Infineon-Technologies-IRG4BC40U
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PD – 91456E
IRG4BC40U
UltraFast Speed IGBT
INSULATED GATE BIPOLAR TRANSISTOR
C
Features
• UltraFast: optimized for high operating
frequencies 8-40 kHz in hard switching, >200
kHz in resonant mode
V
CES
=
6
00V
• Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
Generation 3
V
CE(on) typ.
=
1.72V
G
@V
GE
= 15V, I
C
= 20A
E
• Industry standard TO-220AB package
n-channel
Benefits
• Generation 4 IGBTs offer highest efficiency available
• IGBTs optimized for specified application conditions
• Designed to be a “drop-in” replacement for equivalent
industry-standard Generation 3 IR IGBTs
TO-220AB
Absolute Maximum Ratings
Parameter
Max.
Units
V
CES
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current
Gate-to-Emitter Voltage
600
V
I
C
@ T
C
= 25
°
C
40
I
C
@ T
C
= 100
°
C
20
A
I
CM
160
I
LM
160
V
GE
20
V
E
ARV
Reverse Voltage Avalanche Energy
Maximum Power Dissipation
15
160
mJ
P
D
@ T
C
= 25
°
C
W
P
D
@ T
C
= 100
°
C Maximum
Power Dissipation
65
T
J
Operating Junction and
-55 to
+150
T
STG
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting torque, 6-32 or M3 screw.
°
C
300 (0.063 in. (1.6mm) from case)
10 lbf
•
in (1.1N
•
m)
Thermal Resistance
Parameter
Junction-to-Case
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount
Weight
Min.
——
——
——
——
Typ.
——
0.50
Max.
0.77
——
80
Units
°
C/W
R
θ
JC
R
θ
CS
R
θ
JA
Wt
——
2 (0.07)
——
g (oz)
1
4/17/2000
IRG4BC40U
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter
Collector-to-Emitter Breakdown Voltage
600 —- —-
Emitter-to-Collector Breakdown Voltage
18 —-
—-
Min. Typ. Max. Units
Conditions
V
GE
= 0V, I
C
= 250µA
V
GE
= 0V, I
C
= 1.0A
V
(BR)CES
V
(BR)ECS
V
V
See Fig. 2, 5
V
GE
= 15V
∆
V
(BR)CES
/
∆
T
J
Temperature Coeff. of Breakdown Voltage
–
— 0.63 —- V/
°
C V
GE
= 0V, I
C
= 1.0mA
V
CE(on)
Collector-to-Emitter Saturation Voltage
—- 1.72 2.1
—- 2.15 —-
—- 1.7 —-
3.0 —- 6.0
I
C
= 20A
V
I
C
= 40A
I
C
= 20A, T
J
= 150
°
C
V
CE
= V
GE
, I
C
= 250µA
V
GE(th)
Gate Threshold Voltage
∆
V
GE(th)
/
∆
T
J
Temperature Coeff. of Threshold Voltage
—- -13 —-
mV/
°
C V
CE
= V
GE
, I
C
= 250µA
g
fe
Forward Transconductance
ꢀ
Zero Gate Voltage Collector Current
Gate-to-Emitter Leakage Current
11
18
—-
S
V
CE
= 100V, I
C
= 20A
—- —- 250
—- —- 2.0
—- —-
2500
V
GE
= 0V, V
CE
= 600V
I
CES
µA
V
GE
= 0V, V
CE
= 10V, T
J
= 25
°
C
V
GE
= 0V, V
CE
= 600V, T
J
= 150
°
C
I
GES
—- —-
100
n
A
V
GE
= 20V
Switching Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter
Total Gate Charge (turn-on)
Gate – Emitter Charge (turn-on)
Gate – Collector Charge (turn-on)
Turn-On Delay Time
Ris
e
T
ime
Min. Typ. Max. Units
—- 100 150
Conditions
Q
g
Q
ge
Q
gc
t
d(on)
t
r
I
C
= 20A
—-
—-
—-
—-
16
40
34
19
25
60
nC
ns
V
CC
= 400V
V
GE
= 15V
T
J
= 25
°
C
See Fig. 8
—-
—-
I
C
= 20A, V
CC
= 480V
t
d(off)
t
f
Turn-Off Delay Time
Fal
l
T
ime
—- 110 175
—- 120 180
—- 0.32 —-
—- 0.35 —-
—- 0.67 1.0
V
GE
= 15V, R
G
= 10
Ω
Energy losses include “tail”
E
o
n
E
off
E
ts
t
d(on)
t
r
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Ris
e
T
ime
mJ
ns
See Fig. 10, 11, 13, 14
—-
—-
30
19
—-
—-
T
J
= 150
°
C,
I
C
= 20A, V
CC
= 480V
V
GE
= 15V, R
G
= 10
Ω
Energy losses include “tail”
See Fig. 13, 14
t
d(off)
t
f
Turn-Off Delay Time
Fal
l
T
ime
—- 220 —-
—- 160 —-
—- 1.4 —-
—- 7.5 —-
—- 2100 —-
—- 140 —-
E
ts
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
mJ
nH
L
E
Measured 5mm from package
V
GE
= 0V
C
ies
C
oes
C
res
Output Capacitance
Reverse Transfer Capacitance
pF
V
CC
= 30V
See Fig. 7
—-
34
—-
ƒ
= 1.0MHz
Notes:
Repetitive rating; V
GE
= 20V, pulse width limited by
Pulse width
≤
80µs; duty factor
≤
0.1%.
max. junction temperature. ( See fig. 13b )
ꢀ
Pulse width 5.0µs, single shot.
V
CC
= 80%(V
CES
), V
GE
= 20V, L = 10µH, R
G
= 10
Ω
,
(see fig. 13a)
Repetitive rating; pulse width limited by maximum
junction temperature.
2
IRG4BC40U
60
50
40
30
20
10
0
F
o
r
both :
Trian gu
l
a
r
w a ve :
D
u
ty
cyc
l
e
: 50%
I
T
T
=
1
25
°
C
J
=
90
°
C
sink
G
a
te
drive as spec
i
fied
C lam p
voltage:
80 %
o f
ra ted
Po w er
D issip ation
=
2
8
W
Sq u a
r
e
wave:
60 %
of rated
voltag e
I
Ideal d
i
o
des
A
100
0.1
1
10
f, Frequency (kHz)
Fig. 1
– Typical Load Current vs. Frequency
(For square wave, I=I
RMS
of fundamental; for triangular wave, I=I
PK
)
1000
1000
100
10
100
T
J
= 25
°
C
T
J
= 1
5
0
°
C
T
J
= 150
°
C
T
J
= 2
5
°
C
10
V
C C
= 1
0 V
5µ s
P U L S E
W
I
D
T
H
V
G E
= 15V
20µs PULSE WIDTH
A
12
1
A
1
4
6
8
10
0.1
1
10
V
, G
a
te-to-Em itter
Vo ltag e
G E
V
, Collector-to-Emitter Voltage (V)
CE
Fig. 2
– Typical Output Characteristics
T
C
= 25
°
C
Fig. 3
– Typical Transfer Characteristics
3
IRG4BC40U
2.5
2.0
1.5
1.0
40
30
20
10
0
V
G E
= 15V
80µs PULSE WIDTH
V
G E
= 15V
I
C
= 40A
I
C
= 20A
= 10A
I
C
A
A
25
50
75
100
125
150
-60
-40
-20
0
20
40
60
80
100 120 140 160
T
, Case Temperature (
°
C)
T
, Junction Temperature (
°
C)
C
J
Fig. 4
– Maximum Collector Current vs.
Case
Fig. 5
– Collector-to-Emitter
Voltage vs.
Temperature
Junctio
n
T
emperature
1
D =
0
.
5
0
0.20
0.1
0.10
P
DM
0
.
05
t
1
SINGLE PULSE
t
2
(THERMAL RESPONSE)
0.02
0.01
N
o
tes:
1 .
D
u
ty
factor D
=
t
/ t
2
1
2. Pea
k T
= P
x Z
+ T
C
DM
J
thJC
1
0.01
0.00001
0.0001
0.001
0.01
0.1
10
t
1
,
R
ectangular Pulse Duration (sec)
Fig.
6
–
M
aximu
m
E
ffectiv
e
T
ransien
t
T
herma
l
I
mpedance
,
J
unction-to-Case
4
IRG4BC40U
20
16
12
8
4000
3000
2000
1000
0
V
C E
= 4
0
0
V
I
C
=
2
0
A
V
C
C
C
=
0
V,
f =
1
M
Hz
G E
ies
r
e
s
oes
= C
= C
= C
+ C
+ C
,
C
S
H
O RTED
ge
gc
ce
gc
ce
gc
C
ies
C
C
oes
res
4
A
0
A
0
20
40
60
80
100
120
1
10
100
Q
,
T
o
tal G
ate C
harge (n
C )
g
V
,
C
ollector-to-Emitter Voltage (V)
CE
Fig. 7 –
Typical Capacitance vs.
Fig. 8
– Typical Gate Charge vs.
Collector-to-Emitte
r
V
oltage
Gate-to-Emitte
r
V
oltage
1.1
1.0
0.9
0.8
0.7
0.6
10
V
C C
= 480V
V
G E
= 15V
R
G
= 10
Ω
V
G E
= 15V
V
C C
= 480V
T
J
= 25
°
C
I
C
= 20A
I
C
= 40A
I
C
= 20A
I
C
= 10A
1
A
A
0.1
0
10
20
30
40
50
60
-60
-40
-20
0
20
40
60
80
100 120 140 160
R
, Gate Resistance (
)
Ω
T
, Junction Temperature (
°
C)
G
J
Fig. 10
– Typical Switching Losses vs.
Fig. 9
– Typical Switching Losses vs. Gate
Junctio
n
T
emperature
Resistance
5
IRG4BC40U
4.0
1000
100
10
R
G
= 10
Ω
V
T
=
2
0V
=
1
25
°
C
G
E
T
J
= 150
°
C
V
C C
= 480V
V
G E
= 15V
J
3.0
2.0
1.0
0.0
S
A
FE
O PERATING
A REA
A
1
1
10
100
1000
0
10
20
30
40
50
V
,
C
ollector-to-Emitter Voltage (V)
I
, Collector-to-Emitter Current (A)
C E
C
Fig. 11 –
Typical Switching Losses vs.
Fig. 12
– Turn-Off SOA
Collector-to-Emitter Current
6
IRG4BC40U
L
D.U.T.
480V
4
X
I
C
@
25
°
C
R
L
=
V
*
C
50V
0 – 480V
1000V
480µF
960V
*
D
r
i
ver same type as D.U.T.; Vc = 80% of Vce(max)
*
N
ote: Due to the 50V pow
er supply, pulse width and inductor
w ill
increase to obtain rated Id.
Fig. 13b
–
Pulsed Collector
Fig. 13a
–
Clamped Inductive
Load Test Circuit
Current Test Circuit
I
C
L
Fig. 14a
–
Switching Loss
D.U.T.
D river*
V
C
Test Circuit
50V
1000V
* Driver same type
as D.U.T., VC = 480V
90%
10%
V
C
90%
Fig. 14b
–
Switching Loss
t
d(o ff)
Waveforms
10%
5%
I
C
t
f
t
r
t
d (o n)
t=5µs
E
E
o ff
o n
E
=
(
E
+E
)
off
ts
o n
7
IRG4BC40U
Case Outline and Dimensions TO-220AB
10.54 (.415)
3.78 (.149)
N O
T
E S :
– B –
2.87 (.113)
2.62 (.103)
10.29 (.405)
1
D IM E N S IO N S
& T
O LE R A N C IN G
4.69 (.185)
4.20 (.165)
3.54 (.139)
P E R
A N S I
Y
1
4.5M ,
1982.
C O N
T
R O LL
I
N G
D IM E N S IO N
: IN
C H .
D IM E N S IO N S
A R E
S H O W N
M ILLIM E TE R S
(IN C H ES ).
C O N
F
O R M S
TO JE
D E C
O U TLIN E
T O -220AB .
1.32 (.052)
1.22 (.048)
– A –
2
3
6.47 (.255)
6.10 (.240)
4
4
15.24 (.600)
14.84 (.584)
1.15 (.045)
M
I
N
LE A D
A S S IG N M E N T S
1
2
3
1
2
3
4
– G
A
T
E
– C
O
L
LE C TO R
–
E
M
IT TE R
– C
O
L
LE C TO R
3.96 (.160)
3.55 (.140)
3 X
14.09 (.555)
13.47 (.530)
4.06 (.160)
3.55 (.140)
0.93 (.037)
0.69 (.027)
0.55 (.022)
0.46 (.018)
3 X
3 X
1.40 (.055)
1.15 (.045)
3 X
0.36 (.014)
M B A M
2.92 (.115)
2.64 (.104)
2.54 (.100)
2X
CONFORMS TO JEDEC OUTLINE TO-220AB
D
i
m e ns io ns
in M
illim e ters
a nd
(In c he s)
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR EUROPEAN REGIONAL CENTRE:
439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR CANADA:
15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
IR GERMANY:
Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590
IR ITALY:
Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN:
K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR SOUTHEAST ASIA:
1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65
(0)838 4630
IR TAIWAN:
16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673
Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 4/00
8
Note: For
the most current drawings please refer to the IR website at:
