KIA-Semicon-Tech-KNB2908B

Part #KIA-Semicon-Tech-KNB2908B
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KIA-Semicon-Tech-KNB2908B
130A
,
80V  
2908B  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
1
.
Description  
KNX2908B, uses advanced trench technology to provide excellent R

DS(ON)

, Low gate charge,It can  
be used in a wide variety of applications.  
2
.
Features  
V

DS

=80V,I

D

=130A R

DS(ON) typ.)

=5.0mΩ @ V

GS

=10V  
(
High density cell design for lower Rdson  
Fully characterized avalanche voltage and current  
Good stability and uniformity with high EAS  
Excellent package for good heat dissipation  
3
.
Applications  
Power switching application  
Hard switched and High frequency circuits  
Uninterruptible power supply  
4.Symbol  
Pin  
1
Function  
Gate  
2
Drain  
3
Source  
Drain  
4
Rev 1.0.Apr. 2021  
1 of 5  

130A
,
80V  
2908B  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
5.
Ordering Information  
Part Number  
Package  
TO-263  
Brand  
KIA  
KNB2908B  
KNP2908B  
TO-220  
KIA  
6.
Absolute maximum ratings  
Symbo  
Parameter  
Rating  
Units  
l
V
V
Drain-source voltage  
V

DS  

80  
Gate-source voltage  
V

GS  

I

D  

I

DM  

E

AS  

P

D  

+20  
130  
520  
900  
245  
Continuous drain curren  
Pulsed drain current

(Note1)  

Single pulse avalanche energy

(Note2)  

Derating Factor above 25ºC  
A
A
mJ  
W/ºC  
T

J,  

T

STG  

Operation junction and temperature range  
-55 to175  
ºC  
7.
Thermal characteristics  
Symbol  
R

θJC  

Parameter  
Unit  
ºC /W  
Max  
0.61  
Thermal Resistance, Junction-to-Case  
Rev 1.0.Apr. 2021  
2 of 5  

130A
,
80V  
2908B  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
8
.
Electrical characteristics  
(T

A

=25
°
C,unless otherwise noted)  
Parameter  
Symbol  
Test Conditions  
Min Typ Max Units  
Off Characteristics  
Drain-source breakdown voltage  
Drain-Source Leakage Current  
Gate-Soure Forward Leakage  
BV

DSS  

I

DSS  

V

GS

=0V,I

D

=250μA  
V

DS

=80V, V

GS

=0V  
V

GS

=+20V  
80  
–
–
–
–
–
–
V
1
μA  
nA  
nA  
I

GSS(F)  

I

GSS(R)  

–
100  
-100  
Gate-Soure Reverse Leakage  
On Characteristics  
V

GS

=-20V  
–
Drain-source on-Resistance

(Note3)  

R

DS(on)  

V

GS(th)  

gfs  
V

GS

=10V,I

D

=35A  
V

DS

=V

GS

, I

D

=250μA  
V

DS

=5V,I

D

=20A  
–
2.0  
–
5.0  
2.9  
42  
6.0  
4.0  
–
mΩ  
V
Gate threshold voltage  
Forward Transconductance  
Dynamic Characteristics  
Total gate charge  
S
Q

g  

Q

gs  

Q

gd  

t

d(on)  

t

r  

–
–
–
–
–
–
–
160  
31  
50  
24  
41  
75  
25  
–
–
–
–
–
–
–
V

DD

=40V, V

GS

=10V  
I

D

=20A  
Gate-source charge  
Gate-drain charge  
nC  
ns  
Turn-on delay time  
Rise time  
V

DD

=30V,  
I

D

=40A,  
R

GEN

=3Ω,  
V

GS

=10V,  
Turn-off delay time  
Fall time  
t

d(off)  

t

f  

Switching Characteristics

(Note 4)  

Input capacitance  
C

iss  

C

oss  

C

rss  

–
–
–
7950  
460  
–
–
–
V

DS

=25V,V

GS

=0V,  
f=1MHz  
Output capacitance  
Reverse transfer capacitance  
pF  
V
380  
Drain-Source Diode Characteristics  
Diode Forward voltage  
V

SD  

V

GS

=0V,I

S

=20A  
–
–
1.3  
Note  
1. Repetitive Rating: Pulse width limited by maximum junction temperature.  
2. EAS condition :T j=25
℃
,VDD=50V,VG=10V,L=0.5mH,Rg=1
Ω
 
3. Pulse
T
e
st: Pulse Width
 
≤
300
μ
s, Duty Cycle
 
≤
2%.  
4. Guaranteed by design, not subject to production.  
Rev 1.0.Apr. 2021  
3 of 5  

130A
,
80V  
2908B  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
9
.
T
est circuits  
Rev 1.0.Apr. 2021  
4 of 5  

130A
,
80V  
2908B  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
Rev 1.0.Apr. 2021  
5 of 5