KIA-Semicon-Tech-KIA3510AB

Part #KIA-Semicon-Tech-KIA3510AB
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KIA-Semicon-Tech-KIA3510AB
75A
,
100V  
3510A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
1
.
Features  
n
R

DS(on)

=9m
Ω
(
typ.
)
@ V

GS

=10V  
100% avalanche tested  
n
n
n
Reliable and rugged  
Lead free and green device available
(
RoHS Compliant
)  
2
.
Applications  
n
n
Switching application  
Power management for inverter systems  
3.Symbol  
Pin  
1
Function  
Gate  
2
Drain  
3
Source  
Drain  
4
1 of 6  
Rev 1.2 Apr 2015  

75A
,
100V  
3510A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
4.
Absolute maximum ratings  
(T

A

=25
°
C,unless otherwise noted)  
Rating  
Units  
Parameter  
Symbol  
To-220/263  
To-252  
Drain-source voltage  
V

DSS  

V

GSS  

T

J  

100  
±
25  
175  
V
V
Gate-source voltage  
Maximum junction temperature  
Storage temperature range  
º
C  
º
C  
A
T

STG  

-55 to175  
T

C

=25
º
C  
T

C

=100
º
C  
T

C

=25
º
C  
75  
51  
65  
44  
3
Continuous drain current  
I

D  

A
4
Pulsed drain current  
Avalanche current  
Avalanche energy  
I

DP  

219  
30  
A
5
I

AS  

A
5
E

AS  

225  
166  
83  
mJ  
W
W
T

C

=25
º
C  
T

C

=100
º
C  
Maximum power dissipation  
P

D  

5.
Thermal characteristics  
Parameter  
Symbol  
R

θ
JA  

Rating  
62.5  
0.9  
Unit  
º
C/W  
º
C/W  
Thermal resistance,Junction-ambient  
Thermal resistance,Junction-case  
R

θ
JC  

2 of 6  
Rev 1.2 Apr 2015  

75A
,
100V  
3510A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
6
.
Electrical characteristics  
(T

A

=25
°
C,unless otherwise noted)  
Parameter  
Symbol  
BV

DSS  

Test Conditions  
V

GS

=0V,I

DS

=250
Μ
a  
V

DS

=80V, V

GS

=0V  
T

J

=125
°
C  
Min  
Typ  
Max  
Units  
Drain-source breakdown voltage  
100  
–
–
–
V
–
–
1
Zero gate voltage drain current  
I

DSS  

μ
A  
–
20  
Gate threshold voltage  
Gate leakage current  
V

GS(th)  

I

GSS  

V

DS

=V

GS

, I

D

=250
μ
A  
V

GS

=+25V, V

DS

=0V  
V

GS

=10V,I

DS

=50A  
(TO-220TO-263)  
V

GS

=10V,I

DS

=50A  
(TO-252)  
2.0  
–
3.0  
–
4.0  
+100  
V
nA  
–
9
9
11  
14  
1
Drain-source on-state resistance  
R

DS(on)  

m
Ω  
Gate resistance  
R

g  

V

DS

=0V, V

GS

=0V,f=1MHz  
–
–
1.2  
–
–
Ω
1
Diode forward voltage  
V

SD  

I

SD

=50A, V

GS

=0V  
1.3  
V
Reverse recovery time  
Reverse recovery charge  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
t

rr  

Q

rr  

C

iss  

C

oss  

C

rss  

t

d(on)  

t

r  

–
–
–
–
–
–
–
–
–
–
–
–
46  
86  
–
–
nS  
nC  
I

SD

=50A ,  
dl

SD

/dt=100A/
μ
s  
2946  
339  
179  
15  
–
V

DS

=25V,V

GS

=0V,  
f=1MHz  
–
pF  
–
–
108  
51  
–
V

DD

=50V,I

DS

=30A,  
ns  
Turn-off delay time  
Fall time  
t

d(off)  

t

f  

–
R

G

=6.8
Ω
,V

GS

=10V  
59  
–
Total gate charge  
Gate-source charge  
Gate-drain charge  
Q

g  

60  
–
V

DS

=50V,V

GS

=10V  
I

DS

=30A  
Q

gs  

Q

gd  

13.7  
22.8  
—  
—  
nC  
Note : 1. Pulse test; pulse width<300us duty cycle<2%.  
2. Guaranteed by design, not subject to production testing.  
3. Package limitation current is 55A.  
4. Repetitive rating, pulse width limited by max junction temperature.  
5. Starting T

J

=25
º
C, L=0.5mH, I

AS

=30A.  
3 of 6  
Rev 1.2 Apr 2015  

75A
,
100V  
3510A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
7
.
T
est circuits and waveforms  
4 of 6  
Rev 1.2 Apr 2015  

75A
,
100V  
3510A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
5 of 6  
Rev 1.2 Apr 2015  

75A
,
100V  
3510A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
6 of 6  
Rev 1.2 Apr 2015