Infineon-Technologies-IRFB7734PBF

Part #Infineon-Technologies-IRFB7734PBF
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Infineon-Technologies-IRFB7734PBF
Strong
IR
FET™  
IRFB7734PbF  
IRFS7734PbF  
IRFSL7734PbF  
HEXFET

®

Power MOSFET  
Application  
Brushed motor drive applications  
BLDC motor drive applications  

Battery powered circuits  
Half-bridge and full-bridge topologies  
Synchronous rectifier applications  
Resonant mode power supplies  
OR-ing and redundant power switches  
DC/DC and AC/DC converters  
DC/AC inverters  
V

DSS  

R

DS(on)

typ.  
max  
75V  
2.8m
  
3.5m
  
183A  
I

D  

D
D
S
Benefits  
S
S
D
G
Improved gate,
 
avalanche and dynamic dV/dt ruggedness  
Fully characterized capacitance and avalanche SOA  
Enhanced body diode dV/dt and dI/dt capability  
Lead-free, RoHS compliant  
D
G
G
G
D
S
Gate  
Drain  
Source  
Base part number  
Package Type  
Standard Pack  
Form  
Orderable Part Number  
Quantity  
50  
IRFB7734PbF  
IRFSL7734PbF  
IRFS7734PbF  
TO-220  
TO-262  
D2-Pak  
Tube  
IRFB7734PbF  
IRFSL7734PbF  
IRFS7734PbF  
Tube  
50  
Tube  
50  
Tape and Reel Left  
800  
IRFS7734TRLPbF  
200  
160  
120  
80  
10  
8
I
= 100A  
D
T
= 125°C  
= 25°C  
J
6
4
40  
T
J
0
2
25  
50  
75  
100  
125  
150  
175  
4
6
8
10 12 14 16 18 20  
T
, Case Temperature (°C)  
C
V
Gate -to -Source Voltage
 
(V)  
GS,  
Fig 2.
 
Maximum Drain Current vs. Case Temperature  
Fig 1.
 
Typical On-Resistance vs. Gate Voltage  
1
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
Absolute Maximum Rating  
Symbol  
Parameter  
Max.  
183  
Units  
A
I

D

@ T

C

= 25°C  
Continuous Drain Current, V

GS

@ 10V  
I

D

@ T

C

= 100°C
 
Continuous Drain Current, V

GS

@ 10V  
130  
I

DM  

Pulsed Drain Current
  
Maximum Power Dissipation  
Linear Derating Factor  
650  
290  
2.0  
P

D

@T

C

= 25°C  
W
W/°C  
V
V

GS  

Gate-to-Source Voltage  
± 20  
T

J  

T

STG  

Operating Junction and  
Storage Temperature Range  
-55 to
 
+ 175  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case)  
300  
Mounting Torque, 6-32 or M3 Screw  
10 lbf·in (1.1 N·m)  
Avalanche Characteristics  
Symbol  
E

AS (Thermally limited)  

E

AS (Thermally limited)  

I

AR  

Max.  
350  
670  
Units  
mJ  
Parameter  
Single Pulse Avalanche Energy
  
Single Pulse Avalanche Energy
  
Avalanche Current
  
A
mJ  
See Fig 15, 16, 23a, 23b  
E

AR  

Repetitive Avalanche Energy
  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
0.50  
–––  
–––  
Max.  
0.51  
–––  
62  
Units  
Junction-to-Case
  
R

JC  

R

CS  

R

JA  

R

JA  

Case-to-Sink, Flat Greased Surface (TO-220)  
Junction-to-Ambient (TO-220)
  
°C/W  
Junction-to-Ambient (PCB
 
Mount) (D

2

Pak)
  
40  
Static @ T

J

= 25°C (unless otherwise specified)  
Symbol  
Parameter  
Min. Typ.
 
Max. Units  
Conditions  
V

(BR)DSS  

Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
75  
––– –––  
V
V

GS

= 0V, I

D

= 250µA  
–––  
–––  
–––  
2.1 –––  
––– –––  
––– ––– 150  
––– ––– 100  
––– –––
 
-100  
50  
2.8  
3.5  
––– mV/°C
 
Reference to 25°C, I

D

= 1mA  
V

(BR)DSS

/
T

J  

R

DS(on)  

3.5  
–––  
3.7  
1.0  
V

GS

= 10V, I

D

= 100A
  
m
  
V
V

GS

= 6.0V, I

D

= 50A
  
V

DS

= V

GS

, I

D

= 250µA  
V

GS(th)  

I

DSS  

Gate Threshold Voltage  
V
V
V
V

DS

=75 V, V

GS

= 0V  

DS

=75V,V

GS

= 0V,T

J

=125°C  

GS

= 20V  
Drain-to-Source Leakage Current  
µA  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Gate Resistance  
I

GSS  

R

G  

nA  

GS

= -20V  
–––  
2.0  
–––  
  
Notes:  
Repetitive rating; pulse width limited by max. junction temperature.  
Limited by T

Jmax

, starting T

J

= 25°C, L = 70µH, R

G

= 50
, I

AS

= 100A, V

GS

=10V.  
I

SD

100A, di/dt
950A/µs, V

DD

V

(BR)DSS

, T

J


175°C.  
Pulse width
400µs; duty cycle
2%.  
C

oss

eff. (TR) is a fixed capacitance that gives the same charging time as C

oss

while V

DS

is rising from 0 to 80% V

DSS  

.
C

oss

eff. (ER) is a fixed capacitance that gives the same energy as C

oss

while V

DS

is rising from 0 to 80% V

DSS  

.
R

is measured at T

J

approximately 90°C.  
Limited by T

Jmax

, starting T

J

= 25°C, L = 1mH, R

G

= 50
, I

AS

= 37A, V

GS

=10V.  
When mounted on 1″ square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques  
2
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
Dynamic Electrical
 
Characteristics @ T

J

= 25°C (unless otherwise specified)  
Symbol  
gfs  
Parameter  
Forward Transconductance  
Total Gate Charge  
Min.  
250  
–––  
–––  
–––  
–––  
–––  
–––  
Typ. Max.
 
Units  
Conditions  
V

DS

= 10V, I

D

=100A  
I

D

= 100A  
–––  
180  
45  
–––  
270  
–––  
–––  
–––  
–––  
–––  
S
Q

g  

Q

gs  

Gate-to-Source Charge  
Gate-to-Drain Charge  
Total Gate Charge Sync. (Qg – Qgd)  
Turn-On Delay Time  
V

DS

= 38V  
nC  
Q

gd  

55  
V

GS

= 10V  
Q

sync  

t

d(on)  

t

r  

125  
20  
V

DD

= 38V  
I

D

= 100A  
Rise Time  
123  
ns  
t

d(off)  

t

f  

Turn-Off Delay Time  
Fall Time  
–––  
–––  
124  
100  
–––  
–––  
R

G

= 2.7
  
V

GS

= 10V
  
C

iss  

C

oss  

C

rss  

Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
––– 10150 –––  
V

GS

= 0V  
–––  
–––  
816  
500  
–––  
–––  
V

DS

= 25V  
ƒ = 1.0MHz  
pF  
Effective Output Capacitance  
(Energy Related)  
C

oss eff.(ER)  

C

oss eff.(TR)  

–––  
–––  
707  
916  
–––  
–––  
V

GS

= 0V, VDS = 0V to 60V
  
V

GS

= 0V, VDS = 0V to 60V
  
Output Capacitance (Time Related)  
Diode Characteristics  
Symbol  
Parameter  
Min.  
Typ. Max.
 
Units  
Conditions  
MOSFET symbol  
D
Continuous Source Current  
(Body Diode)  
I

S  

–––  
–––  
183  
showing the  
A
G
Pulsed Source Current  
(Body Diode)
  
integral reverse  
p-n junction diode.  
I

SM  

–––  
–––  
–––  
–––  
650  
1.2  
S
V

SD  

Diode Forward Voltage  
V
T

J

= 25°C,I

S

= 100A,V

GS

= 0V
  
dv/dt  
Peak Diode Recovery dv/dt
  
–––  
–––  
–––  
–––  
–––  
–––  
5.1  
47  
51  
76  
96  
2.8  
––– V/ns
 
T

J

= 175°C,I

S

=100A,V

DS

= 64V
  
–––  
–––  
–––  
–––  
–––  
T

J

= 25°C  
V

DD

= 64V  
I

F

= 100A,  
t

rr  

Reverse Recovery Time  
ns  
T

J

= 125°C  
T

J

= 25°C
 
di/dt = 100A/µs
  
Q

rr  

Reverse Recovery Charge  
Reverse Recovery Current  
nC  
A
T

J

= 125°C  
T

J

= 25°C  
I

RRM  

3
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
1000  
100  
10  
1000  
100  
10  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
TOP  
TOP  
BOTTOM  
BOTTOM  
4.5V  
4.5V  
60µs PULSE WIDTH  
Tj = 25°C  
60µs PULSE WIDTH  
Tj = 175°C  
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 4.
 
Typical Output Characteristics  
Fig 3.
 
Typical Output Characteristics  
1000  
100  
10  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
I
= 100A  
D
V
= 10V  
GS  
T =
 
175°C  
J
T =
 
25°C  
J
1
V
= 25V  
DS  
60µs PULSE WIDTH  
0.1  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
-60 -40 -20  
0 20
 
40 60 80
 
100120140160180  
V
, Gate-to-Source Voltage (V)  
T ,
 
Junction Temperature (°C)  
GS  
J
Fig 6.
 
Normalized On-Resistance vs. Temperature  
Fig 5.
 
Typical Transfer Characteristics  
100000  
10000  
1000  
14.0  
V
= 0V,  
f = 1 MHZ  
GS  
I =
 
100A  
D
C
C
C
= C
 
+ C
 
, C  
SHORTED  
iss  
gs  
gd  
ds  
12.0  
= C  
rss  
oss  
gd  
V
V
V
= 60V  
DS  
= 38V  
DS  
= 15V  
DS  
= C
 
+ C  
ds  
gd  
10.0  
8.0  
6.0  
4.0  
2.0  
0.0  
C
iss  
C
oss  
C
rss  
100  
1
10  
100  
0
50  
100  
150  
200  
250  
V
, Drain-to-Source Voltage (V)  
DS  
Q ,
 
Total Gate Charge (nC)  
G
Fig 8.
 
Typical Gate Charge vs.  
Fig 7.
 
Typical Capacitance vs. Drain-to-Source Voltage  
Gate-to-Source Voltage  
4
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
1000  
100  
10  
100µsec  
1msec  
100  
10  
1
T =
 
175°C  
J
OPERATION  
IN THIS  
AREA  
LIMITED BY  
R
(on)  
DS  
10msec  
T =
 
25°C  
J
DC  
Tc = 25°C  
Tj = 175°C  
Single Pulse  
V
= 0V  
GS  
1.0  
0.1  
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
0.1  
1
10  
V
, Source-to-Drain Voltage (V)  
SD  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 10.
 
Maximum Safe Operating Area  
Fig 9.
 
Typical Source-Drain Diode Forward Voltage  
2.0  
95  
Id = 1.0mA  
1.5  
1.0  
0.5  
0.0  
90  
85  
80  
75  
-10  
0
10 20 30 40 50 60 70 80  
-60 -40 -20  
0
20 40 60 80
 
100120140160180  
, Temperature ( °C )  
T
J
V
Drain-to-Source Voltage (V)  
DS,  
Fig 11.
 
Drain-to-Source Breakdown Voltage  
Fig 12.
 
Typical C

oss

Stored Energy  
3.6  
Vgs = 5.5V  
Vgs = 6.0V  
Vgs = 7.0V  
Vgs = 8.0V  
Vgs = 10V  
3.4  
3.2  
3.0  
2.8  
0
20 40 60 80
 
100 120 140 160 180 200  
, Drain Current (A)  
I
D
Fig 13.
 
Typical On-Resistance vs. Drain Current  
© 2014 International Rectifier
 

5
November 5, 2014  

IRFB/S/SL7734PbF  
1
0.1  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
0.01  
0.001  
0.0001  
SINGLE PULSE  
( THERMAL RESPONSE )  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig 14.
 
Maximum Effective Transient Thermal Impedance, Junction-to-Case  
1000  
100  
10  
Allowed avalanche Current vs avalanche  
pulsewidth, tav, assuming
 
Tj = 150°C and  
Tstart = 25°C (Single Pulse)  
Allowed avalanche Current vs avalanche  
  
pulsewidth, tav, assuming
 
j = 25°C and  
Tstart = 150°C.  
1
1.0E-06  
1.0E-05  
1.0E-04  
tav (sec)  
1.0E-03  
1.0E-02  
Fig 15.
Avalanche Current vs. Pulse Width  
400  
300  
200  
100  
0
TOP  
BOTTOM 1.0%
 
Duty Cycle  
= 100A  
Single Pulse  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1.Avalanche failures assumption:  
I
D
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of T

jmax

. This is validated for every  
part type.  
2. Safe operation in Avalanche is allowed as long asT

jmax

is not  
exceeded.  
3. Equation below based on circuit and waveforms shown in Figures  
23a, 23b.  
4. P

D (ave)

= Average power dissipation per single avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage  
increase during avalanche).  
6. I

av

= Allowable avalanche current.  
7.
T = Allowable rise in junction temperature, not to exceed T

jmax  

(assumed as 25°C in Figure 15, 16).  
t

av

= Average time in avalanche.  
D = Duty cycle in avalanche =
 
tav ·f  
25  
50  
75  
100  
125  
150  
175  
Z

thJC

(D, t

av

) = Transient thermal resistance, see Figures 13)  
Starting T
 
, Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·I

av

) =
T/ Z

thJC  

I

av

= 2
T/ [1.3·BV·Z

th

]  
E

AS (AR)

= P

D (ave)· av  

t
Fig 16.
Maximum Avalanche Energy vs. Temperature  
6
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
20  
15  
10  
5
I =
 
60A  
F
V
= 64V  
R
T =
 
25°C  
J
T =
 
125°C  
J
I
= 150µA  
= 250µA  
= 1.0mA  
= 1.0A  
D
I
D
I
D
I
D
0
-75 -50 -25  
0
25 50 75
 
100 125 150 175  
0
200  
400  
600  
800  
1000  
T ,
 
Temperature ( °C )  
di /dt
 
(A/µs)  
J
F
Fig 17.
 
Threshold Voltage vs. Temperature  
Fig 18.
 
Typical Recovery Current vs. dif/dt  
400  
20  
I =
 
60A  
I =
 
100A  
F
F
V
= 64V  
V
= 64V  
R
R
T =
 
25°C  
J
T =
 
125°C  
J
T =
 
25°C  
J
T =
 
125°C  
J
300  
200  
100  
0
15  
10  
5
0
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
di /dt
 
(A/µs)  
di /dt
 
(A/µs)  
F
F
Fig 19.
 
Typical Recovery Current vs. dif/dt  
Fig 20.
 
Typical Stored Charge vs. dif/dt  
400  
I =
 
100A  
F
V
= 64V  
R
T =
 
25°C  
J
T =
 
125°C  
J
300  
200  
100  
0
0
200  
400  
600  
800  
1000  
di /dt
 
(A/µs)  
F
Fig 21.
 
Typical Stored Charge vs. dif/dt  
© 2014 International Rectifier
 

7
November 5, 2014  

IRFB/S/SL7734PbF  
Fig 22.
Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET

®

Power MOSFETs  
V
(BR)DSS  
t
p
15V  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
–
I
A
20V  
I
0.01  
t
p
AS  
Fig 23a.
 
Unclamped Inductive Test Circuit  
Fig 23b.
 
Unclamped Inductive Waveforms  
Fig 24a.
 
Switching Time Test Circuit  
Fig 24b.
 
Switching Time Waveforms  
Id  
Vds  
Vgs  
VDD  
Vgs(th)  
Qgs1  
Qgs2  
Qgd  
Qgodr  
Fig 25b.
 
Gate Charge Waveform  
Fig 25a.
 
Gate Charge Test Circuit  
8
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
TO-220AB Package Outline
(Dimensions are shown in millimeters (inches))  
TO-220AB Part Marking Information  
E X A M
 
P L E :  
T H
 
I
S IS A
 
N IR
 
F 1 0 1 0  
L O
 
C O D E
 
1 7 8 9  
A S S E M
 
B L E D  
IN T
 
H E
 
A S S E M
 
B L Y
 
L IN E
 
“C ”  
P A R T
 
N U M B E R  
D A T E
 
C O D E  
T
IN T
 
E R N A T IO N A L  
R E C T
I
F IE R  
L O
 
G O  
O
N
W
W
1 9 ,
 
2 0 0 0  
Y E A R  
E E K
 
1 9  
L
I
N E  
0
=
2 0 0 0  
N o t
 
e :
 
“
P “
 
in a
 
s s e m
 
b ly
 
lin e
 
p o s it
 
io n  
in d ic a t
 
e s
 
“L e a d
 
F r
 
e e ”  
A S S E M
 
B L Y  
W
–
L O  
T C
 
O D E  
C
TO-220AB packages are not recommended for Surface Mount Application
.  
Note: For the most current drawing please refer to IR website at

9
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
TO-262 Package Outline
(Dimensions are shown in millimeters (inches)  
TO-262 Part Marking Information  
EXAMPLE: THIS
 
IS AN IRL3103L  
LOT COD
E
1
789  
PART NUMBER  
INTERNATIONAL  
ASSEMBLED ON W
W
1
9, 1997  
RECTIFIER  
IN
T
HE ASSEMBLY LINE “C”  
LOGO  
DATE CODE  
YEA
R
7 =
 
1
997  
WEEK 19  
ASSEMBLY  
LOT CODE  
LINE C  
OR  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
DATE CODE  
P =
 
D
ESIGNATES LEAD-FREE  
PRODUCT (OPTIONAL)  
YEAR 7 =
 
1997  
ASSEMBLY  
LOT CODE  
WEEK 19  
A =
 
A
SSEMBLY SITE CODE  
Note: For the most current drawing please refer to IR website at

10  
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
D

2

Pak (TO-263AB) Package Outline
(Dimensions are shown in millimeters (inches))  
D

2

Pak (TO-263AB) Part Marking Information  
THIS IS AN IRF530S WITH  
LOT CODE 8024  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
ASSEMBLED ON WW 02, 2000  
IN THE ASSEMBLY LINE “L”  
F530S  
DATE CODE  
YEAR 0 =
 
2000  
WEEK 02  
ASSEMBLY  
LOT CODE  
LINE L  
OR  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
F530S  
DATE CODE  
P =
 
DESIGNATES LEAD – FREE  
PRODUCT (OPTIONAL)  
ASSEMBLY  
LOT CODE  
YEAR 0 =
 
2000  
WEEK 02  
A =
 
ASSEMBLY SITE CODE  
Note: For the most current drawing please refer to IR website at

11  
© 2014 International Rectifier  
November 5, 2014  

IRFB/S/SL7734PbF  
D

2

Pak (TO-263AB) Tape & Reel Information
(Dimensions are shown in millimeters (inches))  
TRR  
1.60 (.063)  
1.50 (.059)  
1.60 (.063)  
1.50 (.059)  
4.10 (.161)  
3.90 (.153)  
0.368 (.0145)  
0.342 (.0135)  
FEED DIRECTION  
TRL  
11.60 (.457)  
11.40 (.449)  
1.85 (.073)  
1.65 (.065)  
24.30 (.957)  
23.90 (.941)  
15.42 (.609)  
15.22 (.601)  
1.75 (.069)  
1.25 (.049)  
10.90 (.429)  
10.70 (.421)  
4.72 (.136)  
4.52 (.178)  
16.10 (.634)  
15.90 (.626)  
FEED DIRECTION  
13.50 (.532)  
12.80 (.504)  
27.40 (1.079)  
23.90 (.941)  
4
330.00  
(14.173)  
MAX.  
60.00 (2.362)  
MIN.  
30.40 (1.197)  
MAX.  
NOTES :  
1. COMFORMS
 
TO EIA-418.  
2. CONTROLLING
 
DIMENSION: MILLIMETER.  
3. DIMENSION
 
MEASURED @ HUB.  
4. INCLUDES
 
FLANGE DISTORTION @ OUTER EDGE.  
26.40 (1.039)  
24.40 (.961)  
4
3
Note: For the most current drawing please refer to IR website at

Qualification Information

†  

Industrial  
(per JEDEC JESD47F)

††  

Qualification Level  
TO-220  
D

2

Pak  
N/A  
MSL1  
N/A  
Moisture Sensitivity Level  
RoHS Compliant  
TO-262  
Yes  
†
Qualification standards can be found at International Rectifier’s web site:
 

†† Applicable
 
version of JEDEC standard at the time of product release.  
Revision History  
Date  
Comments  

Updated E

AS (L =1mH)
 

= 670mJ
 
on page 2  

Updated note 8
 
“Limited by T

Jmax

, starting T

J

= 25°C, L = 1mH, R

G

= 50
, I

AS

= 37A, V

GS

=10V”. on
 
page 2  

Updated package outline on page 9,10,11.  
11/5/2014  
IR WORLD HEADQUARTERS:
101 N. Sepulveda Blvd., El Segundo, California 90245, USA  
To contact International Rectifier, please visit

12  
© 2014 International Rectifier  
November 5, 2014