KEC-Semicon-KF10N60F-U-PS

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KEC-Semicon-KF10N60F-U-PS
KF10N60P/F  
SEMICONDUCTOR  
N CHANNEL MOS FIELD  
EFFECT TRANSISTOR  
TECHNICAL DATA  
General Description  
KF10N60P  
A
This planar stripe MOSFET has better characteristics, such as fast  
switching time, low on resistance, low gate charge and excellent  
avalanche characteristics. It is mainly suitable for active power factor  
correction and switching mode power supplies.  
O
C
F
E
I
DIM MILLIMETERS  
G
_
A
B
C
D
E
F
9.9 + 0.2  
B
15.95 MAX  
Q
1.3+0.1/-0.05  
_
FEATURES  
0.8 + 0.1  
_
3.6 0.2  
+
·
V

DSS

=600V, I

D

=10A  
·
Drain-Source ON Resistance :  
R

DS(ON)

(Max)=0.73
Ω
@V

GS

=10V  
·
Qg(typ.)= 29.5nC  
K
_
P
2.8 + 0.1  
3.7  
0.5+0.1/-0.05  
1.5  
G
H
I
M
N
L
J
D
_
J
13.08 + 0.3  
1.46  
H
K
L
M
N
O
P
N
_
1.4 0.1  
+
MAXIMUM RATING
 
(Tc=25
℃
)  
_
1.27 0.1  
+
_
2.54 0.2  
+
RATING  
_
4.5 0.2  
+
CHARACTERISTIC  
SYMBOL  
UNIT  
_
2.4 0.2  
+
1
2
3
1. GATE  
2. DRAIN  
KF10N60P  
KF10N60F  
_
Q
9.2
+
0
.2  
3. SOURCE  
V

DSS  

V

GSS  

Drain-Source Voltage  
Gate-Source Voltage  
@T

C

=25
℃  
600  
V
V
±
30  
TO-220AB  
10  
6
10*  
6*  
I

D  

Drain Current  
@T

C

=100
℃  
A
KF10N60F  
I

DP  

Pulsed (Note1)  
25  
25*  
C
A
Single Pulsed Avalanche Energy  
(Note 2)  
E

AS  

360  
16.5  
4.5  
mJ  
mJ  
Repetitive Avalanche Energy  
(Note 1)  
E

AR  

DIM
MILLIMETERS  
E
_
10.16 0.2  
+
A
B
C
D
E
Peak Diode Recovery dv/dt  
(Note 3)  
_
15.87 0.2  
dv/dt  
V/ns  
+
_
2.54 0.2  
+
_
0.8 0.1  
+
178  
46  
W
W/
℃  
℃
Tc=25
℃  
Drain Power  
Dissipation  
_
+
P

D  

3.18  
0.1  
_
3.3 0.1  
+
1.43  
0.37  
F
Derate above 25
℃  
_
12.57 0.2  
+
G
H
J
L
M
N
T

j  

Maximum Junction Temperature  
Storage Temperature Range  
150  
_
0.5 0.1  
+
R
_
13.0 0.5  
+
T

stg  

-55
∼
150  
℃
_
K
L
3.23 0.1  
+
D
1.47 MAX  
Thermal Characteristics  
1.47 MAX  
M
N
O
Q
R
N
H
_
2.54 0.2  
+
R

thJC  

R

thJA  

Thermal Resistance, Junction-to-Case  
0.7  
2.7  
℃
/W  
℃
/W  
_
6.68 0.2  
+
_
Thermal Resistance,  
Junction-to-Ambient  
4.7  
+
_
0.2  
1. GATE  
2. DRAIN  
3. SOURCE  
62.5  
62.5  
2.76 0.2  
+
1
2
3
* : Drain current limited by maximum junction temperature.  
*Single Gauge Lead Frame  
PIN CONNECTION  
TO-220IS (1)  
(KF10N60P, KF10N60F)  
D
G
S
2013. 5. 03  
Revision No : 1  
1/7  

KF10N60P/F  
ELECTRICAL CHARACTERISTICS
 
(Tc=25
℃
)  
CHARACTERISTIC  
SYMBOL  
TEST CONDITION  
MIN. TYP.
 
MAX. UNIT  
Static  
BV

DSS  

Breakdown Voltage Temperature Coefficient
 
Δ
BV

DSS

/
Δ
T

j

I

D

=250
μ
A, Referenced
 
to 25
℃  
Drain-Source Breakdown Voltage  
I

D

=250
μ
A, V

GS

=0V  
600  
–
–
–
V
V/
℃  
μ
A  
V
–
–
0.6  
I

DSS  

V

th  

V

DS

=600V, V

GS

=0V  
V

DS

=V

GS

, I

D

=250
μ
A  
V

GS

=
±
30V, V

DS

=0V  
V

GS

=10V, I

D

=5A  
Drain Cut-off Current  
Gate Threshold Voltage  
Gate Leakage Current  
Drain-Source ON Resistance  
Dynamic  
–
10  
2.5  
–
–
–
4.5  
±
100  
0.73  
I

GSS  

nA  
Ω
R

DS(ON)  

–
0.59  
Q

g  

Q

gs  

Q

gd  

t

d(on)  

t

r  

Total Gate Charge  
–
–
–
–
–
–
–
–
–
–
26  
6
–
–
–
–
–
–
–
–
–
–
V

DS

=480V, I

D

=10A  
V

GS

=10V  
Gate-Source Charge  
Gate-Drain Charge  
nC  
ns  
pF  
A
(Note4,5)  
(Note4,5)  
10  
Turn-on Delay time  
32  
V

DD

=300V  
I

D

=10A  
Turn-on Rise time  
35  
t

d(off)  

t

f  

Turn-off Delay time  
Turn-off Fall time  
88  
R

G

=25
Ω  
30  
C

iss  

C

oss  

C

rss  

Input Capacitance  
1350  
140  
13  
V

DS

=25V, V

GS

=0V, f=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Source-Drain Diode Ratings  
Continuous Source Current  
Pulsed Source Current  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
I

S  

I

SP  

V

SD  

t

rr  

–
–
–
–
–
–
–
10  
40  
1.4  
–
V

GS

<V

th  

I

S

=10A, V

GS

=0V  
–
V
ns  
350  
4.2  
I

S

=10A, V

GS

=0V,  
dIs/dt=100A/
μ
s  
Q

rr  

–
μ
C  
Note 1) Repetivity rating : Pulse width limited by junction temperature.  
Note 2) L =6.8mH,
 
I

S

=10A, V

DD

=50V, R

G

=25
Ω
, Starting
 
T

j

=25
℃
.  
Note 3) I

S

≤
10A, dI/dt
≤
200A/
㎲
, V

DD

≤
BV

DSS

, Starting T

j

=25
℃
.  
Note 4) Pulse Test : Pulse width
≤
300
㎲
, Duty
 
Cycle
≤
2%.  
Note 5) Essentially independent of operating temperature.  
Marking  
1
1
KF10N60  
KF10N60  
2
813  
F
2
801  
P
1
2
PRODUCT NAME  
LOT NO  
2013. 5. 03  
Revision No : 1  
2/7  

KF10N60P/F  
Fig1. I
 
– V  
Fig2. I
 
– V  
D
D
GS  
DS  
100  
10  
V
=30V  
DS  
10

1  

V
V
=10V  
GS  
=7V  
GS  
V
=5V  
GS  
100
C  
25
C  
10

0  

1
10

-1  

0.1  
0.1  
10  
Drain – Source Voltage
 
V

DS

(V)  
2
4
6
8
10  
1
100  
Gate – Source Voltage
 
V

GS

(V)  
Fig3. BV  
– T  
Fig4. R  
– I  
DSS  
j
DS(ON) D  
1.2  
1.1  
1.0  
0.9  
0.8  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0
V

GS

= 0V  
I

DS

= 250  
V
=6V  
GS  
V
=10V  
GS  
100  
-100  
-50  
0
50  
150  
0
5
10  
Drain Current
 
I

D

(A)  
15  
20  
Junction Temperature
 
Tj (  
)
C
Fig6. R  
– T  
j
DS(ON)  
Fig5. I
 
– V  
S
SD  
10

2  

10

1  

10

0  

10

-1  

3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
I
=10V  
GS  
= 5A  
DS  
100
C  
25
C  
-100  
-50  
0
50  
100  
150  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.8  
(V)  
Junction Temperature T
 
(  
)
C
Source – Drain Voltage V

SD  

j
2013. 5. 03  
Revision No : 1  
3/7  

KF10N60P/F  
Fig 7. C
 
– V  
DS  
Fig8. Q
 
– V  
g
GS  
10

4  

10

3  

10

2  

10

1  

12  
10  
8
I

D

=10A  
V
= 480V  
DS  
V
= 300V  
DS  
C
iss  
V
= 120V  
DS  
6
C
oss  
4
2
C
rss  
40  
0
5
15  
20  
35  
40  
0
10  
25  
30  
(nC)  
0
10  
20  
30  
Gate – Charge  
Q
g
Drain – Source Voltage
 
V

DS

(V)  
Fig9. Safe Operation Area  
Fig10. Safe Operation Area  
(KF10N60F)  
(KF10N60P)  
10

2  

10

1  

10

2  

10

1  

10
µ
s  
100
µ
s  
10
µ
s  
100
µ
s  
1ms  
10ms  
1ms  
10

0  

10

-1  

10

-2  

10

0  

10

-1  

10

-2  

Operation in this  
area is limited by R

DS(ON)  

Operation in this  
10ms  
area is limited by R

DS(ON)  

DC  
DC  
T =
 
25  
c
T =
 
25  
C
C
c
j
C
T =
 
150  
j
C
T =
 
150  
Single pulse  
Single pulse  
10

2  

10

3  

10

2  

10

3  

10

0  

10

1  

10

0  

10

1  

Drain – Source Voltage V  
(V)  
Drain – Source Voltage V  
(V)  
DS  
DS  
Fig11. I
 
– T  
D
j
14  
12  
10  
8
6
4
2
0
25  
50  
75  
125  
)
150  
100  
Junction Temperature T  
(
C
j
2013. 5. 03  
Revision No : 1  
4/7  

KF10N60P/F  
Fig12. Transient Thermal Response Curve  
(KF10N60P)  
10

0  

10

-1  

10

-2  

Duty=0.5  
0.2  
0.1  
P
DM  
0.05  
t
1
0.02  
t
2
– Duty Factor, D= t

1

/t

2  

10

0  

Single Pulse  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

1  

TIME (sec)  
Fig13. Transient Thermal Response Curve  
(KF10N60F)  
10

1  

10

0  

Duty=0.5  
0.2  
P
0.1  
DM  
t
0.05  
1
10

-1  

10

-2  

t
0.02  
2
– R

th(j-c)

= 2.7 C/W Max.  
– Duty Factor, D= t

1

/t

2  

Single Pulse  
10

-5  

10

-4  

10

-3  

10

-2  

10

-1  

10

0  

10

1  

TIME (sec)  
2013. 5. 03  
Revision No : 1  
5/7  

KF10N60P/F  
Fig14. Gate Charge  
V
GS  
10 V  
Fast  
Recovery  
Diode  
I
D
0.8 V  
DSS  
I
D
1.0 mA  
Q
V
Q
Q
DS  
gd  
gs  
Q
g
V
GS  
Fig15. Single Pulsed Avalanche Energy  
BV  
1
2
DSS  
2
E
AS  
=
LI

AS  

BV  
– V  
DD  
DSS  
BV

DSS  

L
I
AS  
50V  
25
Ω
 
I

D

(t)  
V

DS  

V
GS  
V

DD  

V

DS

(t)  
10 V  
Time  
t
p
Fig16. Resistive Load Switching  
V

DS  

90%  
R
L
0.5 V  
DSS  
10%  
V

GS  

t

d(off)  

25
Ω  
t
t

d(on)  

t

on  

r
t
f
V
DS  
t

off  

V
GS  
10V  
2013. 5. 03  
Revision No : 1  
6/7  

KF10N60P/F  
Fig17. Source – Drain Diode Reverse Recovery and dv /dt  
Body Diode Forword Current  
DUT  
V
DS  
I
SD  
(DUT)  
di/dt  
I
F
I
RM  
I
S
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
0.5  
V
DSS  
V
DS  
(DUT)  
driver  
V

SD  

V
DD  
V
GS  
10V  
Body Diode Forword Voltage drop  
2013. 5. 03  
Revision No : 1  
7/7