KIA-Semicon-Tech-KNP2708A

Part #KIA-Semicon-Tech-KNP2708A
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KIA-Semicon-Tech-KNP2708A
160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
1
.
General Features  
n
n
n
n
Proprietary New Trench
T
echnology  
R

DS(ON),typ.

=4.0m
Ω
@V

GS

=10V  
Low Gate Charge Minimize Switching Loss  
Fast Recovery Body Diode  
2
.
Applications  
n
n
n
High efficiency DC/DC converters  
Synchronous Rectification  
UPS Inverter  
3.
Pin configuration  
Pin  
1
Function  
Gate  
2
Drain  
3
Source  
Drain  
4
1 of 8  
Rev 1.0 Nov. 2018  

160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
4.
Ordering Information  
Part Number  
KNP2708A  
Package  
TO-220  
Brand  
KIA  
KNB2708A  
TO-263  
KIA  
5.
Absolute maximum ratings  
(T
C
= 25
º
C , unless otherwise specified)  
Symbol  
V

DSS  

Parameter  
Rating  
80  
Unit  
Drain-to-Source Voltage

[1]  

Gate-to-Source Voltage  
Continuous Drain Current

[2]  

Continuous Drain Current

[3]  

V
V

GSS  

±
20  
160  
80  
I

D  

A
I

D

@ T

C

=100
º
C Continuous
 
Drain Current@T

C

=100
º
C

[2]  

116  
640  
1100  
5.0  
I

DM  

Pulsed Drain Current at V

GS

=10V

[2,4]  

Single Pulse Avalanche Energy  
Peak Diode Recovery dv/dt

[3]  

Power Dissipation  
E

AS  

mJ  
V/ns  
W
dv /dt  
313  
2.08  
P

D  

Derating Factor above 25
º
C  
W/
º
C  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10  
seconds, Package Body for 10 seconds  
T

L  

T

PAK  

300  
260  
º
C  
T

J

&T

STG  

Operating and Storage Temperature Range  
-55 to 175  
Caution: Stresses greater than those listed in the
“
Absolute Maximum Ratings
”
may cause permanent  
damage to the device.  
6.
Thermal characteristics  
Symbol  
R

θ
JC  

Parameter  
Rating  
0.48  
62  
Unit  
º
C /W  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
R

θ
JA  

2 of 8  
Rev 1.0 Nov. 2018  

160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
7
.
Electrical characteristics  
OFF Characteristics  
(TJ=25
°
C,unless otherwise specified)  
Symbol  
BV

DSS  

Parameter  
Test Conditions  
Min.  
80  
—  
Typ.  
—  
Max. Unit  
Drain-to-Source Breakdown Voltage  
V

GS

=0V, I

D

=250uA  
—  
5
V
V

DS

=80V, V

GS

=0V  
V

DS

=64V,V

GS

=0V,  
T

J

=125
°
C  
—  
I

DSS  

Drain-to-Source Leakage Current  
uA  
—  
—  
100  
V

GS

=+20V,V

DS

=0V  
V

GS

=-20V, V

DS

=0V  
—  
—  
—  
—  
+100  
-100  
I

GSS  

Gate-to-Source Leakage Current  
nA  
ON Characteristics  
Symbol  
(TJ=25
°
C,unless otherwise specified)  
Parameter  
Test Conditions  
V

GS

=10V, I

D

=24A

[5]  

V

DS

=V

GS

,I

D

=250uA  
V

DS

=10V, I

D

=80A

[5]  

Min.  
—  
Typ.  
4.0  
—  
Max. Unit  
R

DS(ON)

Static Drain-to-Source On-Resistance  
V

GS(TH)

Gate Threshold Voltage  
4.8  
4.0  
–
m
Ω  
V
2.0  
–
gfs  
Forward Transconductance  
130  
S
Dynamic Characteristics  
Symbol  
Essentially independent of operating temperature  
Parameter  
Test Conditions  
Min.  
—  
Typ.  
9300  
650  
260  
2.7  
Max. Unit  
—  
C

iss  

C

oss  

C

rss  

R

g  

Input Capacitance  
V

GS

=0V,  
V

DS

=25V,  
f=1.0MHZ  
Output Capacitance  
—  
—  
—  
—  
—  
—  
—  
pF  
Reverse Transfer Capacitance  
Gate Series Resistance  
Total Gate Charge  
—  
f=1.0MHZ  
—  
Ω
Q

g  

—  
115  
40  
V

DD

=40V,  
I

D

=80A,  
nC  
Q

gs  

Q

gd  

Gate-to-Source Charge  
Gate-to-Drain (Miller) Charge  
—  
V

GS

=0 to 10V  
—  
30  
Resistive Switching Characteristics  
Symbol Parameter  
Essentially independent of operating temperature  
Test Conditions  
Min.  
—  
Typ.  
50  
Max. Unit  
—  
t

d(ON)  

t

rise  

t

d(OFF)  

t

fall  

Turn-on Delay Time  
Rise Time  
V

DD

=40V,  
I

D

=40A,  
—  
135  
112  
75  
—  
nS  
—  
V

GS

= 10V  
R

G

=10
Ω  
Turn-Off Delay Time  
Fall Time  
—  
—  
—  
Source-Drain Body Diode Characteristics  
(T

J

=25
°
C,unless otherwise specified)  
Symbol  
I

SD  

Parameter  
Continuous Source Current

[2]  

Pulsed Source Current

[2]  

Diode Forward Voltage  
Reverse recovery time  
Test Conditions  
Min  
—  
Typ.  
—  
Max. Unit  
160  
A
Integral PN-diode in  
MOSFET  
I

SM  

—  
—  
640  
V

SD  

t

rr  

I

S

=80A, V

GS

=0V  
—  
—  
1.2  
—  
V
—  
85  
205  
ns  
nC  
V

GS

=0V ,I

F

=80A,  
diF/dt=100A/
μ
s  
Q

rr  

Reverse recovery charge  
—  
—  
Note:[1] T

J

=+25
º
C to +175
º
C.  
[2] Silicon limited current only.  
[3] Package limited current .  
[4] Repetitive rating; pulse width limited by maximum junction temperature.  
[5] Pulse width
≤
380
µ
s; duty cycle
≤
2%.  
3 of 8  
Rev 1.0 Nov. 2018  

160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
8
.
T
e
st circuits and waveforms  
4 of 8  
Rev 1.0 Nov. 2018  

160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
5 of 8  
Rev 1.0 Nov. 2018  

160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
6 of 8  
Rev 1.0 Nov. 2018  

160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
7 of 8  
Rev 1.0 Nov. 2018  

160A
,
80V  
KNX2708A  
N-CHANNEL MOSFET  
KIA  
SEMICONDUCTORS  
8 of 8  
Rev 1.0 Nov. 2018