Infineon-Technologies-IRFH8307TRPBF
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Strong
IR
FET™
IRFH8307TRPbF
V
DSS
30
V
R
DS(on)
max
(@ V
GS
= 10V)
1.3
m
Qg
(typical)
Rg
(typical)
50
nC
1.3
I
D
100
A
(@T
C (Bottom)
= 25°C)
PQFN 5X6 mm
Applications
OR-ing MOSFET for 12V (typical) Bus in-Rush Current
Battery Operated DC Motor Inverters
Features
Benefits
Low R
DSon
(<1.3m
)
Low Thermal Resistance to PCB (<0.8°C/W)
Low Profile (<0.9 mm)
Lower Conduction Losses
Enable better thermal dissipation
Increased Power Density
Multi-Vendor Compatibility
Easier Manufacturing
results in
Industry-Standard Pinout
Compatible with Existing Surface Mount Techniques
RoHS Compliant, Halogen-Free
MSL1, Industrial Qualification
Environmentally Friendlier
Increased Reliability
Base part number
Package Type
Standard Pack
Orderable Part Number
Form
Tape and Reel
Quantity
4000
IRFH8307PbF
PQFN 5mm x 6 mm
IRFH8307TRPbF
Absolute Maximum Ratings
Parameter
Gate-to-Source Voltage
Max.
± 20
42
Units
V
GS
V
I
D
@ T
A
= 25°C
I
D
@ T
A
= 70°C
I
D
@ T
C (Bottom)
= 25°C
I
D
@ T
C (Bottom)
= 100°C
I
DM
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
33
100
100
400
A
P
D
@T
A
= 25°C
P
D
@T
C (Bottom)
= 25°C
Power Dissipation
3.6
W
Power Dissipation
156
Linear Derating Factor
0.029
W/°C
T
J
Operating Junction and
-55 to
+ 150
°C
T
STG
Storage Temperature Range
Notes
through
are on page 9
1
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IRFH8307TRPbF
Static @ T
J
= 25°C (unless otherwise specified)
Parameter
Min.
30
Typ.
–––
0.02
1.1
Max. Units
Conditions
V
GS
= 0V, I
D
= 250µA
BV
DSS
BV
DSS
/
T
J
R
DS(on)
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
–––
–––
1.3
V
–––
–––
–––
1.35
–––
–––
V/°C Reference
to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 50A
m
1.7
2.1
V
GS
= 4.5V, I
D
= 50A
V
DS
= V
GS
, I
D
= 150µA
V
GS(th)
V
GS(th)
I
DSS
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
1.80
-6.2
–––
2.35
V
––– mV/°C
5.0
µA
V
DS
= 24V, V
GS
= 0V
V
DS
= 24V, V
GS
= 0V, T
J
=125°C
V
GS
= 20V
–––
–––
–––
190
–––
–––
–––
–––
–––
120
150
I
GSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
100
-100
nA
V
GS
= -20V
V
DS
= 15V, I
D
= 50A
nC V
GS
= 10V, V
DS
= 15V, I
D
= 50A
gfs
Q
g
–––
–––
S
Q
g
Total Gate Charge
–––
50
75
V
V
DS
= 15V
GS
= 4.5V
Q
gs1
Q
gs2
Q
gd
Q
godr
Q
sw
Q
oss
R
G
t
d(on)
Pre-Vth Gate-to-Source Charge
Post-Vth Gate-to-Source Charge
Gate-to-Drain Charge
Gate Charge Overdrive
Switch Charge (Q
gs2
+ Q
gd
)
Output Charge
–––
–––
–––
–––
–––
–––
–––
–––
12
6.5
16
16
23
30
1.3
26
–––
–––
–––
–––
–––
–––
2.6
nC
I
D
= 50A
See Fig. 18
nC V
DS
= 16V, V
GS
= 0V
Gate Resistance
Turn-On Delay Time
–––
V
DD
= 15V, V
GS
= 4.5V
ns I
D
= 50A
R
G
=1.8
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
–––
–––
–––
30
31
13
7200
1360
590
–––
–––
–––
–––
–––
–––
See Fig.17
V
GS
= 0V
pF
V
DS
= 15V
ƒ = 1.0MHz
Avalanche Characteristics
Parameter
Typ.
Max.
Units
mJ
A
E
AS
I
AR
Single Pulse Avalanche Energy
Avalanche Current
–––
–––
420
50
Diode Characteristics
Parameter
Min.
Typ.
Max. Units
Conditions
MOSFET symbol
D
I
S
Continuous Source Current
(Body Diode)
–––
–––
100
A
400
showing the
G
integral reverse
p-n junction diode.
I
SM
Pulsed Source Current
(Body Diode)
–––
–––
S
V
SD
t
rr
Q
rr
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
–––
–––
–––
–––
34
68
1.0
51
100
V
T
J
= 25°C, I
S
= 50A, V
GS
= 0V
ns T
J
= 25°C, I
F
= 50A, V
DD
= 15V
nC
di/dt = 200A/µs
Thermal Resistance
Parameter
Typ.
0.5
Max.
0.8
15
Units
Junction-to-Case
R
JC
(Bottom)
R
JC
(Top)
R
JA
°C/W
Junction-to-Case
–––
–––
–––
Junction-to-Ambient
Junction-to-Ambient
35
33
R
JA
(<10s)
2
2020-02-27
IRFH8307TRPbF
1000
100
10
1000
100
10
VGS
10V
VGS
10V
TOP
TOP
5.0V
4.5V
3.5V
3.3V
3.0V
2.9V
2.7V
5.0V
4.5V
3.5V
3.3V
3.0V
2.9V
2.7V
BOTTOM
BOTTOM
2.7V
1
2.7V
1
60µs PULSE WIDTH
Tj = 150°C
60µs PULSE WIDTH
Tj = 25°C
1
0.1
10
100
0.1
10
100
V
, Drain-to-Source Voltage (V)
DS
Fig 2.
Typical Output Characteristics
V
, Drain-to-Source Voltage (V)
DS
Fig 1.
Typical Output Characteristics
2.0
1.5
1.0
0.5
1000
100
10
I
= 50A
D
V
= 10V
GS
T =
150°C
J
T =
25°C
J
1
0.1
0.01
V
= 15V
DS
60µs PULSE WIDTH
1.0
2.0
3.0
4.0
5.0
-60 -40 -20
0
20 40 60 80
100 120 140 160
V
, Gate-to-Source Voltage (V)
GS
T ,
Junction Temperature (°C)
J
Fig 4.
Normalized On-Resistance vs. Temperature
Fig 3.
Typical Transfer Characteristics
100000
10000
1000
14
V
C
= 0V,
f = 1 MHZ
GS
I =
50A
D
= C
+ C
, C
SHORTED
iss
gs
gd ds
V
V
= 24V
= 15V
DS
DS
12
10
8
C
= C
rss
gd
C
= C
+ C
ds
oss
gd
Ciss
6
Coss
Crss
4
2
0
100
0
40
80
120
160
1
10
100
Q
Total Gate Charge (nC)
V
, Drain-to-Source Voltage (V)
G
DS
Fig 6.
Typical Gate Charge vs. Gate-to-Source Voltage
Fig 5.
Typical Capacitance vs. Drain-to-Source Voltage
3
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IRFH8307TRPbF
1000
100
10
1000
100
10
OPERATION IN THIS AREA LIMITED BY R
(on)
DS
1msec
100µsec
T =
150°C
J
T =
25°C
10msec
J
1
1
Tc = 25°C
Tj = 150°C
Single Pulse
V
= 0V
1.4
GS
0.1
0.1
0.2
0.4
V
0.6
0.8
1.0
1.2
1.6
0.1
1
10
100
, Source-to-Drain Voltage (V)
V
, Drain-to-Source Voltage (V)
SD
DS
Fig 8.
Maximum Safe Operating Area
Fig 7.
Typical Source-Drain Diode Forward Voltage
300
250
200
150
100
50
3.0
LIMITED BY PACKAGE
I
I
I
I
= 1.0A
D
D
D
D
= 1.0mA
= 500µA
= 150µA
2.5
2.0
1.5
1.0
0.5
0
-75 -50 -25
0
25 50 75
100 125 150 175
, Temperature ( °C )
25
50
75
100
125
150
175
T
J
T ,
Case Temperature (°C)
C
Fig 10.
Threshold Voltage Vs. Temperature
Fig 9.
Maximum Drain Current vs. Case Temperature
1
D = 0.50
0.1
0.01
0.20
0.10
0.05
0.02
0.01
Notes:
SINGLE PULSE
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
( THERMAL RESPONSE )
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t
, Rectangular Pulse Duration (sec)
1
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRFH8307TRPbF
6
5
4
3
2
1
0
2000
1600
1200
800
400
0
I
= 50A
I
D
D
TOP
15A
21A
50A
BOTTOM
T =
125°C
J
T =
25°C
J
2
4
6
8
10 12 14 16 18 20
25
50
75
100
125
150
Starting T
, Junction Temperature (°C)
V
, Gate-to-Source Voltage (V)
J
GS
Fig 13.
Maximum Avalanche Energy vs. Drain Current
Fig 12.
On– Resistance vs. Gate Voltage
1000
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming
Tj = 125°C and
Tstart =25°C (Single Pulse)
100
Allowed avalanche Current vs avalanche
pulsewidth, tav, assuming
j = 25°C and
Tstart = 125°C.
10
1
1.0E-06
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
tav (sec)
Fig 14.
Typical Avalanche
Current vs. Pulse width
5
2020-02-27
IRFH8307TRPbF
Fig 15.
Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET
®
Power MOSFETs
V
(BR)DSS
t
p
15V
DRIVER
+
L
V
DS
D.U.T
AS
R
G
V
DD
–
I
A
20V
I
0.01
t
p
AS
Fig 16a.
Unclamped Inductive Test Circuit
Fig 16b.
Unclamped Inductive Waveforms
Fig 17a.
Switching Time Test Circuit
Fig 17b.
Switching Time Waveforms
Id
Vds
Vgs
Vgs(th)
Qgs1
Qgs2
Qgd
Qgodr
Fig 18b.
Gate Charge Waveform
Fig 18a.
Gate Charge Test Circuit
6
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IRFH8307TRPbF
PQFN 5×6 Outline “B” Package Details
PQFN 5×6 Outline “G” Package Details
For more information on board mounting, including footprint and stencil recommendation, please refer to application note
For more information on package inspection techniques, please refer to application note AN-1154:
7
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IRFH8307TRPbF
PQFN 5×6 Part Marking
INTERNATIONAL
RECTIFIER LOGO
DATE CODE
PART NUMBER
XXXX
XYWWX
XXXXX
(“4 or 5 digits”)
ASSEMBLY
SITE CODE
(Per SCOP 200-002)
MARKING CODE
(Per Marking Spec)
PIN 1
IDENTIFIER
LOT CODE
(Eng Mode – Min last 4 digits of EATI#)
(Prod Mode – 4 digits of SPN code)
PQFN 5×6 Tape and Reel
REEL DIMENSIONS
TAPE DIMENSIONS
CODE
Ao
DESCRIPTION
Dimension design to accommodate the component width
Dimension design to accommodate the component lenght
Dimension design to accommodate the component thickness
Overall width of the carrier tape
Bo
Ko
W
P
1
Pitch between successive cavity centers
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Note: All
dimension are nominal
Package
Type
Reel
Diameter
(Inch)
QTY
Reel
Width
W1
Ao
Bo
Ko
P1
W
Pin 1
(mm)
(mm)
(mm)
(mm)
(mm)
Quadrant
(mm)
5 X 6 PQFN
13
4000
12.4
6.300
5.300
1.20
8.00
12
Q1
8
2020-02-27
IRFH8307TRPbF
Qualification Information
†
Qualification Level
Industrial
†
(per JEDEC JESD47F
††
guidelines)
MSL1
PQFN 5mm x 6mm
Moisture Sensitivity Level
RoHS Compliant
(per JEDEC J-STD-020D
††)
Yes
†
Qualification standards can be found at International Rectifier’s web site:
http://www.irf.com/product-info/reliability/
†† Applicable
version of JEDEC standard at the time of product release.
Notes:
Repetitive rating;
pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 0.337mH, R
G
= 50
, I
AS
= 50A.
Pulse width
400µs; duty cycle
2%.
R
is measured at T
J
of approximately 90°C.
When mounted on 1 inch square
PCB (FR-4). Please refer to AN-994 for more details:
Calculated continuous current based on maximum allowable junction temperature. Package is limited to 100A by
production test capability.
Revision History
Date
Comments
Updated package outline, on page 7.
03/28/2013
08/01/2013
Added “Strong
IR
FET™” above part number on page1
Updated package outline
for “option B” and
added package outline for
“option G” on page 7.
Updated tape and reel on page 8.
Updated package outline for “option G” on page 7.
Updated “IFX logo” on page 1 and page 9.
Changed datasheet with Infineon logo – all pages
Added disclaimer on last page
04/28/2015
05/19/2015
02/27/2020
Removed “HEXFET ™ POWER MOSFT” -page1
9
2020-02-27
IRFH8307TRPbF
Trademarks of Infineon Technologies AG
µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™,
CoolSiC™, DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™,
GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™,
OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID
FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™
Trademarks updated November 2015
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
IMPORTANT NOTICE
Edition 2016-04-19
Published by
Infineon Technologies AG
81726 Munich, Germany
For further information on the product, technology,
delivery terms and conditions and prices please
contact your nearest Infineon Technologies o
ff
ice
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Bescha
ff
enheitsgarantie”) .
With respect to any examples, hints or any typical
values stated herein and/or any information
regarding the application of the product, Infineon
Technologies hereby disclaims any and all
warranties and liabilities of any kind, including
without limitation warranties of non-infringement
of intellectual property rights of any third party.
Please note that this product is not qualified
according to the AEC Q100 or AEC Q101 documents
of the Automotive Electronics Council.
© 2016 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about this
document?
WARNINGS
Due to technical requirements products may
In addition, any information given in this
contain dangerous substances. For information on
document
is subject to customer’s compliance
the types in question please contact your nearest
with its
obligations stated in this document and
Infineon Technologies o
ff
ice.
any applicable legal requirements, norms and
standards concerning customer’s products and
Except as otherwise explicitly approved by Infineon
any use of the product of Infineon Technologies in
Technologies in a written document signed by
customer’s applications.
Document reference
ifx1
authorized
representatives
of
Infineon
Technologies,
Infineon Technologies’ products
may
not be used in any applications where a
failure of the product or any consequences of the
use thereof can reasonably be expected to result in
personal injury.
The data contained in this document is exclusively
intended for technically trained sta
ff
. It is the
responsibility
of
customer’s
technical
departments
to evaluate the suitability of the
product for the intended application and the
completeness of the product information given in
this document with respect to such application.
10
2020-02-27
