Jiangsu-Changjing-Electronics-Technology-Co—Ltd–CJAB25P03

Part #Jiangsu-Changjing-Electronics-Technology-Co—Ltd–CJAB25P03
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Jiangsu-Changjing-Electronics-Technology-Co—Ltd–CJAB25P03
NGSU CHANGJING ELECTRONICS TECHNOLOGY CO., LTD  
N
WB
3.3×3.3-8L Plastic-Encapsulate MOSFETS  
CJA
B
2
5
P03
P-Channel Power MOSFET  
I

D  

PDFN
WB
3.3×3.3-8L  
V

(BR)DSS  

R

DS(on)

MAX  
–
2
5
A
 
-30
V  
20
mΩ
@  
-10V  
DESCRIPTION  
The CJAB25P03 uses advanced trench technology and design  
to provide excellent R

DS(ON)

with low gate charge. It can be used in a  
wide variety of applications  
FEATURES  
High density cell design for ultra low R

DS(ON)  

Fully characterized avalanche voltage and  
current  
Excellent package for good heat dissipation  
Special process technology for high ESD  
capabilit
y  
Good stability and uniformity with high E

AS  

APPLICATIONS  
Battery and loading switching  
MARKING  
EQUIVALENT CIRCUIT  
D
D
D
D
8
7
6
5
CJAB25P03 = Part No.  
Solid dot=Pin1 indicator  
XX=Date Code  
CJAB  
2
5P03  
XX  
1
2
3
4
S
S
S
G
MAXIMUM RATINGS ( T

a

=25
℃
unless otherwise noted )  
Parameter  
Drain-Source Voltage  
Symbol  
V

DS  

Limit  
-30  
Unit  
V
Gate-Source Voltage  
V

GS  

±20  
-25  
V
(1)  
Continuous Drain Current  
Pulsed Drain Current  
I

D  

A
I

DM  

-100  
150  
A
(1)  
Single Pulsed Avalanche Energy  
Power Dissipation  
mJ  
W
E

AS  

P

D  

3
(2)  
Thermal Resistance from Junction to Ambient  
Junction Temperature  
℃
/W  
℃
R

θJA  

41.67  
150  
T

J  

T

stg  

T

L  

Storage Temperature Range  
-55 ~+150  
260  
℃
℃
Lead Temperature for Soldering Purposes(1/8’’ from case for 10s)  
(1).E  
condition: V
 
=15V,L=0.1mH, R
 
=25Ω, Starting T
 
= 25°C  
DD  
AS  
G
J
(2).Mounted on a glass epoxy board of 25.4 mm x 25.4 mm x 0.8 mmt  
Rev
.
– 1.0  
1

MOSFET ELECTRICAL
 
CHARACTERISTICS  
T =25  
a
unless otherwise specified  
℃
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Off characteristics  
Drain-source breakdown voltage  
Zero gate voltage drain current  
Gate-body leakage current  
On characteristics (note1)  
Gate-threshold voltage  
V
(BR) DSS  
I

DSS  

V
GS
= 0V, I
D
=-250µA  
V
DS
=-24V, V
GS
=0V  
V
DS
=0V, V
GS
=±20V  
-30  
V
-1  
µA  
nA  
±100  
I

GSS  

V
GS(th)  
R
DS(on)  
g

FS  

V
DS
=V

GS

, I
D
=-250µA  
V
GS
=-10V, I
D
=-10A  
V
GS
=-4.5V, I
D
=-10A  
V
DS
=-10V, I
D
=-10A  
-1.0  
-1.6  
14  
-3  
V
20  
34  
mΩ  
mΩ  
S
Static drain-source on-sate resistance  
21  
Forward transconductance  
Dynamic characteristics (note 2)  
Input capacitance  
22  
C

iss  

C

oss  

C

rss  

1700  
296  
V
DS
=-15V,V
GS
=0V,  
f =1MHz  
pF  
Output capacitance  
Reverse transfer capacitance  
Switching characteristics (note 2)  
Total gate charge  
205  
Q

g  

Q

gs  

Q

gd  

30  
6
V
DS
=-15V,I
D
=-10A,  
V
GS
=-10V  
nC  
ns  
Gate-source charge  
Gate-drain charge  
9
Turn-on delay time  
t
d  
10  
26  
35  
8
(on)  
Turn-on rise time  
t
r  
t
d(off)  
t
f  
V
DD
=-15V,I
D
=-1A,R
L
=15Ω  
V
GS
=-10V,R
G
=2.5Ω  
Turn-off delay time  
Turn-off fall time  
Drain-Source Diode Characteristics  
Drain-source diode forward voltage
(note1)  
V

SD  

I

S  

V
GS
=0V, I

S

=-10A  
-0.8  
-1.2  
-25  
V
A
A
Continuous drain-source diode forward  
current
(note3)  
Pulsed drain-source diode forward current  
Notes:  
I

SM  

-100  
1. Pulse
 
T
est : Pulse Width≤300µs, duty cycle ≤2%.  
2. Guaranteed
 
by design, not subject to production.  
3. Surface
 
Mounted on FR4 Board, t
 
≤
10 sec.  
Rev
.
– 1.0  
2

Typical Characteristics  
Transfer Characteristics  
Output Characteristics  
–
40  
–
32  
–
24  
–
16  
–
8  
-5  
-4  
-3  
-2  
-1  
-0  
V

DS

=-10V  
Pulsed  
Pulsed  
V

GS

=-10V,-6V  
V

GS

=-5.0V  
T

J

=125
℃
 
T

J

=25
℃  
V

GS

=-4.0V  
V

GS

=-3.5V  
-2.0  
-0  
-0.0  
-0.5  
-1.0  
-1.5  
-2.5  
-0.0  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-3.0  
-3.5  
-4.0  
-4.5  
-5.0  
DRAIN TO SOURCE VOLTAGE
 
V

DS

(V)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
R

DS(ON)

——
V

GS  

R

DS(ON)  

I

D  

——  
40  
36  
32  
28  
24  
20  
16  
12  
8
48  
44  
40  
36  
32  
28  
24  
2
0  
16  
12  
8
T

a

=25
℃  
Pulsed  
I

D

=-1
0
A  
Pulsed  
V

GS

=-
4.5
V  
T

a

=100
℃  
T

a

=25
℃  
V

GS

=-10V  
4
4
0
-0.5  
0
-4.0  
-10  
-20  
-30  
-40  
-50  
-4.5  
-5.0  
-5.5 -6.0  
-6.5  
-7.0  
-7.5  
-8.0  
-8.5 -9.0  
-9.5 -10.0  
DRAIN CURRENT
 
I

D

(A)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
Threshold Voltage  
I

S

——  
V

SD  

-100  
-10  
-3.0  
-2.5  
-2.0  
-1.5  
-1.0  
-0.5  
-0.0  
Pulsed  
T

a

=100
℃  
T

a

=25
℃  
-1  
I

D

=-250uA  
-0.1  
-0.01  
-1E-3  
-0  
-200  
-400  
-600  
-800  
-1000  
-1200  
25  
50  
75  
100  
125  
SOURCE TO DRAIN VOLTAGE
 
V

SD

(mV)  
JUNCTION TEMPERATURE
 
T

J

(
℃
)  
Rev
.
– 1.0  
3

Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
Max.  
Min.  
Max.  
A
A1  
A2  
D
D1  
E
E1  
E2  
b
e
L
L1  
L2  
L3  
H
0.650  
0.850  
0.026  
0.033  
0.152 REF.  
0~0.05  
0.006 REF.  
0~0.002  
2.900  
2.300  
2.900  
3.150  
1.535  
0.200  
0.550  
0.300  
0.180  
3.100  
2.600  
3.100  
3.450  
1.935  
0.400  
0.750  
0.500  
0.480  
0.114  
0.091  
0.114  
0.124  
0.060  
0.008  
0.022  
0.012  
0.007  
0.122  
0.102  
0.122  
0.136  
0.076  
0.016  
0.030  
0.020  
0.019  
0~0.100  
0~0.100  
0~0.004  
0~0.004  
0.315  
9°  
0.515  
13°  
0.012  
9°  
0.020  
13°  
θ
NOTICE  
JSCJ reserve
s
the right to make modifications,enhancements,improvements,corrections or other  
changes without
f
urther notice to any product herein. JSCJ does not assume any liability arising  
out of the application or use of any product described herein.  
Rev
.
– 1.0  
4