Jiangsu-Changjing-Electronics-Technology-Co—Ltd–CJAB20N03

Part #Jiangsu-Changjing-Electronics-Technology-Co—Ltd–CJAB20N03
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Jiangsu-Changjing-Electronics-Technology-Co—Ltd–CJAB20N03
NGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD  
N
WB
3.3×3.3-8L Plastic-Encapsulate MOSFETS  
CJAB20N03
N-Channel Power MOSFET  
I

D  

V

(BR)DSS  

R

DS(on)

TYP  
PDFN
WB
3.
3×
3.
3-8L  
@
10
V  
8.5
m
Ω  
3
0
V  
2
0
A  
@
12
m
Ω
4
.5
V  
DESCRIPTION  
The CJAB20N03 uses advanced trench technology and design  
to provide excellent R

DS(ON)

with low gate charge. It can be used in a  
wide variety of applications  
FEATURES  
Battery switch  
Good stability and uniformity with high E

AS  

Excellent package for good heat dissipation  
Special process technology for high ESD  
capabilit
y  
Load switch  
High density cell design for ultra low R

DS(ON)  

Fully characterized avalanche voltage and  
current  
APPLICATIONS  
SMPS and general purpose applications  
Hard switched and high frequency circuits  
Uninterruptible Power Supply  
MARKING  
EQUIVALENT CIRCUIT  
D
D
D
D
8
7
6
5
AB20N03 = Part No.  
Solid dot=Pin1 indicator  
XX=Date Code  
AB  
20N03  
XX  
2
3
1
4
S
S
G
S
MAXIMUM RATINGS ( T

a

=25
℃
unless otherwise noted )  
Parameter  
Drain-Source Voltage  
Symbol  
V

DS  

Limit  
30  
Unit  
V
Gate-Source Voltage  
V

GS  

±20  
20  
V
Continuous Drain Current  
Pulsed Drain Current  
I

D  

A
I

DM  

100  
70  
A
(1)  
Single Pulsed Avalanche Energy  
Power Dissipation  
E

AS  

mJ  
W
P

D  

R

θJA  

T

J  

1.5  
Thermal Resistance from Junction to Ambient  
Junction Temperature  
83.3  
150  
℃
/W  
℃
Storage Temperature Range  
T

stg  

T

L  

-55 ~+150  
260  
℃
℃
Lead Temperature for Soldering Purposes(1/8’’ from case for 10s)  
(1).E  
condition: V
 
=15V,L=0.14mH, R
 
=25Ω, Starting T
 
= 25°C  
DD  
AS  
G
J
(2).Mounted on a glass epoxy board of 25.4 mm x 25.4 mm x 0.8 mmt  
1
Rev
.
– 1.0  

MOSFET ELECTRICAL
 
CHARACTERISTICS  
T =25  
a
unless otherwise specified  
℃
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Off characteristics  
Drain-source breakdown voltage  
Zero gate voltage drain current  
Gate-body leakage current  
On characteristics (note1)  
Gate-threshold voltage  
V
(BR) DSS  
I

DSS  

V
GS
= 0V, I
D
=250µA  
V
DS
=30V, V
GS
=0V  
V
DS
=0V, V
GS
=±20V  
30  
V
1
µA  
nA  
±100  
I

GSS  

V
GS(th)  
R
DS(on)  
g

FS  

V
DS
=V

GS

, I
D
=250µA  
V
GS
=10V, I
D
=10A  
V
GS
=4.5V, I
D
=10A  
V
DS
=5V, I
D
=20A  
1.0  
15  
1.
7  
8.5  
12  
3.0  
12  
18  
V
mΩ  
mΩ  
S
Static drain-source on-sate resistance  
Forward transconductance  
Dynamic characteristics (note 2)  
Input capacitance  
C

iss  

C

oss  

C

rss  

823  
138  
100  
V
DS
=15V,V
GS
=0V,  
f =1MHz  
pF  
Output capacitance  
Reverse transfer capacitance  
Switching characteristics (note 2)  
Total gate charge  
Q

g  

Q

gs  

Q

gd  

13  
3
V

DS

=15V, V

GS

=10V,  
I

D

=9A  
nC  
ns  
Gate-source charge  
Gate-drain charge  
4.5  
Turn-on delay time  
t
d  
10  
8
(on)  
Turn-on rise time  
t
r  
t
d(off)  
t
f  
V

DS

=15V,V
GS
=10V,  
R
L
=1.8Ω,R
GEN
=3Ω  
Turn-off delay time  
30  
5
Turn-off fall time  
Drain-Source Diode Characteristics  
Drain-source diode forward voltage(note1)  
V

SD  

I

S  

V
GS
=0V, I

S

=10A  
1.2  
20  
V
A
A
Continuous drain-source diode forward  
current  
Pulsed drain-source diode forward current  
Reverse Recovery Time  
I

SM  

100  
t

rr  

T
J
= 25°C, I
F
= 10A  
22  
12  
35  
20  
n
s
 
Reverse Recovery Charge  
di/dt = 100A/μs(Note
1
)  
Q
rr  
nC  
Notes:  
1. Pulse
 
T
est : Pulse Width≤300µs, duty cycle ≤2%.  
2. Guaranteed
 
by design, not subject to production.  
2
Rev
.
– 1.0  

Typical Characteristics  
Transfer Characteristics  
Output Characteristics  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
V

DS

=5V  
Pulsed  
Pulsed  
10V  
V

GS

= 5V  
V

GS

= 4V  
V

GS

=3V  
T

a

=25
℃
 
V

GS

=2.5V  
0
0
0
1
2
3
4
5
0
1
2
3
4
DRAIN TO SOURCE VOLTAGE
 
V

DS

(V)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
R

DS(ON)

——
V

GS  

R

DS(ON)  

I

D  

——  
10  
9
8
7
6
5
4
3
2
1
0
20  
18  
16  
14  
12  
10  
8
T

a

=25
℃  
Pulsed  
I

D

=10A  
Pulsed  
V

GS

=10V  
T

a

=100
℃  
T

a

=25
℃  
6
4
2
0
5
10  
15  
20  
25  
3
4
5
6
7
8
9
10  
3
DRAIN CURRENT
 
I

D

(A)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
Threshold Voltage  
I

S

——  
V

SD  

25  
10  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Pulsed  
1
I

D

=250uA  
T

a

=25
℃  
T

a

=100
℃  
0.1  
0.01  
1E-3  
0
200  
400  
600  
800  
1000  
1200  
25  
50  
75  
100  
125  
SOURCE TO DRAIN VOLTAGE
 
V

SD

(mV)  
JUNCTION TEMPERATURE
 
T

J

(
℃
)  
Rev
.
– 1.0  
3

P
DFNWB3
.3
×
3
.3
-8 L  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
Max.  
Min.  
Max.  
A
A1  
A2  
D
D1  
E
E1  
E2  
b
e
L
L1  
L2  
L3  
H
0.650  
0.850  
0.026  
0.033  
0.152 REF.  
0~0.05  
0.006 REF.  
0~0.002  
2.900  
2.300  
2.900  
3.150  
1.535  
0.200  
0.550  
0.300  
0.180  
3.100  
2.600  
3.100  
3.450  
1.935  
0.400  
0.750  
0.500  
0.480  
0.114  
0.091  
0.114  
0.124  
0.060  
0.008  
0.022  
0.012  
0.007  
0.122  
0.102  
0.122  
0.136  
0.076  
0.016  
0.030  
0.020  
0.019  
0~0.100  
0~0.100  
0~0.004  
0~0.004  
0.315  
9°  
0.515  
13°  
0.012  
9°  
0.020  
13°  
θ
P
DFNWB3
.3
×
3
.3
-8 L  
NOTICE  
JSCJ reserve
s
the right to make modifications,enhancements,improvements,corrections or other  
changes without
f
urther notice to any product herein. JSCJ does not assume any liability arising  
out of the application or use of any product described herein.  
Rev
.
– 1.0  
4

P
DFNWB3
.3
×
3
.3
-8 L  
P
DFNWB3
.3
×
3
.3
-8 L  
P
DFNWB3
.3
×
3
.3
-8 L  
P
D
F
N
W
B
3
.
3
×
3
.
3
–
8
L  
P
DFNWB3
.3
×
3
.3
-8 L  
P
DFNWB3
.3
×
3
.3
-8 L  
Rev
.
– 1.0  
5