drain Current (A)  
D
Fig 5.
 
Normalized On-Resistance  
Fig 6.
 
Typical On-Resistance Vs. Drain  
Vs. Temperature  
Current  
0.80  
150  
I
D
TOP  
-0.58A  
-1.0A  
BOTTOM -1.3A  
120  
90  
60  
30  
0
0.60  
0.40  
0.20  
0.00  
I
= -2.3A  
D
A
25  
50  
75  
100  
125  
150  
0
3
6
9
12  
15  
°
Starting T
 
, Junction Temperature
 
( C)  
J
–
V

GS

, Gate-to-Source Voltage (V)  
Fig 7.
 
Typical On-Resistance Vs. Gate  
Fig 8.
 
Maximum Avalanche Energy  
Voltage  
Vs. Drain Current  

IRF9953PbF  
20  
16  
12  
8
400  
300  
200  
100  
0
V
C
C
C
= 0V,  
f = 1MHz  
I
D
= -2.3A  
GS  
iss  
rss  
oss  
= C
 
+ C  
,
C
SHORTED  
V
=-10V  
gs  
gd  
gd  
ds  
DS  
= C  
= C
 
+ C  
ds  
gd  
C
C
iss  
oss  
C
rss  
4
0
A
0
2
4
6
8
10  
1
10  
100  
Q ,
 
Total Gate Charge (nC)  
G
-V ,
 
Drain-to-Source Voltage (V)  
DS  
Fig 9.
 
Typical Capacitance Vs.  
Fig 10.
 
Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
0.50  
0.20  
0.10  
0.05  
10  
0.02  
0.01  
P
2
DM  
1
t
1
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D =
 
t /
 
t  
1
2. Peak T
 
=
P  
J
x Z  
+ T  
thJA A  
DM  
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t ,
 
Rectangular Pulse Duration (sec)  
1
Fig 11.
 
Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  

IRF9953PbF  
SO-8 Package
 
Outline  
Dimensions are shown in milimeters (inches)  
IN
C
H
ES  
MI
L
LI
M
E
TERS  
DIM  
A
D
B
M
I
N  
.0532  
MAX  
.0688  
.0098  
.020  
M
I
N  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
5
A
E
A1
.
0040  
b
c
D
E
.013  
8
1
7
2
6
3
5
.0075  
.189  
.0098  
.1968  
.1574  
6
H
0.25 [.010]  
A
.1497  
4
e
.050 B
A
S
IC  
1.27 B
A
S
IC  
0.635
B
A
S
I
C  
e1
.
025
 
B
A
S
IC  
H
K
L
.2284  
.0099  
.016  
0°  
.2440  
.0196  
.050  
8°  
5.80  
0.25  
0.40  
0°  
6.20  
0.50  
1.27  
8°  
e
6X  
y
e1  
A
K x 45°  
A
C
y
0.10 [.004]  
8X c  
A1  
B
8X L  
8X b  
0.25 [.010]  
7
C
F
O
OT
P
RINT  
8X 0.72 [.028]  
NOT
E
S :  
1. DI
M
E
N
S
I
O
NING
 
&
T
O
L
ER
A
NC
I
N
G
P
ER
A
S
M
E Y14.5M-1994.  
2.
C
O
N
T
R
O
L
LING
 
DI
M
E
N
S
I
O
N: MI
L
LI
M
E
TER  
3. DI
M
E
NS
 
I
O
NS A
R
E S
 
H
O
WN IN MIL L IME T E RS
 
[
I
N
C
H
ES ].  
4.
O
U
T
 
L INE
 
C
O
N
F OR MS
 
T O
J
EDEC
O
U T
L
INE
 
MS -012
A
A.  
5
6
7
D
I
M
E
N
S
I
O
N DO
E
S
N
OT INC
L
UDE
M
O
L
D PR
O
T
RUSI
O
N
S
.  
MO
L
D PR
O
T
RUSI
O
NS NOT
T
O E
X
C
E
ED
0
.15 [.006].  
6.46 [.255]  
D
I
M
E
N
S
I
O
N DO
E
S
N
OT INC
L
UDE
M
O
L
D PR
O
T
RUSI
O
N
S
.  
MO
L
D PR
O
T
RUSI
O
NS NOT
T
O E
X
C
E
ED
0
.25 [.010].  
D
I
M
E
N
S
I
O
N
I
S THE LEN
G
T
H
O
F
L
E
A
D
F
O
R
S
O
L
D
ERING
T
O  
ASUBSTR
A
T
E.  
3X 1.27 [.050]  
8X 1.78 [.070]  
SO-8 Part Marking Information (Lead-Free)  
E
X
A
M
P
LE: THIS IS
A
N
I
RF
7
101 (MO
S
FET)  
DAT E
 
CODE (YWW)  
P =
 
DE S I
G
N
AT E S
 
L E AD-F
R
E E  
PR
O
D
U
C
T (O
P
TI
O
NA
L
)  
Y =
 
L
A
S
T
D
I
G
I
T
O
F
T
HE
Y
E
A
R  
WW =
 
WE E K  
XXXX  
F
7
101  
IN
T
ER
N
A
T
I
O
NAL  
RE
C
T
I
FIER  
L
O
GO  
A =
 
A
S S E MB
L
Y S IT E
 
C
ODE  
L
O
T CODE  
P
A
R
T NU
M
B
ER  

IRF9953PbF  
SO-8
T
a
pe and Reel  
Dimensions are shown in milimeters (inches)  
TERMINAL NUMBER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
NOTES:  
1. CONTROLLING
 
DIMENSION : MILLIMETER.  
2. ALL
 
DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).  
3. OUTLINE
 
CONFORMS TO EIA-481 & EIA-541.  
330.00  
(12.992)  
MAX.  
14.40 ( .566 )  
12.40 ( .488 )  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the Consumer market.  
Qualifications Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903